公开(公告)号：US08116084B2

公开(公告)日：2012-02-14

申请号：US12734646

申请日：2008-11-19

申请人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

发明人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

IPC分类号： H05K1/00

CPC分类号： H05K3/38 ,  B23K1/0016 ,  B23K1/19 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/4803 ,  H01L23/15 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K2203/128 ,  Y10T428/12007 ,  Y10T428/12736 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

摘要翻译： 一种功率模块基板的制造方法，其特征在于，包括：准备陶瓷基板和由纯铝制成的金属板; 熔融步骤，其中陶瓷基板和金属板层叠有钎料，并且在陶瓷基板和金属板之间的界面处通过熔融钎料填充金属形成熔融铝层， 加热引起的; 以及熔融铝层通过冷却固化的固化步骤，并且当熔融铝层固化时，使晶体生长成以金属板的结晶取向布置。

公开(公告)号：US20100285331A1

公开(公告)日：2010-11-11

申请号：US12734646

申请日：2008-11-19

申请人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

发明人： Takeshi Kitahara ,  Yoshiyuki Nagatomo ,  Toshiyuki Nagase ,  Yoshirou Kuromitsu

IPC分类号： B32B15/20 ,  B23K31/02 ,  B32B15/04

CPC分类号： H05K3/38 ,  B23K1/0016 ,  B23K1/19 ,  B23K2101/40 ,  B23K2103/10 ,  B23K2103/18 ,  B23K2103/52 ,  H01L21/4803 ,  H01L23/15 ,  H01L23/3735 ,  H01L2224/32225 ,  H05K1/0306 ,  H05K1/09 ,  H05K3/0061 ,  H05K2203/128 ,  Y10T428/12007 ,  Y10T428/12736 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A method for manufacturing a power module substrate, includes: preparing a ceramics substrate and a metal plate made of pure aluminum; a fusion step in which the ceramics substrate and the metal plate are stacked in layers with a brazing filler metal interposed therebetween, and a fused aluminum layer is formed at an interface between the ceramics substrate and the metal plate by fusing the brazing filler metal which is caused by heating; and a solidifying step in which the fused aluminum layer is solidified by cooling, and a crystal is grown so as to be arranged in a crystal orientation of the metal plate when the fused aluminum layer is solidified.

摘要翻译： 一种功率模块基板的制造方法，其特征在于，包括：准备陶瓷基板和由纯铝制成的金属板; 熔融步骤，其中陶瓷基板和金属板层叠有钎料，并且在陶瓷基板和金属板之间的界面处通过熔融钎料填充金属形成熔融铝层， 加热引起的; 以及熔融铝层通过冷却固化的固化步骤，并且当熔融铝层固化时，使晶体生长成以金属板的结晶取向布置。

公开(公告)号：US07128979B2

公开(公告)日：2006-10-31

申请号：US10510199

申请日：2003-04-21

申请人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo

发明人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo

IPC分类号： B22F3/00 ,  H01L23/10

CPC分类号： H05K1/09 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0355 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/24926 ,  H01L2924/00

摘要： A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98% by mass of aluminum, and display an average crystal grain diameter within a range from 0.5 mm to 5 mm and a standard deviation σ for that crystal grain diameter of no more than 2 mm. Each conductive layer comprises at least 20 ppm of Cu, Fe and Si. The surface area of the crystal with the maximum crystal grain diameter within the conductive layers accounts for no more than 15% of the surface area of the insulating ceramic substrate.

摘要翻译： 一种电路板，包括结合到绝缘陶瓷基板的两个表面的导电层，其间设置有钎焊材料。 导电层包含至少99.98质量％的铝，并且平均晶粒直径在0.5mm至5mm的范围内，并且该晶粒直径的标准偏差σ为不大于2mm。 每个导电层包含至少20ppm的Cu，Fe和Si。 在导电层内具有最大晶粒直径的晶体的表面积不超过绝缘陶瓷衬底的表面积的15％。

公开(公告)号：US20050214518A1

公开(公告)日：2005-09-29

申请号：US10510199

申请日：2003-04-21

申请人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo

发明人： Toshiyuki Nagase ,  Yoshiyuki Nagatomo

IPC分类号： H01L23/373 ,  H05K1/03 ,  H05K1/09 ,  H05K3/38 ,  B32B3/00 ,  B32B7/00 ,  B32B17/00 ,  B32B18/00

CPC分类号： H05K1/09 ,  H01L23/3735 ,  H01L2924/0002 ,  H01L2924/3011 ,  H05K1/0306 ,  H05K2201/0355 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/24926 ,  H01L2924/00

摘要： A circuit board including conductive layers bonded to both surfaces of an insulating ceramic substrate, with a brazing material disposed therebetween. The conductive layers comprise at least 99.98% by mass of aluminum, and display an average crystal grain diameter within a range from 0.5 mm to 5 mm and a standard deviation σ for that crystal grain diameter of no more than 2 mm. Each conductive layer comprises at least 20 ppm of Cu, Fe and Si. The surface area of the crystal with the maximum crystal grain diameter within the conductive layers accounts for no more than 15% of the surface area of the insulating ceramic substrate.

