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公开(公告)号:US20090096041A1
公开(公告)日:2009-04-16
申请号:US12333092
申请日:2008-12-11
IPC分类号: H01L29/84
CPC分类号: B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81C1/0023 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/15153 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要翻译: 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上,该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里,基板被模制树脂密封,使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此,可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。
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公开(公告)号:US20070158826A1
公开(公告)日:2007-07-12
申请号:US11616125
申请日:2006-12-26
申请人: Shingo Sakakibara , Hiroshi Saitoh
发明人: Shingo Sakakibara , Hiroshi Saitoh
IPC分类号: H01L23/34
CPC分类号: B81B7/0064 , H01L2224/48091 , H01L2924/3025 , H04R1/04 , H04R2201/003 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device includes a substrate, a semiconductor chip having a diaphragm, which vibrates in response to sound pressure variations, and a circuit chip that is electrically connected to the semiconductor chip so as to control the semiconductor chip, wherein the semiconductor chip is fixed to the surface of the circuit chip whose backside is mounted on the surface of the substrate. Herein, a plurality of connection terminals formed on the backside of the semiconductor chip are electrically connected to a plurality of electrodes running through the circuit chip. A ring-shaped resin sheet is inserted between the semiconductor chip and the circuit chip. The semiconductor chip and the circuit chip vertically joined together are stored in a shield case having a mount member (e.g., a stage) and a cover member, wherein connection terminals of the circuit chip are exposed to the exterior via through holes of the stage.
摘要翻译: 半导体器件包括:衬底,具有响应于声压变化而振动的隔膜的半导体芯片;以及与半导体芯片电连接以控制半导体芯片的电路芯片,其中将半导体芯片固定到 其背面安装在基板的表面上的电路芯片的表面。 这里,形成在半导体芯片的背面上的多个连接端子电连接到贯穿电路芯片的多个电极。 在半导体芯片和电路芯片之间插入环状树脂片。 垂直接合在一起的半导体芯片和电路芯片存储在具有安装构件(例如,台架)和盖构件的屏蔽壳体中,其中电路芯片的连接端子通过平台的通孔暴露于外部。
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公开(公告)号:US07646092B2
公开(公告)日:2010-01-12
申请号:US11566879
申请日:2006-12-05
IPC分类号: H01L23/12
CPC分类号: B81B7/0061 , B81B2201/0257 , B81B2201/0264 , B81C3/005 , B81C2203/0109 , B81C2203/054 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
摘要翻译: 本发明的半导体器件包括:在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖,其具有与基板相对并覆盖中空部的基本上板状的顶板部,并且具有至少一对侧壁部,该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位。
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公开(公告)号:US20070210392A1
公开(公告)日:2007-09-13
申请号:US11634384
申请日:2006-12-06
IPC分类号: H01L29/82
CPC分类号: B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81C1/0023 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要翻译: 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上,该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里,基板被模制树脂密封,使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此,可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。
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公开(公告)号:US07560811B2
公开(公告)日:2009-07-14
申请号:US11634384
申请日:2006-12-06
IPC分类号: H01L29/82
CPC分类号: B81B7/007 , B81B2201/0257 , B81B2201/0264 , B81C1/0023 , H01L2224/45139 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/49171 , H01L2924/3011 , H01L2924/3025 , H01L2924/00014 , H01L2924/00 , H01L2924/00011
摘要: A semiconductor device is designed such that a semiconductor sensor chip having a diaphragm for detecting pressure variations based on the displacement thereof is fixed onto the upper surface of a substrate having a rectangular shape, which is covered with a cover member so as to form a hollow space embracing the semiconductor sensor chip between the substrate and the cover member. Herein, the substrate is sealed with a molded resin such that chip connection leads packaging leads are partially exposed externally of the molded resin; the chip connection leads are electrically connected to the semiconductor sensor chip and are disposed in line along one side of the semiconductor sensor chip; and the packaging leads are positioned opposite the chip connection leads by way of the semiconductor sensor chip. Thus, it is possible to downsize the semiconductor device without substantially changing the size of the semiconductor sensor chip.
