公开(公告)号：US12057327B2

公开(公告)日：2024-08-06

申请号：US18107935

申请日：2023-02-09

Applicant: TOKYO ELECTRON LIMITED

Inventor： Masataka Gosho ,  Yuichi Douki ,  Satoshi Biwa ,  Satoshi Okamura ,  Katsuhiro Ookawa ,  Yuichiro Kunugimoto

IPC: H01L21/67 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02 ,  H01L21/66 ,  H01L21/687

CPC classification number: H01L21/67051 ,  B08B3/08 ,  B08B7/04 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67028 ,  H01L21/67253 ,  H01L21/67288 ,  H01L21/68764 ,  H01L22/12 ,  H01L22/20 ,  H01L21/67248

Abstract: There is provided a substrate processing apparatus comprising a liquid amount detecting part configured to detect a liquid amount of a liquid film formed on a substrate; and a coating state detecting part configured to detect a coating state of the substrate with the liquid film formed thereon.

公开(公告)号：US20190006206A1

公开(公告)日：2019-01-03

申请号：US16019773

申请日：2018-06-27

Applicant: Tokyo Electron Limited

Inventor： Hiroyuki Higashi ,  Takahisa Otsuka ,  Kazuyoshi Shinohara ,  Takashi Nakazawa ,  Seiya Fujimoto ,  Yuichi Douki

IPC: H01L21/67 ,  H01L21/3065

Abstract: The substrate processing method according to an exemplary embodiment includes a low temperature dissolving processing and an etching processing. The low temperature dissolving processing dissolves oxygen in an alkaline aqueous solution cooled to a predetermined temperature lower than the room temperature. The etching processing etches a substrate by supplying the alkaline aqueous solution in which oxygen is dissolved to the substrate.

公开(公告)号：US20180221925A1

公开(公告)日：2018-08-09

申请号：US15747921

申请日：2016-07-28

Applicant: Tokyo Electron Limited

Inventor： Norihiro Ito ,  Jiro Higashijima ,  Nobuhiro Ogata ,  Takahisa Otsuka ,  Yuichi Douki ,  Yusuke Hashimoto ,  Kazuhiro Aiura ,  Daisuke Goto

IPC: B08B17/02 ,  H01L21/67 ,  H01L21/687 ,  H01L21/02 ,  B08B3/02 ,  B08B3/08

CPC classification number: B08B17/025 ,  B08B3/02 ,  B08B3/022 ,  B08B3/08 ,  B08B2203/0229 ,  B08B2203/0264 ,  H01L21/02052 ,  H01L21/67051 ,  H01L21/68764

Abstract: A substrate processing apparatus includes a stationary cup body 51 provided to surround a substrate holding unit 31 and configured to receive a processing liquid or mist of the processing liquid discharged onto a substrate, the stationary cup body not being moved relatively with respect to a processing vessel; a mist guard 80; and a guard elevating mechanism 84 configured to elevate the mist guard. Here, the mist guard is provided at an outside of the stationary cup body to surround the stationary cup body and configured to block a liquid scattered outwards beyond a space above the stationary cup body. Further, the mist guard includes a cylindrical portion 81 of a cylindrical shape and a protruding portion 82 protruded from an upper portion of the cylindrical portion toward an inside of the cylindrical portion.

公开(公告)号：US09953852B2

公开(公告)日：2018-04-24

申请号：US14525541

申请日：2014-10-28

Applicant: TOKYO ELECTRON LIMITED

Inventor： Jiro Higashijima ,  Yuichi Douki ,  Masami Akimoto ,  Shigehisa Inoue

IPC: H01L21/67 ,  B08B1/04

CPC classification number: H01L21/6715 ,  B08B1/04 ,  H01L21/67051 ,  H01L21/6708 ,  Y10S134/902

Abstract: A liquid processing apparatus of the present disclosure performs a liquid processing by supplying a processing liquid to a substrate that is rotating. A substrate holding unit configured to be rotatable around a vertical axis is provided with a holding surface to attract and hold a bottom surface of the substrate horizontally. A guide unit is formed integrally with the substrate holding unit, disposed around the substrate held in the substrate holding unit, and provided at a position equal to or lower than a height of a top surface of a periphery of the substrate. The guide unit includes a guide surface configured to guide the processing liquid. A rotary cup rotates integrally with the substrate holding unit, and guides the processing liquid towards the cup between the rotary cup and the guide unit.

