公开(公告)号：US07332373B2

公开(公告)日：2008-02-19

申请号：US10885785

申请日：2004-07-08

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L21/78

CPC分类号： H01L24/12 ,  H01L21/56 ,  H01L21/78 ,  H01L23/3114 ,  H01L24/11 ,  H01L24/94 ,  H01L2224/05001 ,  H01L2224/05008 ,  H01L2224/05023 ,  H01L2224/05024 ,  H01L2224/05569 ,  H01L2224/056 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/13099 ,  H01L2224/274 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2924/00014

摘要： The present invention provides a method of manufacturing semiconductor device. The method includes providing a semiconductor wafer having a main surface; defining a chip forming region which includes chip regions defined by scribe lines, and a peripheral region which surrounds the chip forming region, on the main surface; forming circuit elements and electrode pads connected to the circuit elements on the chip areas; forming an insulating film, which exposes respective portions of the electrode pads, on the main surface; forming protruded electrodes on the insulating film provided in the chip areas so that the protruded electrodes are arranged at predetermined intervals in the chip area; forming an encapsulating material, which exposes top faces of the protruded electrodes, on the insulating film; and cutting the semiconductor wafer along the scribe lines.

摘要翻译： 本发明提供半导体器件的制造方法。 该方法包括提供具有主表面的半导体晶片; 限定芯片形成区域，其包括由划线限定的芯片区域和在主表面上包围芯片形成区域的周边区域; 形成电路元件和连接到芯片区域上的电路元件的电极焊盘; 形成在主表面露出电极焊盘的各部分的绝缘膜; 在设置在芯片区域中的绝缘膜上形成突出电极，使得突出电极以预定的间隔布置在芯片区域中; 形成在所述绝缘膜上露出所述突出电极的顶面的封装材料; 并沿切割线切割半导体晶片。

公开(公告)号：US07254481B2

公开(公告)日：2007-08-07

申请号：US11076237

申请日：2005-03-10

申请人： Shigeru Yamada ,  Naoki Sashida ,  Akihiko Obata

发明人： Shigeru Yamada ,  Naoki Sashida ,  Akihiko Obata

IPC分类号： G01C21/30

CPC分类号： G01C21/3676 ,  G01C21/343 ,  G01C21/3605 ,  G01C21/3679 ,  G08G1/096811 ,  G08G1/096827 ,  G08G1/096838 ,  G08G1/096894 ,  G08G1/0969 ,  G09B29/007

摘要： An action support apparatus displays a destination specification screen for specifying a destination, and receives from the user a specification of a general destination. If a general destination is specified, then the apparatus determines a detailed destination, referencing a knowledge DB. If there is a plurality of detailed destinations with respect to the general destination, then any one of them is set to the user's destination. Next, the apparatus sets the current location as the starting point, and generates a planned route from the starting point to the destination based on a map DB and an internal clock. Furthermore, the apparatus reads a filtering rule from a filtering DB, and extracts as recommended information facility information of facilities suited to the user from a facility information DB. Depending on the filtering rule, it is also acceptable to use user information in a user DB in the extraction of the recommended information. Subsequently, the apparatus associates the extracted recommended information with the planned route, and outputs them.

摘要翻译： 动作辅助装置显示用于指定目的地的目的地规格画面，并从用户接收通用目的地的规格。 如果指定了通用目的地，则设备确定详细目的地，引用知识数据库。 如果相对于一般目的地存在多个详细的目的地，则将它们中的任何一个设置为用户的目的地。 接下来，设备将当前位置设置为起始点，并且基于地图DB和内部时钟生成从起始点到目的地的规划路线。 此外，设备从过滤DB读取过滤规则，并从设施信息DB提取适合于用户的设施的推荐信息设施信息。 根据过滤规则，在提取推荐信息时也可以在用户DB中使用用户信息。 随后，该设备将所提取的推荐信息与计划路由相关联，并将其输出。

公开(公告)号：US06759316B2

公开(公告)日：2004-07-06

申请号：US10124595

申请日：2002-04-18

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L2144

CPC分类号： H01L23/49816 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device having a multilayer structure and a method of manufacturing the semiconductor device are disclosed. The semiconductor device according to the present invention has a semiconductor element including pad electrodes formed on the electrode area thereof, a first insulation layer formed on the circuit formation area of the semiconductor element, and a first circuit pattern formed on said first insulation layer. The first circuit pattern electrically connected to the pad electrodes. The semiconductor device of the present invention further has a second insulation layer formed on the first circuit pattern including a first through hole for exposing the first circuit pattern, and a second circuit pattern formed on the second insulation layer. The second circuit pattern is electrically connected to the pad electrodes and has a second through hole for exposing the first circuit pattern. The semiconductor device of the present invention further has first external electrodes electrically connected to said second circuit pattern and second external electrodes electrically connected to the first circuit pattern through the first and second through holes.