摘要翻译： 一种电路板，包括结合到绝缘陶瓷基板的两个表面的导电层，其间设置有钎焊材料。 导电层包含至少99.98质量％的铝，并且平均晶粒直径在0.5mm至5mm的范围内，并且该晶粒直径的标准偏差σ为不大于2mm。 每个导电层包含至少20ppm的Cu，Fe和Si。 在导电层内具有最大晶粒直径的晶体的表面积不超过绝缘陶瓷衬底的表面积的15％。

公开(公告)号：US08188376B2

公开(公告)日：2012-05-29

申请号：US12615793

申请日：2009-11-10

申请人： Takeshi Negishi ,  Toshiyuki Nagase

发明人： Takeshi Negishi ,  Toshiyuki Nagase

IPC分类号： H05K1/16

CPC分类号： H01L23/3735 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0597 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

摘要： A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.

摘要翻译： 一种用于提供功率模块衬底的工艺。 通过挥发性有机介质的表面张力将钎焊片临时固定在陶瓷基板的表面上，并且通过表面张力将从基材冲压的导电图案构件暂时固定在钎焊板的表面上。 这些被加热以挥发挥发性有机介质，并且在导电图案构件的厚度方向施加压力。 然后将钎焊片熔化以将导电图案部件与陶瓷基板的表面接合。

公开(公告)号：US08001682B2

公开(公告)日：2011-08-23

申请号：US11573755

申请日：2005-08-16

申请人： Takeshi Negishi ,  Toshiyuki Nagase

发明人： Takeshi Negishi ,  Toshiyuki Nagase

IPC分类号： H05K3/34 ,  H05K3/02 ,  H05K3/10 ,  H01K3/22 ,  H01K3/00 ,  B23P19/00

CPC分类号： H01L23/3735 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0597 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

摘要： A high-efficiency production method for a power module substrate with reduced line width of a conductive pattern provides an insulation substrate suitable for realizing a large current and a high voltage of a power module. According to the method, a brazing sheet is temporarily fixed on a first surface of a ceramics substrate by surface tension of a volatile organic liquid. The brazing sheet is also temporarily fixed on the first surface of a conductive pattern member punched from a base material by surface tension of same type of volatile organic liquid. The brazing sheet and the conductive pattern member are heated so as to volatilize the volatile organic liquid and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the first surface of the ceramics substrate.

摘要翻译： 具有导电图案的线宽减小的功率模块用基板的高效率的制造方法提供适于实现电力模块的大电流和高电压的绝缘基板。 根据该方法，通过挥发性有机液体的表面张力将钎焊片材暂时固定在陶瓷基板的第一面上。 钎焊片也通过相同类型的挥发性有机液体的表面张力临时固定在从基材冲压的导电图案构件的第一表面上。 钎焊板和导电图案构件被加热以挥发挥发性有机液体，并且在导电图案构件的厚度方向施加压力。 将钎焊片熔化，将导电图案部件与陶瓷基板的第一面接合。

公开(公告)号：US20100053903A1

公开(公告)日：2010-03-04

申请号：US12615793

申请日：2009-11-10

申请人： Takeshi Negishi ,  Toshiyuki Nagase

发明人： Takeshi Negishi ,  Toshiyuki Nagase

IPC分类号： H05K7/20 ,  H05K1/00

CPC分类号： H01L23/3735 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0597 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

摘要： A process for providing a power module substrate. A brazing sheet is temporarily fixed on a surface of a ceramic substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium, and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is then melted to join the conductive pattern member with the surface of the ceramics substrate.

摘要翻译： 一种用于提供功率模块衬底的工艺。 通过挥发性有机介质的表面张力将钎焊片临时固定在陶瓷基板的表面上，并且通过表面张力将从基材冲压的导电图案构件暂时固定在钎焊板的表面上。 这些被加热以挥发挥发性有机介质，并且在导电图案构件的厚度方向施加压力。 然后将钎焊片熔化以将导电图案部件与陶瓷基板的表面接合。