公开(公告)号：US20160370810A1

公开(公告)日：2016-12-22

申请号：US15181770

申请日：2016-06-14

Applicant: Tokyo Electron Limited

Inventor： Keigo Satake ,  Kenji Nakamizo ,  Yuichi Douki ,  Takuro Masuzumi

IPC: G05D7/06

CPC classification number: G05D7/0635 ,  G05B2219/41303 ,  H01L21/67051 ,  H01L21/67253

Abstract: Disclosed is a processing apparatus including a chamber, at least one nozzle, a measuring unit, an opening/closing unit, and a controller. The chamber accommodates a workpiece therein. The nozzle is provided in the chamber to supply a processing fluid toward the workpiece. The measuring unit measures a supply flow rate of the processing fluid supplied to the nozzle. The opening/closing unit performs opening/closing of a flow path of the processing fluid to be supplied to the nozzle. The controller outputs opening and closing operation signals at a preset timing. After outputting the opening operation signal, the controller calculates an integrated amount of the processing fluid based on a measurement result of the measuring unit, and performs an output timing change processing to change a timing of outputting the opening or closing operation signal from the preset timing based on the calculated integrated amount.

Abstract translation: 公开了一种包括室，至少一个喷嘴，测量单元，打开/关闭单元和控制器的处理设备。 该室容纳工件。 喷嘴设置在腔室中以朝向工件供应处理流体。 测量单元测量供应到喷嘴的处理流体的供应流量。 打开/关闭单元执行要供给到喷嘴的处理流体的流路的打开/关闭。 控制器以预设的定时输出打开和关闭操作信号。 在输出打开操作信号之后，控制器基于测量单元的测量结果计算处理流体的积分量，并且执行输出定时改变处理以改变从预设定时输出打开或关闭操作信号的定时 基于计算的积分量。

公开(公告)号：US09136150B2

公开(公告)日：2015-09-15

申请号：US13759471

申请日：2013-02-05

Applicant: Tokyo Electron Limited

Inventor： Tokutarou Hayashi ,  Yuichi Douki ,  Hirotoshi Mori ,  Akihiro Teramoto

IPC: G06F7/00 ,  G05B19/18 ,  B63B27/00 ,  B65H1/00 ,  H01L21/677 ,  H01L21/673 ,  H01L21/67

CPC classification number: H01L21/677 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67259 ,  H01L21/67288 ,  H01L21/673 ,  H01L21/67742

Abstract: There is provided a technique which can prevent poor processing of successive substrates in the event of a failure of a module or a transport mechanism for transporting a substrate between modules. A substrate processing apparatus includes: a plurality of modules from which a substrate holder of a substrate transport mechanism receives a substrate; a sensor section for detecting a displacement of the holding position of a substrate, held by the substrate holder, from a reference position preset in the substrate holder; and a storage section for storing the displacement, detected when the substrate holder receives a substrate from each of the modules, in a chronological manner for each module. A failure of one of the modules or the substrate transport mechanism is estimated based on the chronological data on the displacement for each module, stored in the storage section. This enables an early detection of a failure or abnormality.

Abstract translation: 提供了一种技术，其可以防止在模块故障或用于在模块之间传送基板的输送机构的情况下连续的基板的加工不良。 基板处理装置包括：多个模块，基板传送机构的基板保持器从该多个模块接收基板; 传感器部分，用于检测由衬底保持器保持的衬底的保持位置从预设在衬底保持器中的参考位置的位移; 以及存储部，用于存储当基板保持器从每个模块接收到基板时检测到的位移，用于每个模块的按时间顺序排列。 基于存储在存储部中的每个模块的位移的时间顺序数据来估计模块或基板传送机构中的一个的故障。 这使得能够及早发现故障或异常。