摘要翻译： 公开了一种具有多层结构的半导体器件和制造半导体器件的方法。 根据本发明的半导体器件具有包括形成在其电极区上的焊盘电极的半导体元件，形成在半导体元件的电路形成区域上的第一绝缘层和形成在所述第一绝缘层上的第一电路图案。 电连接到焊盘电极的第一电路图案。 本发明的半导体器件还具有形成在第一电路图案上的第二绝缘层，其包括用于暴露第一电路图案的第一通孔和形成在第二绝缘层上的第二电路图案。 第二电路图案电连接到焊盘电极，并具有用于暴露第一电路图案的第二通孔。 本发明的半导体器件还具有电连接到所述第二电路图案的第一外部电极和通过第一和第二通孔电连接到第一电路图案的第二外部电极。

公开(公告)号：US06605867B2

公开(公告)日：2003-08-12

申请号：US09989382

申请日：2001-11-21

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L2972

CPC分类号： H01L23/3128 ,  H01L21/486 ,  H01L23/49827 ,  H01L24/48 ,  H01L2224/05599 ,  H01L2224/45099 ,  H01L2224/48227 ,  H01L2224/85399 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2924/00 ,  H01L2924/00012

摘要： A conductive layer is formed on a dielectric substrate on which a semiconductor chip is mounted, and holes are formed passing through the layer and the substrate. After this, before the through-holes are filled with a conductive material, the conductive layer is patterned by patterning. By patterning, conductive patterns are formed from the conductive layer. After the conductive patterns are formed, the through-holes are filled with a conductive material while both ends of the holes are open, to form conductors. In the above process, one open end of each through-hole is used as a leak hole to discharge air bubbles, thus suppressing the occurrence of voids caused by bubbles, and an increase in electrical resistance in the conductors by voids can be prevented.

摘要翻译： 在其上安装有半导体芯片的电介质基板上形成导电层，并且穿过该层和基板形成空穴。 之后，在通孔填充有导电材料之前，通过图案化将导电层图案化。 通过图案化，导电图案由导电层形成。 在形成导电图案之后，通孔填充有导电材料，同时孔的两端开放，形成导体。 在上述过程中，每个通孔的一个开口端用作泄漏孔以排出气泡，从而抑制由气泡引起的空隙的发生，并且可以防止导体中空隙的电阻增加。

公开(公告)号：US06387796B1

公开(公告)日：2002-05-14

申请号：US09707846

申请日：2000-11-08

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： H01L2144

CPC分类号： H01L23/49816 ,  H01L23/3107 ,  H01L23/49572 ,  H01L23/49827 ,  H01L24/48 ,  H01L24/49 ,  H01L24/50 ,  H01L2224/4824 ,  H01L2224/49109 ,  H01L2924/00014 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A semiconductor device having a multilayer structure and a method of manufacturing the semiconductor device are disclosed. The semiconductor device according to the present invention has a semiconductor element including pad electrodes formed on the electrode area thereof, a first insulation layer formed on the circuit formation area of the semiconductor element, and a first circuit pattern formed on said first insulation layer. The first circuit pattern electrically connected to the pad electrodes. The semiconductor device of the present invention further has a second insulation layer formed on the first circuit pattern including a first through hole for exposing the first circuit pattern, and a second circuit pattern formed on the second insulation layer. The second circuit pattern is electrically connected to the pad electrodes and has a second through hole for exposing the first circuit pattern. The semiconductor device of the present invention further has first external electrodes electrically connected to said second circuit pattern and second external electrodes electrically connected to the first circuit pattern through the first and second through holes.

