公开(公告)号：US4255447A

公开(公告)日：1981-03-10

申请号：US65340

申请日：1979-08-09

申请人： Kiyomi Ozawa ,  Shigeru Ishii ,  Mamoru Hayashi ,  Masayoshi Hirose ,  Kiminori Hirata

发明人： Kiyomi Ozawa ,  Shigeru Ishii ,  Mamoru Hayashi ,  Masayoshi Hirose ,  Kiminori Hirata

IPC分类号： C07C253/00 ,  A01N53/00 ,  A01N53/08 ,  C07C67/00 ,  C07C255/39 ,  C07C121/75

CPC分类号： A01N53/00

摘要： Phenylcyclopropane carboxylic acid derivatives having the formula (I) ##STR1## wherein X represents a C.sub.2 -C.sub.10 straight or branched alkyl group, are novel compounds having excellent acaricidal effect.

摘要翻译： 具有式（I）的苯基环丙烷羧酸衍生物（I）其中X表示C2-C10直链或支链烷基，是具有优异杀螨效果的新型化合物。

公开(公告)号：US4425343A

公开(公告)日：1984-01-10

申请号：US267077

申请日：1981-05-26

申请人： Gojyo Sakata ,  Kenji Makino ,  Yasuo Kawamura ,  Jun Sato ,  Kiyomi Ozawa ,  Masayoshi Hirose ,  Kiminori Hirata

发明人： Gojyo Sakata ,  Kenji Makino ,  Yasuo Kawamura ,  Jun Sato ,  Kiyomi Ozawa ,  Masayoshi Hirose ,  Kiminori Hirata

IPC分类号： A01N47/34 ,  C07D215/22 ,  C07D215/227 ,  C07D215/36 ,  C07D241/44 ,  A61K31/47 ,  A61K31/495

CPC分类号： C07D215/227 ,  A01N47/34 ,  C07D215/36 ,  C07D241/44

摘要： This invention relates to a heterocyclic ether or thioether linkage containing urea compounds of the following formula I: ##STR1## wherein B denotes an oxygen atom or a sulfur atom, A denotes CH or a nitrogen atom, X.sup.1 and X.sup.2 denote independently of each other hydrogen atom, halogen atom, trifluoromethyl group or nitro group, Y and Z denote independently of each other hydrogen atom or halogen atom, and P and Q denote independently of each other hydrogen atom, halogen atom, alkoxyl group or alkyl group, a process for producing the same and an insecticide containing the same.

摘要翻译： 本发明涉及含有下式I的脲化合物的杂环醚或硫醚键：其中B表示氧原子或硫原子，A表示CH或氮原子，X1和X2独立地表示 氢原子，卤原子，三氟甲基或硝基，Y和Z彼此独立地表示氢原子或卤素原子，P和Q彼此独立地表示氢原子，卤素原子，烷氧基或烷基， 其制造方法和含有该杀虫剂的杀虫剂。

公开(公告)号：US4504483A

公开(公告)日：1985-03-12

申请号：US408912

申请日：1982-08-17

申请人： Kiyomi Ozawa ,  Masataka Hatanaka ,  Masayoshi Hirose ,  Masaki Kudo

发明人： Kiyomi Ozawa ,  Masataka Hatanaka ,  Masayoshi Hirose ,  Masaki Kudo

IPC分类号： A01N53/04 ,  A01N43/40 ,  A01N53/00 ,  C07D213/64 ,  C07D213/643 ,  C07D213/647

CPC分类号： C07D213/643 ,  A01N43/40 ,  A01N53/00 ,  C07D213/647

摘要： Fluorine substituted pyridine methyl esters having the formula ##STR1## wherein R represents ##STR2## in which X is chlorine or difluoromethoxy; Y is chlorine or tert-butyl; and Z is a halogen atom, are novel compounds which are useful as insecticides and acaricides.