摘要翻译: 半导体器件被设计成使得具有用于检测基于其位移的压力变化的隔膜的半导体传感器芯片被固定到矩形形状的基板的上表面上,该基板被覆盖件覆盖以形成中空 覆盖基板和盖构件之间的半导体传感器芯片的空间。 这里,基板被模制树脂密封,使得芯片连接将封装引线部分地暴露在模制树脂的外部; 芯片连接引线电连接到半导体传感器芯片并且沿着半导体传感器芯片的一侧设置成一行; 并且封装引线通过半导体传感器芯片与芯片连接引线相对定位。 因此,可以实质上改变半导体传感器芯片的尺寸来减小半导体器件的尺寸。
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公开(公告)号:US20080056524A1
公开(公告)日:2008-03-06
申请号:US11899321
申请日:2007-09-05
申请人: Shingo Sakakibara , Hiroshi Saitoh
发明人: Shingo Sakakibara , Hiroshi Saitoh
IPC分类号: H04R19/04
CPC分类号: H04R19/04
摘要: A microphone package includes a housing, which has a cavity and a sound hole for allowing the cavity to communicate with the exterior, and a microphone chip, which is mounted on the mounting surface so as to detect sound within the cavity. The sound hole is opened in connection with the mounting surface and is surrounded by a projection wall projecting upwardly from the mounting surface at a prescribed position in proximity to the microphone chip.
摘要翻译: 麦克风封装包括壳体,其具有用于允许空腔与外部连通的空腔和声孔,以及安装在安装表面上以便检测腔内的声音的麦克风芯片。 声孔与安装表面相连开,并且由靠近麦克风芯片的规定位置处从安装表面向上突出的突出壁包围着。
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公开(公告)号:US08344489B2
公开(公告)日:2013-01-01
申请号:US12628127
申请日:2009-11-30
IPC分类号: H01L23/02
CPC分类号: B81B7/0061 , B81B2201/0257 , B81B2201/0264 , B81C3/005 , B81C2203/0109 , B81C2203/054 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned.
摘要翻译: 本发明的半导体器件包括:在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖,其具有与基板相对并覆盖中空部的基本上板状的顶板部,并且具有至少一对侧壁部,该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位。
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公开(公告)号:US20070176272A1
公开(公告)日:2007-08-02
申请号:US11566879
申请日:2006-12-05
IPC分类号: H01L23/02
CPC分类号: B81B7/0061 , B81B2201/0257 , B81B2201/0264 , B81C3/005 , B81C2203/0109 , B81C2203/054 , H01L2224/48091 , H01L2224/48227 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要: A semiconductor device of the invention includes: a substrate having a hollowed hollow section on a top surface; a semiconductor chip mounted in the hollow section of the substrate; and a lid having a substantially plate-shaped top plate section that opposes the substrate and covers the hollow section, and having at least one pair of side wall sections that project from a circumference of the top plate section towards the substrate and that engage with a side surface of the substrate. The substrate and the lid can be accurately positioned
摘要翻译: 本发明的半导体器件包括:在顶表面上具有中空的中空部分的衬底; 安装在基板的中空部分中的半导体芯片; 以及盖,其具有与基板相对并覆盖中空部的基本上板状的顶板部,并且具有至少一对侧壁部,该侧壁部从顶板部的圆周朝向基板突出并且与一对 基板的侧表面。 基板和盖子可以精确定位
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公开(公告)号:US08530014B2
公开(公告)日:2013-09-10
申请号:US12412469
申请日:2009-03-27
申请人: Takeshi Shimono , Kenji Ichikawa , Takeshi Inaba , Yukinori Kamiya , Shingo Sakakibara , Shigehito Sagisaka , Takahiro Kitahara
发明人: Takeshi Shimono , Kenji Ichikawa , Takeshi Inaba , Yukinori Kamiya , Shingo Sakakibara , Shigehito Sagisaka , Takahiro Kitahara
CPC分类号: B32B27/08 , B32B1/02 , B32B1/08 , B32B3/28 , B32B7/12 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/285 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2250/24 , B32B2262/103 , B32B2262/106 , B32B2264/102 , B32B2264/105 , B32B2270/00 , B32B2307/202 , B32B2307/306 , B32B2307/308 , B32B2307/50 , B32B2307/704 , B32B2307/712 , B32B2307/714 , B32B2307/7242 , B32B2307/7265 , B32B2327/12 , B32B2439/00 , B32B2457/04 , B32B2535/00 , B32B2597/00 , B32B2605/00 , Y10T428/1352 , Y10T428/1379 , Y10T428/1393 , Y10T428/3154 , Y10T428/31544 , Y10T428/31725 , Y10T428/31739 , Y10T428/31743 , Y10T428/31746 , Y10T428/3175 , Y10T428/31757 , Y10T428/31855 , Y10T428/31931 , Y10T428/31938
摘要: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.
