摘要:
An illumination device including a base, a heat dissipation member, an FPC board and a plurality of light-emitting elements is provided. The heat dissipation member is disposed on the base. The heat dissipation member has a center axis and a curved surface. The center axis passes through the base and the curved surface surrounds the center axis. The FPC board is disposed on the curved surface. The light-emitting elements are disposed on the FPC board.
摘要:
An illumination apparatus including a light-emitting unit and a lens module is described. The light-emitting unit is used for generating a light and has a light exit axis. The lens module has a light exit surface with a plurality of curved surfaces. The lens module receives the light and outputs the light from the curved surfaces. Further, the curved surfaces have at least two curvatures, each for adjusting a illumination range of the light output from the corresponding curved surface.
摘要:
The present invention discloses a method for fabricating a light emitting diode (LED) package structure. The method comprises the following steps: a carrier having a substrate and a first protrusion is provided, wherein the first protrusion is disposed on the substrate and has a recess. An adhesion layer and a LED chip are disposed on a bottom of the recess, wherein the adhesion layer is bonded between the carrier and the LED chip, and a ratio between a width of the recess and a width of the LED chip is larger than 1 and smaller than or equal to 1.5 such that a gap existing between a sidewall of the LED chip and an inner sidewall of the recess.
摘要:
A light emitting diode (LED) structure, a manufacturing method thereof and a LED module are provided. The LED structure has temperature sensing function. The LED structure comprises a composite substrate and an LED. The composite substrate comprises a diode structure whose P-type semiconductor region or N-type semiconductor region has a predetermined doping concentration. The diode structure is a temperature sensor, and the sensitivity of the temperature sensor is based on the predetermined doping concentration. The LED is disposed on the composite substrate. The diode structure is used for sensing the heat emitted from the LED.
摘要:
A drive system for an illumination device includes a plurality of LEDs; an extra load; an illumination setting unit, for providing an illumination parameter such as a work cycle; a power supply unit, for providing a DC current; a microprocessor, for receiving the illumination parameter and generating a plurality of drive signals and a compensation signal according to the received illumination parameter; a plurality of first drive units, for driving the LEDs to receive the DC current in the high-level cycle for illumination; and a second drive unit, for receiving the compensation signal and outputting the DC current to the extra load according to the compensation signal.
摘要:
A light-emitting diode (LED) package structure including a carrier substrate, at least one LED chip, an optical element and a thermal-conductive transparent liquid is provided. The LED chip is disposed on the carrier substrate and has an active layer. The optical element is disposed on the substrate and forms a sealed space with the carrier substrate, and the LED chip is disposed in the sealed space. The thermal-conductive transparent liquid fills up the sealed space.
摘要:
A light emitting diode (LED), a fabricating method thereof, and a package structure thereof are provided. The LED includes a substrate, a first semiconductor layer disposed on the substrate, an active layer disposed on the first semiconductor layer, a second semiconductor layer disposed on the active layer, a current distribution modifying layer, a first electrode and a second electrode. The active layer and the second semiconductor layer form a mesa structure and expose a part of the first semiconductor layer. The current distribution modifying layer is disposed on the second semiconductor layer. The first electrode is disposed on and electrically connected to the first semiconductor layer exposed by the mesa structure. The second electrode is disposed on the current distribution modifying layer and is electrically connected to the second semiconductor layer. The LED has superior light emitting efficiency.
摘要:
A light emitting diode (LED) package structure includes a carrier, a first protrusion, a LED chip, and an adhesion layer. The first protrusion is disposed on the carrier and has a first opening to expose the carrier. The LED chip is disposed in the first opening on the carrier, and a ratio between a width of the first opening and a width of the LED chip is 1˜1.5. The adhesion layer is disposed between the LED chip and the carrier to bond the LED chip to the carrier.
摘要:
An optical interactive panel includes a cladding layer, a first waveguide array, a second waveguide array, a first set of image sensor, and a second set of image sensor. The cladding layer has a first index of refraction. The first waveguide array has first waveguide channels formed on the cladding layer, wherein the first waveguide channels have a second index of refraction less than the first index of refraction, and extending at a first direction. The second waveguide array has second waveguide channels, formed on the cladding layer and extending at a second direction. The first set of image sensor detects a first set of light signals from the first waveguide channels to determine a first-direction location. The second set of image sensor detects a second set of light signals from the second waveguide channels to determine a second-direction location.