Method and apparatus for silicon oxide deposition on large area substrates
    11.
    发明申请
    Method and apparatus for silicon oxide deposition on large area substrates 审中-公开
    在大面积衬底上沉积氧化硅的方法和装置

    公开(公告)号:US20060127068A1

    公开(公告)日:2006-06-15

    申请号:US11348595

    申请日:2006-02-07

    IPC分类号: A21B2/00

    CPC分类号: C23C16/402 C23C16/4485

    摘要: A method and apparatus for depositing a dielectric material at a rate of at least 3000 Angstroms per minute on a large area substrate that has a surface area of at least about 0.35 square meters is provided. In one embodiment, the dielectric material is silicon oxide. Also provided is a large area substrate having a layer of dielectric material deposited by a process yielding a deposition rate in excess of about 3000 Angstroms per minute and a processing chamber for fabricating the same.

    摘要翻译: 提供了一种在具有至少约0.35平方米的表面积的大面积基板上以至少3000埃每分钟的速率沉积电介质材料的方法和装置。 在一个实施例中,电介质材料是氧化硅。 还提供了一种大面积基板,其具有通过产生超过约3000埃/分钟的沉积速率的工艺沉积的介电材料层和用于制造该沉积速率的处理室。

    Method and apparatus for dechucking a substrate
    12.
    发明申请
    Method and apparatus for dechucking a substrate 有权
    剥离基板的方法和装置

    公开(公告)号:US20060034032A1

    公开(公告)日:2006-02-16

    申请号:US10919457

    申请日:2004-08-16

    IPC分类号: H01T23/00

    摘要: A method and apparatus for dechucking a substrate is provided. In one embodiment, a processing chamber is provided that includes a grounded chamber body having a substrate support assembly disposed in an interior volume. A dechucking circuit selectively couples the substrate support assembly to ground or to a power source. In another embodiment of the invention, a method for dechucking a substrate includes the steps of completing a plasma process on a substrate disposed on a grounded substrate support assembly, disconnecting the substrate support assembly from ground, and applying a dechucking voltage to the substrate support assembly.

    摘要翻译: 提供了一种用于去除基板的方法和装置。 在一个实施例中,提供了处理室,其包括接地室主体,其具有设置在内部容积中的基板支撑组件。 解扣电路将衬底支撑组件选择性地耦合到地或电源。 在本发明的另一个实施例中,一种用于对基板进行去夹套的方法包括以下步骤:在设置在接地的基板支撑组件上的基板上完成等离子体处理,将基板支撑组件从地面断开,以及向基板支撑组件施加脱扣电压 。

    DOUBLE DUAL SLOT LOAD LOCK CHAMBER
    13.
    发明申请
    DOUBLE DUAL SLOT LOAD LOCK CHAMBER 有权
    双层双层货车锁

    公开(公告)号:US20080044259A1

    公开(公告)日:2008-02-21

    申请号:US11926720

    申请日:2007-10-29

    IPC分类号: H01L21/67

    摘要: Provided herein is a double dual slot load lock chamber. The double dual slot load lock chamber includes two isolated load lock regions that are vertically stacked and share a common wall, wherein each isolated load lock region comprises two substrate slots.

    摘要翻译: 这里提供双重双槽加载锁定室。 双双插槽加载锁定室包括垂直堆叠并共享公共壁的两个隔离的负载锁定区域,其中每个隔离的负载锁定区域包括两个基板槽。

    Substrate handling system
    14.
    发明申请
    Substrate handling system 审中-公开
    基材处理系统

    公开(公告)号:US20060283688A1

    公开(公告)日:2006-12-21

    申请号:US11176742

    申请日:2005-07-07

    IPC分类号: B65G47/10

    摘要: Embodiments of a substrate handling system are provided herein. In one embodiment apparatus for handling a substrate includes a conveyor having a plurality of rollers arranged to convey a substrate thereon and a substrate handler. The substrate handler includes a first bracket and a first plurality of fingers extending horizontally from the first bracket. The first plurality of fingers has a substrate support surface and is disposed between adjacent ones of the plurality of rollers. The substrate handler is movable between an idle position having the first plurality of fingers disposed beneath a support elevation of the plurality of rollers, and a transfer position having the first plurality of fingers disposed above the plurality of rollers.