摘要翻译: 本发明提供一种对燃料具有耐环境开裂性和燃料不渗透性的层压体,另外生产率高。 本发明是一种含有三氟氯乙烯共聚物层(C)和无氟有机材料层(K)的层压体,其中氯三氟乙烯共聚物的熔体流动速率为15.0〜40.0(g / 10分钟),含有15.0〜25.0 氯三氟乙烯单元相对于所有单体单元的摩尔百分比。
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公开(公告)号:US20090246435A1
公开(公告)日:2009-10-01
申请号:US12412469
申请日:2009-03-27
申请人: Takeshi SHIMONO , Kenji Ichikawa , Takeshi Inaba , Yukinori Kamiya , Shingo Sakakibara , Shigehito Sagisaka , Takahiro Kitahara
发明人: Takeshi SHIMONO , Kenji Ichikawa , Takeshi Inaba , Yukinori Kamiya , Shingo Sakakibara , Shigehito Sagisaka , Takahiro Kitahara
CPC分类号: B32B27/08 , B32B1/02 , B32B1/08 , B32B3/28 , B32B7/12 , B32B27/16 , B32B27/18 , B32B27/20 , B32B27/285 , B32B27/304 , B32B27/308 , B32B27/32 , B32B27/322 , B32B27/34 , B32B27/36 , B32B27/365 , B32B2250/24 , B32B2262/103 , B32B2262/106 , B32B2264/102 , B32B2264/105 , B32B2270/00 , B32B2307/202 , B32B2307/306 , B32B2307/308 , B32B2307/50 , B32B2307/704 , B32B2307/712 , B32B2307/714 , B32B2307/7242 , B32B2307/7265 , B32B2327/12 , B32B2439/00 , B32B2457/04 , B32B2535/00 , B32B2597/00 , B32B2605/00 , Y10T428/1352 , Y10T428/1379 , Y10T428/1393 , Y10T428/3154 , Y10T428/31544 , Y10T428/31725 , Y10T428/31739 , Y10T428/31743 , Y10T428/31746 , Y10T428/3175 , Y10T428/31757 , Y10T428/31855 , Y10T428/31931 , Y10T428/31938
摘要: The present invention provides a laminate having an environmental cracking resistance for a fuel and a fuel impermeability and, in addition, higher in productivity. The present invention is a laminate including a chlorotrifluoroethylene copolymer layer (C) and a fluorine-free organic material layer (K), wherein the chlorotrifluoroethylene copolymer has a melt flow rate of 15.0 to 40.0 (g/10 minutes) and contains 15.0 to 25.0 mole percent of chlorotrifluoroethylene units relative to all monomer units.
摘要翻译: 本发明提供一种对燃料具有耐环境开裂性和燃料不渗透性的层压体,另外生产率高。 本发明是一种含有三氟氯乙烯共聚物层(C)和无氟有机材料层(K)的层压体,其中氯三氟乙烯共聚物的熔体流动速率为15.0〜40.0(g / 10分钟),含有15.0〜25.0 氯三氟乙烯单元相对于所有单体单元的摩尔百分比。
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