摘要翻译： 氟取代的吡啶甲酯，其具有式（I）其中R表示其中X为氯或二氟甲氧基的X为 Y是氯或叔丁基; Z是卤原子，是可用作杀虫剂和杀螨剂的新型化合物。

公开(公告)号：US06897021B2

公开(公告)日：2005-05-24

申请号：US09820778

申请日：2001-03-30

申请人： Hiroshi Nagasawa ,  Akira Fukunaga ,  Masayoshi Hirose

发明人： Hiroshi Nagasawa ,  Akira Fukunaga ,  Masayoshi Hirose

IPC分类号： C12Q1/68 ,  C40B40/06 ,  C40B60/14 ,  G01N33/543 ,  G01N33/545 ,  G01N33/552 ,  C07H21/04 ,  G01N33/53

CPC分类号： G01N33/54346 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00585 ,  B01J2219/0059 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00608 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00621 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00641 ,  B01J2219/00644 ,  B01J2219/00659 ,  B01J2219/00722 ,  C40B40/06 ,  C40B60/14 ,  G01N33/545 ,  G01N33/552

摘要： A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed.The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier.A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.

公开(公告)号：US20050191699A1

公开(公告)日：2005-09-01

申请号：US11118357

申请日：2005-05-02

申请人： Hiroshi Nagasawa ,  Akira Fukunaga ,  Masayoshi Hirose

发明人： Hiroshi Nagasawa ,  Akira Fukunaga ,  Masayoshi Hirose

IPC分类号： C12Q1/68 ,  C40B40/06 ,  C40B60/14 ,  G01N33/543 ,  G01N33/545 ,  G01N33/552 ,  C12M1/34

CPC分类号： G01N33/54346 ,  B01J2219/00317 ,  B01J2219/00497 ,  B01J2219/00527 ,  B01J2219/00585 ,  B01J2219/0059 ,  B01J2219/00596 ,  B01J2219/00605 ,  B01J2219/00608 ,  B01J2219/0061 ,  B01J2219/00612 ,  B01J2219/00617 ,  B01J2219/00621 ,  B01J2219/00626 ,  B01J2219/0063 ,  B01J2219/00637 ,  B01J2219/00641 ,  B01J2219/00644 ,  B01J2219/00659 ,  B01J2219/00722 ,  C40B40/06 ,  C40B60/14 ,  G01N33/545 ,  G01N33/552

摘要： A reaction probe chip which is prepared by loading a reactive probe on fine pieces of carrier such as particles, tile-like plates and then arraying and immobilizing the reactive probe-loaded carrier on a base material. The carrier fine pieces such as particles, tile-like plates and the like are porous or have a reactive surface, and the base material is preferably a thin inorganic plate or a thin organic plate is disclosed. The inorganic base material is preferably a glass slide or silicon wafer, and the organic base material is preferably a polyester film or polyethylene film. In case the porous carrier pieces are used, the reactivity of the inner surfaces of the porous carrier pores should be maintained during array or immobilization process of the reactive probe-loaded carrier. A composite substrate characterized in that on at least a section of the surface thereof, a plurality of porous regions are orderly arranged as compartments by non-porous regions, or a plurality of non-porous regions are orderly arranged as compartments by porous regions is also disclosed. The porous solid is preferably porous glass or porous ceramic, the porous glass is preferably split-phase porous glass, and the surface is preferably flattened by a process such as polishing.

摘要翻译： 反应探针芯片，其通过将反应性探针载载在诸如颗粒，瓦片状平板的细小载体上，然后将反应性探针负载的载体排列并固定在基材上来制备。 诸如颗粒，瓦片状板等的载体细片是多孔的或具有反应性表面，并且基材优选为薄的无机板或薄的有机板。 无机基材优选为玻璃载玻片或硅晶片，有机基材优选为聚酯膜或聚乙烯膜。 在使用多孔载体片的情况下，多孔载体孔的内表面的反应性应保持在反应性探针负载的载体的阵列或固定过程中。 一种复合基板，其特征在于，在其表面的至少一部分上，多个多孔区域通过非多孔区域有序地布置为隔室，或者多个非多孔区域通过多孔区域有序地布置为隔室也是 披露 多孔固体优选为多孔玻璃或多孔陶瓷，多孔玻璃优选为分相多孔玻璃，优选通过抛光等方法使表面变平。