    摘要翻译: 本文提供了基板处理系统的实施例。 在一个实施例中,用于处理衬底的装置包括具有布置成在其上传送衬底的多个辊和衬底处理器的传送器。 衬底处理器包括第一支架和从第一支架水平延伸的第一多个指状物。 第一多个指状物具有基底支撑表面并且设置在多个辊的相邻辊之间。 衬底处理器可在具有设置在多个辊的支撑高度的第一多个指状物的空闲位置之间移动,以及具有设置在多个辊上方的第一多个指状物的转移位置。

    Methods and apparatus for sealing an opening of a processing chamber
    15.
    发明申请
    Methods and apparatus for sealing an opening of a processing chamber 审中-公开
    用于密封处理室的开口的方法和装置

    公开(公告)号:US20060249701A1

    公开(公告)日:2006-11-09

    申请号:US11480615

    申请日:2006-07-03

    IPC分类号: F16K25/00

    摘要: In one embodiment, a slit valve is provided that is adapted to seal an opening and that includes a valve housing having a first wall, a first opening formed in the first wall, a second wall and a second opening formed in the second wall. The slit valve also includes a closure member having a sealing portion adapted to contact the second wall and seal the second opening, and a bracing member moveable relative to the sealing portion and adapted to contact the first wall. The slit valve further includes at least one actuating mechanism adapted to (1) move the sealing portion toward the second wall and into contact with the second wall; and (2) move the bracing member away from the sealing portion and into contact with the first wall so as to brace the sealing portion against the second wall. Numerous other aspects are provided.

    摘要翻译: 在一个实施例中,提供了狭缝阀,其适于密封开口并且包括具有第一壁,形成在第一壁中的第一开口,形成在第二壁中的第二壁和第二开口的阀壳体。 狭缝阀还包括封闭构件,其具有适于接触第二壁并密封第二开口的密封部分,以及可相对于密封部分移动并适于接触第一壁的支撑构件。 狭缝阀还包括至少一个致动机构,其适于(1)将密封部分朝向第二壁移动并与第二壁接触; 和(2)将支撑构件移动离开密封部分并与第一壁接触,以将密封部分支撑在第二壁上。 提供了许多其他方面。

    Electronic device manufacturing chamber and methods of forming the same
    16.
    发明申请
    Electronic device manufacturing chamber and methods of forming the same 审中-公开
    电子器件制造室及其形成方法

    公开(公告)号:US20060201074A1

    公开(公告)日:2006-09-14

    申请号:US11366831

    申请日:2006-03-01

    IPC分类号: E04H6/00

    CPC分类号: H01L21/67236 H01L21/67196

    摘要: In a first aspect, a first multi-piece chamber is provided. The first multi-piece chamber includes (1) a central piece having a first side and a second side; (2) a first side piece adapted to couple with the first side of the central piece; and (3) a second side piece adapted to couple with the second side of the central piece. The central piece, the first side piece and the second side piece form a substantially cylindrical inner chamber region when coupled together. The pieces may each include openings in the top of the pieces and flat mounting surfaces for coupling the pieces together. Numerous other aspects are provided.

    摘要翻译: 在第一方面,提供了第一多件式室。 第一多件式室包括(1)具有第一侧和第二侧的中心件; (2)适于与所述中心件的第一侧联接的第一侧件; 和(3)适于与所述中心件的第二侧联接的第二侧件。 当连接在一起时,中心件,第一侧件和第二侧件形成基本上圆柱形的内室区域。 这些片可以各自包括在片的顶部的开口和用于将片连接在一起的平坦安装表面。 提供了许多其他方面。

    Large substrate test system
    17.
    发明申请
    Large substrate test system 失效
    大基板测试系统

    公开(公告)号:US20060022694A1

    公开(公告)日:2006-02-02

    申请号:US10901936

    申请日:2004-07-29

    IPC分类号: G01R31/26

    摘要: A method and system for testing one or more large substrates are provided. In one or more embodiments, the system includes a testing chamber having a substrate table disposed therein. The substrate table is adapted to move a substrate within the testing chamber in various directions. More particularly, the substrate table includes a first stage movable in a first direction, and a second stage movable in a second direction, wherein each of the stages moves in an X-direction, Y-direction or both X and Y directions. The system further includes a load lock chamber at least partially disposed below the testing chamber, and a transfer chamber coupled to the load lock chamber and the testing chamber. In one or more embodiments, the transfer chamber includes a robot disposed therein which is adapted to transfer substrates between the load lock chamber and the testing chamber.