公开(公告)号：US5744986A

公开(公告)日：1998-04-28

申请号：US233930

申请日：1994-04-28

申请人： Shigeru Yamada ,  Tetsuro Itakura

发明人： Shigeru Yamada ,  Tetsuro Itakura

IPC分类号： G09G3/36 ,  G11C27/02

CPC分类号： G09G3/3688

摘要： A source driver circuit device for decreasing a gap of output errors of a plurality of driver circuits which perform a serial/parallel conversion of a video signal, comprises a plurality of sample-and-hold circuits arranged in the order for sequentially sampling levels of an input video signal; a plurality of signal output circuits for respectively generating voltage outputs corresponding to holding levels of said plurality of sample-and-hold circuits; a plurality of reference level sample-and-hold circuits each of which is provided with each predetermined number of said sample-and-hold circuits, and for sampling a reference level; a plurality of sample value output circuits for respectively generating voltage outputs corresponding to holding levels of said plurality of reference level sample-and-hold circuits; and an output error correction circuit for performing an output level correction in each of said plurality of signal output circuits on the basis of a level difference between said reference level and an average value of a plurality of outputs issued from said plurality of sample value output circuits. Therefore, it is possible to decrease the level difference between output errors among the driver circuit device.

摘要翻译： 用于减少执行视频信号的串行/并行转换的多个驱动器电路的输出误差的间隙的源极驱动器电路装置包括多个取样和保持电路，其顺序地按 输入视频信号; 多个信号输出电路，用于分别产生对应于所述多个采样和保持电路的保持电平的电压输出; 多个参考电平采样和保持电路，每个基准电平采样和保持电路都设置有每个预定数量的所述采样和保持电路，并且用于对参考电平进行采样; 多个采样值输出电路，用于分别产生与所述多个参考电平采样和保持电路的保持电平相对应的电压输出; 以及输出误差校正电路，用于根据所述参考电平与从所述多个采样值输出电路发出的多个输出的平均值之间的电平差执行所述多个信号输出电路中的每一个的输出电平校正 。 因此，能够降低驱动电路装置的输出误差之间的电平差。

公开(公告)号：US5690137A

公开(公告)日：1997-11-25

申请号：US688873

申请日：1996-07-31

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： B23Q1/00 ,  B23Q11/00 ,  B23Q11/10 ,  B23Q11/12 ,  B08B5/00 ,  B23B27/10 ,  B23Q3/12

CPC分类号： B23Q11/1023 ,  B23Q1/0036 ,  B23Q11/005 ,  B23Q11/12 ,  Y02P70/171 ,  Y10T137/4259 ,  Y10T137/6416 ,  Y10T408/45 ,  Y10T409/304032 ,  Y10T409/309464

摘要： A spindle device for supplying air for cleaning and a coolant for cooling or lubricating, including: a tool holder (11) with a coolant passage (22) through which a coolant is supplied; a spindle (10) having a support surface (26) formed at the front portion thereof for accepting the tool holder (11); a drawing bolt (25) having a through-hole for supplying air or a coolant and movably arranged in the spindle (11) for clamping or unclamping the tool holder (11) accepted on the support portion (26) of the spindle (11); and a pull stud (12) attached on the tool holder (11) and provided with a valve (13), the valve (13) being located in association with the coolant passage (22) and the through-hole, the valve (13) being so constructed as to open or close according to the movement of the drawing bolt (25) in such a manner that the valve (13) opens so as to connect the through-hole to the coolant passage (22) when the tool holder (11) is clamped, whereas the valve (13) temporarily closes so as to shut the connection between the through-hole and the coolant passage (22) when the tool holder (11) is unclamped, wherein a coolant can be supplied from the through-hole to the coolant passage (22) via the valve (13) when the tool holder (11) is clamped, whereas air can be supplied from the through-hole by bypassing the coolant passage (22) when the tool holder (11) is unclamped.

摘要翻译： 一种用于提供用于清洁的空气和用于冷却或润滑的冷却剂的主轴装置，包括：具有供应冷却剂的冷却剂通道（22）的工具保持器（11） 主轴（10），其具有形成在其前部的支撑表面（26），用于接收工具架（11）; 具有用于供应空气的通孔或冷却剂并且可移动地布置在所述心轴（11）中的用于夹紧或松开接纳在所述心轴（11）的支撑部分（26）上的所述工具架（11）的拉拔螺栓（25） ; 以及附接在所述工具保持器（11）上并设置有阀（13）的拉杆（12），所述阀（13）与所述冷却剂通道（22）和所述通孔相关联地定位，所述阀（13） ）被构造成根据拉拔螺栓（25）的运动以使阀（13）打开以将通孔连接到冷却剂通道（22）的方式打开或关闭，当刀架 （11）被夹紧，而当所述工具架（11）松开时，所述阀（13）暂时关闭，以便关闭所述通孔和所述冷却剂通道（22）之间的连接，其中可从 当工具架（11）被夹紧时，经由阀（13）的通孔连接到冷却剂通道（22），而当工具架（11）被夹紧时，可以通过绕过冷却剂通道（22）从通孔供应空气 ）是松开的。