公开(公告)号：USRE38228E1

公开(公告)日：2003-08-19

申请号：US08789304

申请日：1997-01-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Kiyotaka Kawashima ,  You Ishii

IPC分类号： B24B100

CPC分类号： B24B53/017 ,  B24B37/26

摘要： A turntable with an abrasive cloth mounted thereon and a top ring positioned above the turntable are independently rotatably provided. The top ring holds a workpiece to be polished and presses the workpiece against the abrasive cloth. The turntable and the top ring are rotated to polish the surface of the workpiece to a flat mirror finish on the abrasive cloth. A rotatable brush pressed against the abrasive cloth is rotated about an axis substantially perpendicularly to the plane of the abrasive cloth, and oscillated substantially radially between radially inner and outer positions over the abrasive cloth. A cleaning solution is sprayed from a nozzle onto the abrasive cloth. The turntable has a bank along an outer circumferential edge thereto for preventing a protective solution, which is supplied to the abrasive cloth to keep the abrasive cloth wet and prevent it, from flowing off the turntable when the turntable is stationary.

公开(公告)号：US6102786A

公开(公告)日：2000-08-15

申请号：US234633

申请日：1999-01-21

申请人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

发明人： Masayoshi Hirose ,  Yoshimi Sasaki ,  Akira Ogata ,  Seiji Ishikawa ,  Tamami Takahashi ,  Hirokuni Hiyama ,  Yutaka Wada

IPC分类号： B24B37/005 ,  B24D13/14 ,  H01L21/304 ,  B24B29/02

CPC分类号： B24B37/26 ,  B24B37/042 ,  B24B37/24

摘要： A polishing apparatus includes a turntable with an abrasive cloth mounted on an upper surface thereof, and a top ring disposed above the turntable for supporting a workpiece to be polished and pressing the workpiece against the abrasive cloth under a predetermined pressure. The turntable and the top ring are movable relatively to each other to polish a surface of the workpiece supported by the top ring with the abrasive cloth. The abrasive cloth has a projecting region on a surface thereof for more intensive contact with the workpiece than other surface of the abrasive cloth. The projecting region has a smaller dimension in a radial direction of the turntable than a diameter of the workpiece when the projecting region is held in contact with the workpiece. A position of the projecting region is determined on the basis of an area in which the projecting region acts on the workpiece.

摘要翻译： 抛光装置包括：转盘，其具有安装在其上表面上的研磨布;以及顶环，其设置在所述转台上方，用于支撑待抛光的工件，并在预定压力下将所述工件压靠所述研磨布。 转盘和顶环彼此相对移动，用研磨布抛光由顶环支撑的工件的表面。 研磨布在其表面上具有突出区域，用于与研磨布的其它表面更加紧密地接触工件。 当突出区域与工件保持接触时，突出区域在转台的径向上具有比工件的直径更小的尺寸。 基于突出区域作用在工件上的区域来确定突出区域的位置。

公开(公告)号：US5716264A

公开(公告)日：1998-02-10

申请号：US683424

申请日：1996-07-18

申请人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

发明人： Norio Kimura ,  Ritsuo Kikuta ,  You Ishii ,  Masayoshi Hirose

IPC分类号： B24B37/00 ,  B24B53/007 ,  B24B21/18

CPC分类号： B24B53/017

摘要： A polishing apparatus is employed to polish an object to be polished by urging the surface of the object to be polished against the surface of a polishing cloth and causing a relative movement therebetween, while supplying a polishing liquid into an area between the object to be polished and the polishing cloth. A plurality of nozzles spray respective fluid jets to strike against the surface of the cloth. The plurality of nozzles include more than one type of nozzle which vary flow velocity, flow rate, angle of spray, and cross-sectional configuration of a jet. The plurality of nozzles have axes positioned at a location at different distances from the rotation axis of the polishing cloth.