    摘要翻译: 提供了用于测试一个或多个大基板的方法和系统。 在一个或多个实施例中,系统包括具有设置在其中的衬底台的测试室。 衬底台适于在各个方向上移动测试室内的衬底。 更具体地,衬底台包括可在第一方向上移动的第一阶段和沿第二方向移动的第二阶段,其中每个阶段沿X方向,Y方向或X方向和Y方向两者移动。 该系统还包括至少部分地设置在测试室下方的负载锁定室和耦合到负载锁定室和测试室的传送室。 在一个或多个实施例中,传送室包括设置在其中的机器人,其适于在载荷锁定室和测试室之间传送基板。

    RF current return path for a large area substrate plasma reactor
    18.
    发明授权
    RF current return path for a large area substrate plasma reactor 失效
    用于大面积衬底等离子体反应器的RF电流返回路径

    公开(公告)号:US08062717B2

    公开(公告)日:2011-11-22

    申请号:US11425679

    申请日:2006-06-21

    IPC分类号: H05H1/24

    CPC分类号: H01J37/32082 H01J37/32577

    摘要: An apparatus for providing a return current path for RF current between a chamber wall and a substrate support is provided comprising a low impedance flexible curtain having a first end and a second end, the first end adapted to be electrically connected to the chamber wall and the second end adapted to be connected to the substrate support, wherein the curtain further comprises at least one fold in the curtain material, located an axial distance between the first end and the second end, and at least one perforation cut into the curtain proximate the second end.

    摘要翻译: 提供一种用于在室壁和衬底支撑件之间提供用于RF电流的返回电流路径的装置,其包括具有第一端和第二端的低阻抗柔性帘幕,所述第一端适于电连接到室壁和 第二端适于连接到基板支撑件,其中帘幕还包括帘幕材料中的至少一个折叠部,位于第一端部和第二端部之间的轴向距离处,并且至少一个穿孔切入靠近第二端部的帘幕 结束。

    Substrate conveyor system
    19.
    发明申请
    Substrate conveyor system 失效
    基板输送机系统

    公开(公告)号:US20060280588A1

    公开(公告)日:2006-12-14

    申请号:US11176861

    申请日:2005-07-07

    IPC分类号: B65G1/133 H01L21/677

    摘要: Embodiments of a vacuum conveyor system are provided herein. In one embodiment, apparatus for conveying a substrate includes a vacuum sleeve and a plurality of rollers disposed within the vacuum sleeve for supporting and transporting the substrate thereupon. The plurality of rollers is adapted to simultaneously support the substrate thereupon at a plurality of elevations. A leading edge of the substrate is supported at an elevation above an adjacent one of the plurality of rollers in the direction of travel.

    摘要翻译: 本文提供了真空输送系统的实施例。 在一个实施例中,用于输送基板的装置包括真空套筒和设置在真空套筒内的多个辊,用于在其上支撑和运输基板。 多个辊适于在多个高度处同时支撑基底。 基板的前缘在行进方向上支撑在多个辊中的相邻的一个上方的高度上。

    Linear vacuum deposition system
    20.
    发明申请
    Linear vacuum deposition system 失效
    线性真空沉积系统

    公开(公告)号:US20060278497A1

    公开(公告)日:2006-12-14

    申请号:US11176085

    申请日:2005-07-07

    IPC分类号: B23Q7/00

    摘要: Embodiments of a vacuum conveyor system are provided herein. In one embodiment a vacuum conveyor system includes a first vacuum sleeve having a plurality of rollers that support and move substrates through the first vacuum sleeve. A port is provided for sealably coupling the first vacuum sleeve to a process chamber. A first substrate handler is disposed proximate the port. Multiple ports may be provided for sealably coupling the first vacuum sleeve to a plurality of process chambers. A dedicated substrate handler is provided for each process chamber. A second vacuum sleeve may be sealably coupled to an opposing side of the process chambers. The vacuum conveyor system may be modular with independent modules linked via load lock chambers. The plurality of rollers may compensate for any sag of the leading edge of a substrate being transported thereupon.

    摘要翻译: 本文提供了真空输送系统的实施例。 在一个实施例中,真空输送系统包括具有支撑并移动基板通过第一真空套筒的多个辊的第一真空套筒。 提供端口用于将第一真空套筒密封地联接到处理室。 第一衬底处理器设置在端口附近。 可以提供多个端口用于将第一真空套管密封地联接到多个处理室。 为每个处理室提供专用的基板处理器。 第二真空套筒可以密封地联接到处理室的相对侧。 真空输送系统可以是模块化的,具有通过负载锁定室连接的独立模块。 多个辊可以补偿在其上运送的基板的前缘的任何下垂。