公开(公告)号：US10792711B2

公开(公告)日：2020-10-06

申请号：US16215958

申请日：2018-12-11

Applicant: Tokyo Electron Limited

Inventor： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment comprises a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, wherein the treatment film comprises an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US10272478B2

公开(公告)日：2019-04-30

申请号：US14809387

申请日：2015-07-27

Applicant: TOKYO ELECTRON LIMITED

Inventor： Meitoku Aibara ,  Yuki Yoshida ,  Hisashi Kawano ,  Masami Yamashita ,  Itaru Kanno ,  Kenji Mochida ,  Motoyuki Shima

IPC: B08B3/08 ,  H01L21/02 ,  H01L21/67

Abstract: An object of the present invention is to obtain a high removing performance of particles. The substrate processing system according to the exemplary embodiment includes a holding unit and a removing solution supply unit. The holding unit holds a substrate that has a treatment film formed thereon, the treatment film includes an organic solvent and a fluorine-containing polymer that is soluble in the organic solvent. The removing solution supply unit supplies to the treatment film formed on the substrate, a removing solution capable of removing the treatment film.

公开(公告)号：US10121646B2

公开(公告)日：2018-11-06

申请号：US15825779

申请日：2017-11-29

Applicant: Tokyo Electron Limited

Inventor： Koji Kagawa ,  Hisashi Kawano ,  Meitoku Aibara ,  Yuki Yoshida

IPC: H01L21/02 ,  H01L21/67

Abstract: In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.

公开(公告)号：US20180240684A1

公开(公告)日：2018-08-23

申请号：US15764482

申请日：2016-09-29

Applicant: Tokyo Electron Limited

Inventor： Koji Egashira ,  Masami Yamashita ,  Yoshiyuki Honda ,  Yuki Yoshida ,  Yosuke Kawabuchi

IPC: H01L21/67 ,  H01L21/02 ,  H01J37/32

CPC classification number: H01L21/67034 ,  H01J37/32449 ,  H01J37/32715 ,  H01J2237/335 ,  H01L21/02057 ,  H01L21/02101 ,  H01L21/67017 ,  H01L21/67109 ,  H01L21/6719

Abstract: A gas discharge hole 74 (205) configured to discharge a gas is provided at a position outside an edge of a substrate W held by a substrate holding unit 89 (204) within a processing chamber 81 (201). The gas discharged from the gas discharge hole 74 (205) forms a flow of the gas flowing in a direction along a first surface (front surface) of the substrate held by the substrate holding unit. A gas of a sublimation substance which is sublimated and a foreign substance included in the gas are flown along the flow of the gas to be removed from a vicinity of the substrate. The gas serves as a heat transfer medium for heat transfer from a heating unit 88 (203) to the substrate.

公开(公告)号：US09870914B2

公开(公告)日：2018-01-16

申请号：US15226396

申请日：2016-08-02

Applicant: Tokyo Electron Limited

Inventor： Koji Kagawa ,  Hisashi Kawano ,  Meitoku Aibara ,  Yuki Yoshida

IPC: H01L21/02 ,  H01L21/67

CPC classification number: H01L21/0206 ,  H01L21/67028 ,  H01L21/67034 ,  H01L21/67051 ,  H01L21/67109 ,  H01L21/6719 ,  H01L21/67248

Abstract: In order to remove from a substrate having a concavo-convex pattern formed on a surface of the substrate, a solid material with which a concave portion of the concavo-convex pattern is filled and which is formed by evaporating a solvent in a sublimable substance solution containing a sublimable substance that sublimates at a temperature equal to or higher than a first temperature, and an impurity that evaporates at a temperature equal to or higher than a second temperature that is higher than the first temperature, the prevent invention provides a substrate processing apparatus and a substrate processing method which heat the substrate to a temperature equal to or higher than the second temperature.

公开(公告)号：US20140373877A1

公开(公告)日：2014-12-25

申请号：US14297723

申请日：2014-06-06

Applicant: Tokyo Electron Limited

Inventor： Shigehisa Inoue ,  Daisuke Nakayama ,  Katsufumi Matsuki ,  Takuro Masuzumi ,  Yuki Yoshida ,  Meitoku Aibara ,  Hiromi Kiyose ,  Takashi Uno ,  Hirotaka Maruyama ,  Kazuya Koyama ,  Takashi Nakazawa

IPC: B08B3/02 ,  H01L21/67

CPC classification number: B08B3/02 ,  H01L21/67051

Abstract: Disclosed are a liquid processing apparatus and a liquid processing method in which a substrate is processed by a processing liquid in the form of liquid droplets. The liquid processing apparatus includes: a first processing liquid ejecting unit configured to eject a first processing liquid in a form of liquid droplets which contains pure water toward the surface of the substrate; and a second processing liquid ejecting unit configured to eject a second processing liquid as a continuous liquid stream toward the surface of the substrate processed by the first processing liquid in the form of the liquid droplets. The second processing liquid inverts a zeta potential on the surface of the substrate into a negative zeta potential.