摘要翻译： 抛光装置用于通过将待抛光物体的表面推压在抛光布的表面上并在其之间相对移动，同时将抛光液体提供到待抛光对象之间的区域中来抛光待抛光物体 和抛光布。 多个喷嘴喷射相应的流体射流以抵靠布的表面。 多个喷嘴包括不止一种类型的喷嘴，其改变流速，流速，喷射角度和射流的横截面构造。 多个喷嘴具有位于与抛光布的旋转轴线不同的距离处的轴线。

公开(公告)号：US5643056A

公开(公告)日：1997-07-01

申请号：US550117

申请日：1995-10-30

申请人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

发明人： Masayoshi Hirose ,  Seiji Ishikawa ,  Norio Kimura ,  Yoshimi Sasaki ,  Kouki Yamada ,  Fujio Aoyama ,  Noburu Shimizu ,  Katsuya Okumura

IPC分类号： B24B7/22 ,  B24B29/02 ,  B24B37/07 ,  B24B37/10 ,  H01L21/304 ,  B24B1/00

CPC分类号： B24B7/228 ,  B24B29/02 ,  B24B37/04

摘要： A drum-type polishing apparatus for producing a flat mirror polish on an object such as a semiconductor wafer, is capable of three degrees of freedom of movement of a drum member with respect to the wafer. The relative movements can be made, successively or simultaneously, at right angles to an axis of the drum, parallel to the surface of the wafer, as well as at any desired angular orientations. Combined with a follower device to provide automatic compensation for unevenness in pressing pressure applied to the wafer during polishing, the polishing apparatus offers outstanding uniformity in polishing quality and high productivity, even for large diameter wafers, with a comparatively modest investment in both facility space and equipment cost.

摘要翻译： 用于在诸如半导体晶片的物体上制造平面镜抛光的滚筒式抛光装置能够使鼓构件相对于晶片具有三个自由度的移动。 相对运动可以连续或同时地与滚筒的轴线成直角，平行于晶片的表面以及任何期望的角度取向。 结合跟随装置，为抛光期间对晶片施加的压力压力的不均匀性提供自动补偿，抛光装置即使对于大直径晶片也具有优异的抛光质量均匀性和高生产率，在设备空间和 设备成本

公开(公告)号：US5616063A

公开(公告)日：1997-04-01

申请号：US309193

申请日：1994-09-20

申请人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

发明人： Katsuya Okumura ,  Riichirou Aoki ,  Hiromi Yajima ,  Masako Kodera ,  Shirou Mishima ,  Atsushi Shigeta ,  Masayoshi Hirose ,  Norio Kimura ,  Seiji Ishikawa

IPC分类号： H01L21/302 ,  B08B1/04 ,  B24B27/00 ,  B24B37/04 ,  B24B37/34 ,  B24B51/00 ,  B24B55/12 ,  H01L21/00 ,  H01L21/677 ,  B24B49/00

CPC分类号： H01L21/67167 ,  B08B1/04 ,  B08B13/00 ,  B24B27/0023 ,  B24B37/04 ,  B24B37/345 ,  B24B51/00 ,  B24B55/12 ,  H01L21/67028 ,  H01L21/67046 ,  H01L21/67057 ,  H01L21/67161 ,  H01L21/67219 ,  H01L21/67745

摘要： A polishing apparatus is a cluster type of apparatus having a plurality of units which perform various operations. The polishing apparatus includes a universal transfer robot having at least one arm for transferring a workpiece, a plurality of units disposed around the universal transfer robot and including a loading unit for receiving the workpiece to be polished, at least one polishing unit for polishing the workpiece, at least one washing unit for washing the workpiece which has been polished and an unloading unit for receiving the cleaned workpiece. Discrete mechanisms respectively transfer a clean workpiece and a dirty workpiece amongst the units.

摘要翻译： 抛光装置是具有执行各种操作的多个单元的集群类型的装置。 抛光装置包括具有用于传送工件的至少一个臂的通用传送机器人，设置在通用传送机器人周围的多个单元，并且包括用于接收被抛光工件的装载单元，用于抛光工件的至少一个抛光单元 至少一个用于清洗已经被抛光的工件的洗涤单元和用于接收清洁的工件的卸载单元。 离散机构分别在单元之间传送清洁的工件和脏工件。