公开(公告)号：US5622247A

公开(公告)日：1997-04-22

申请号：US341064

申请日：1994-11-16

申请人： Shigeru Yamada

发明人： Shigeru Yamada

IPC分类号： B23Q7/14 ,  B65G37/00

CPC分类号： B23Q7/1431 ,  Y10T29/5196

摘要： A pallet changer of the type in which a pallet is exchanged between a pallet changer body and a table of a machine tool. A circular groove is provided on the bottom side of the pallets and plate members having a shape corresponding to that of the groove are provided on the pallet changer body and the table. The pallets are rotatable through a path, defined between the plate of the pallet changer body and the plate of the machine tool table.

摘要翻译： 一种托盘交换器，其中托盘在托盘交换器主体和机床的工作台之间被更换。 在托板的底侧设置有圆形槽，并且具有与槽的形状对应的形状的板构件设置在托盘交换器主体和工作台上。 托板可以通过限定在托盘更换器主体的板和机床台板之间的路径旋转。

公开(公告)号：US5412422A

公开(公告)日：1995-05-02

申请号：US976334

申请日：1992-11-13

申请人： Shigeru Yamada ,  Masataka Tsuji ,  Kenji Mitsui

发明人： Shigeru Yamada ,  Masataka Tsuji ,  Kenji Mitsui

IPC分类号： H04N5/225 ,  H04N5/335 ,  H04N5/341 ,  H04N5/345 ,  H04N5/369 ,  H04N5/372 ,  H04N5/374 ,  H04N5/376 ,  H04N5/378 ,  H04N9/04 ,  H04N5/45 ,  H04N5/232

CPC分类号： H04N3/1562

摘要： A high speed imaging apparatus comprises an imaging sensor composed of a multiplicity of photoelectric converting elements which are two-dimensionally arrayed, the imaging sensor being sectioned into a plurality of blocks by effecting predetermined splitting in a vertical row direction and in a horizontal column direction and the blocks including photoelectric converting element groups, vertical and horizontal scanning circuit capable of parallel-reading of the photoelectric converting element groups of the respective blocks in vertical and horizontal direction, and a drive circuit for driving the vertical and horizontal scanning circuit so as to sequentially selecting one or plurality of the blocks within said imaging sensor which are then read and scanned. The imaging apparatus may further comprise an operation sensor for detecting a moving direction of an object, a control unit for calculating the blocks to be selected and a reading order of the selected blocks in response to a signal from the operation sensor, and a block selection address generation circuit through which an output signal from the control unit is inputted to the drive circuit so as to sequentially change over the blocks of the imaging sensor in accordance with the moving direction of the object.

摘要翻译： 高速成像装置包括由二维排列的多个光电转换元件构成的成像传感器，通过在垂直行方向和水平列方向上进行预定的分割，成像传感器被分割成多个块，并且 包括光电转换元件组，能够在垂直和水平方向上并行读取各个块的光电转换元件组的垂直和水平扫描电路的块和用于驱动垂直和水平扫描电路的驱动电路，以便顺序地 选择所述成像传感器内的一个或多个块，然后读取和扫描。 成像装置还可以包括用于检测物体的移动方向的操作传感器，用于响应于来自操作传感器的信号计算要选择的块和所选择的块的读取顺序的控制单元，以及块选择 地址产生电路，通过该电路将来自控制单元的输出信号输入到驱动电路，以便根据物体的移动方向依次切换成像传感器的块。

公开(公告)号：US4914803A

公开(公告)日：1990-04-10

申请号：US238189

申请日：1988-08-30

申请人： Koichiro Kitamura ,  Shigeru Yamada

发明人： Koichiro Kitamura ,  Shigeru Yamada

IPC分类号： B23Q3/157

CPC分类号： B23Q3/15713 ,  Y10T483/1779 ,  Y10T483/1882

摘要： A machine tool comprising a spindle head, a tool magazine, and an arm, the arm being secured to the spindle head, the arm having gripping members for holding a tool holder. When a workpiece is machined, the arm in which gripping members are opened is placed near the spindle. As soon as machining is completed, the grip members are closed so as to hold the tool holder set into the spindle. The end face of the spindle and the end face of the tool magazine stand at different levels when the spindle head is located in tool changing position. When a used tool is returned to the tool magazine, the arm operates in the following steps: first, the arm grips the used tool set into the spindle; second, the arm is moved so as to draw the tool from the spindle; and third, the arm is swiveled so as to return the tool to the tool magazine.