Abstract translation: 公开了一种液体处理装置和液体处理方法，其中基板由液滴形式的处理液体处理。 液体处理装置包括：第一处理液体喷射单元，被配置为将含有纯水的液滴形式的第一处理液喷射到基板的表面; 以及第二处理液体喷射单元，被配置为以液滴的形式将作为连续液体流的第二处理液体朝向由第一处理液体处理的基板的表面喷射。 第二处理液将基板表面上的ζ电位反转为负ζ电位。

公开(公告)号：US20140360536A1

公开(公告)日：2014-12-11

申请号：US14296813

申请日：2014-06-05

Applicant: Tokyo Electron Limited

Inventor： Yosuke Kawabuchi ,  Hisashi Kawano ,  Satoru Tanaka ,  Hiroyuki Suzuki ,  Kotaro Oishi ,  Kazuyoshi Shinohara ,  Yuki Yoshida

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/02057 ,  H01L21/67028 ,  H01L21/6715

Abstract: A throughput in processing a substrate can be improved and a running cost thereof can be reduced. A substrate processing apparatus 1 that processes a substrate 3 with a processing liquid and dries the substrate 3 includes a substrate rotating device 22 configured to rotate the substrate 3; a processing liquid discharging unit 13 configured to discharge the processing liquid toward the substrate 3; a substitution liquid discharging unit 14 configured to discharge a substitution liquid, which is substituted with the processing liquid on the substrate 3, toward the substrate 3 while relatively moving with respect to the substrate 3; and an inert gas discharging unit 15 configured to discharge an inert gas toward a peripheral portion of the substrate 3 in an inclined direction from above the substrate 3 while moving in a direction different from a direction in which the substitution liquid discharging unit 14 is moved.

Abstract translation: 可以提高处理基板的生产量，并且可以降低其运行成本。 用处理液处理基板3并干燥基板3的基板处理装置1包括：基板旋转装置22，被配置为旋转基板3; 将处理液朝向基板3排出的处理液排出部13; 置换液体排出单元14，被配置为在衬底3上被处理液取代的取代液体相对于衬底3相对移动而朝向衬底3排出; 以及惰性气体排出单元15，其构造成在与替代液体排出单元14的移动方向不同的方向上移动，同时从基板3的上方沿倾斜方向朝向基板3的周边部分排出惰性气体。

公开(公告)号：US20140137902A1

公开(公告)日：2014-05-22

申请号：US14084839

申请日：2013-11-20

Applicant: Tokyo Electron Limited

Inventor： Kazuhiro Aiura ,  Norihiro Ito ,  Hidetoshi Nakao ,  Kazuyoshi Shinohara ,  Satoru Tanaka ,  Yuki Yoshida ,  Meitoku Aibara

IPC: H01L21/67

CPC classification number: H01L21/67051 ,  H01L21/68735

Abstract: A substrate processing apparatus includes a rotary cup that is provided at a substrate holding unit to surround a substrate held thereon and to be rotated along with the substrate holding unit, and configured to guide a processing liquid dispersed from the substrate; and an outer cup that is provided around the rotary cup with a gap therebetween and configured to collect the guided processing liquid by the rotary cup. Further, a height of an upper end of the rotary cup is higher than that of the outer cup. Furthermore, an outward protrusion protruded outwards in a radial direction thereof and extended along a circumference thereof is provided at an upper end portion of an outer surface of the rotary cup, and the outward protrusion blocks mist of the processing liquid dispersed from the gap between the rotary cup and the outer cup toward a space above the substrate.

Abstract translation: 一种基板处理装置，包括旋转杯，该旋转杯设置在基板保持单元处，以围绕保持在其上的基板并与基板保持单元一起旋转，并且构造成引导从基板分散的处理液; 以及外杯，其设置在旋转杯周围，其间具有间隙，并且构造成通过旋转杯收集被引导的处理液。 此外，旋转杯的上端的高度高于外杯的高度。 此外，在旋转杯的外表面的上端部设置有沿其径向向外突出并且沿着其周向延伸的向外突出部，并且向外突出部阻挡从位于旋转杯之间的间隙分散的处理液的雾 旋转杯和外杯朝向衬底上方的空间。