公开(公告)号：US20070297162A1

公开(公告)日：2007-12-27

申请号：US11573755

申请日：2005-08-16

申请人： Takeshi Negishi ,  Toshiyuki Nagase

发明人： Takeshi Negishi ,  Toshiyuki Nagase

IPC分类号： H05K7/00 ,  B23K31/02 ,  H01B17/00

CPC分类号： H01L23/3735 ,  H01L21/4846 ,  H01L24/32 ,  H01L24/83 ,  H01L2224/32225 ,  H01L2224/83801 ,  H01L2224/8382 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01088 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/15787 ,  H05K1/0306 ,  H05K3/041 ,  H05K3/202 ,  H05K3/386 ,  H05K2203/0597 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49156 ,  Y10T29/49158 ,  Y10T29/4916 ,  Y10T29/53174 ,  Y10T29/532 ,  H01L2924/00014 ,  H01L2924/01014 ,  H01L2924/3512 ,  H01L2924/00

摘要： High-efficiency production of a power module substrate and reduction of the line width of a conductive pattern, and to provide an insulation substrate suitable for realizing a large current and a high voltage of a power module. A brazing sheet is temporarily fixed on a surface of a ceramics substrate by surface tension of a volatile organic medium, and a conductive pattern member punched from a base material is temporarily fixed on a surface of the brazing sheet by surface tension. These are heated so as to volatilize the volatile organic medium and a pressure is applied to the conductive pattern member in its thickness direction. The brazing sheet is melted to join the conductive pattern member with the surface of the ceramics substrate.

摘要翻译： 功率模块基板的高效率生产和导电图案的线宽度的降低，并且提供适于实现功率模块的大电流和高电压的绝缘衬底。 通过挥发性有机介质的表面张力将钎焊片临时固定在陶瓷基板的表面上，并且通过表面张力将从基材冲压的导电图案构件暂时固定在钎焊板的表面上。 这些被加热以挥发挥发性有机介质，并且在其厚度方向上对导电图案构件施加压力。 将钎焊片熔化以将导电图案部件与陶瓷基板的表面接合。

公开(公告)号：US6033787A

公开(公告)日：2000-03-07

申请号：US916258

申请日：1997-08-22

申请人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

发明人： Toshiyuki Nagase ,  Yoshirou Kuromitsu ,  Kunio Sugamura ,  Yoshio Kanda ,  Masafumi Hatsushika ,  Masato Otsuki

IPC分类号： B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H05K1/03 ,  H05K3/00 ,  H05K3/38 ,  B22F3/00 ,  H01L23/10

CPC分类号： H05K3/0061 ,  B32B15/04 ,  H01L23/15 ,  H01L23/373 ,  H01L2924/0002 ,  H05K1/0306 ,  H05K2201/0355 ,  H05K3/38 ,  Y10T428/12007 ,  Y10T428/12493 ,  Y10T428/12576 ,  Y10T428/24926

摘要： A ceramic circuit board with a heat sink which has a long life under heat cycles. First and second aluminum plates are laminated and bonded onto both sides of a ceramic substrate through Al--Si-based brazing solders, respectively. A heat sink formed of an AlSiC-based composite material is laminated and bonded onto a surface of the first aluminum plate. The ceramic substrate is formed of AlN, Si.sub.3 N.sub.4 or Al.sub.2 O.sub.3. An Al alloy in the heat sink has an Al purity of 80-99% by weight, and the first or second aluminum plate has an Al purity not less than 99.98% by weight. The heat sink is laminated and bonded onto the first aluminum plate through the Al alloy in the heat sink.

摘要翻译： 具有散热片的陶瓷电路板，其热循环寿命长。 第一和第二铝板分别通过Al-Si基钎焊焊料层压并结合到陶瓷衬底的两侧。 将由AlSiC基复合材料形成的散热片层叠并结合到第一铝板的表面上。 陶瓷基板由AlN，Si3N4或Al2O3形成。 散热器中的Al合金的Al纯度为80-99重量％，第一或第二铝板的Al纯度不低于99.98重量％。 通过散热器中的Al合金将散热片层压并结合到第一铝板上。

公开(公告)号：US20060179144A1

公开(公告)日：2006-08-10

申请号：US11334560

申请日：2006-01-19

申请人： Toshiyuki Nagase

发明人： Toshiyuki Nagase

IPC分类号： G06F15/173 ,  G06F13/38 ,  G06F13/12

CPC分类号： G06F13/387 ,  G06F2213/4004

摘要： A USB hub according to an embodiment of the invention includes: a USB upstream port unit for inputting/outputting data in accordance with a USB protocol; a wireless upstream port unit for inputting/outputting data in accordance with a predetermined wireless communication protocol; a USB downstream port unit including at least one input/output port for inputting/outputting data in accordance with the USB protocol; a port selector for selection between the USB upstream port unit and the wireless upstream port unit to be connected with the input/output port; and a communication protocol converting unit provided on a connection path between the wireless upstream port unit and the port selector and converting the USB protocol and the wireless communication protocol.