公开(公告)号：US20080007939A1

公开(公告)日：2008-01-10

申请号：US11822331

申请日：2007-07-05

申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

IPC分类号： G09F13/04

CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。

公开(公告)号：USD512694S1

公开(公告)日：2005-12-13

申请号：US29220220

申请日：2004-12-27

申请人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

设计人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

公开(公告)号：US08168453B2

公开(公告)日：2012-05-01

申请号：US12370802

申请日：2009-02-13

申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

IPC分类号： H01L21/56

CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

公开(公告)号：US07790482B2

公开(公告)日：2010-09-07

申请号：US12370194

申请日：2009-02-12

申请人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

发明人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

IPC分类号： H01L21/00

CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

公开(公告)号：US07687292B2

公开(公告)日：2010-03-30

申请号：US12153719

申请日：2008-05-23

申请人： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

发明人： Jung Kyu Park ,  Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

IPC分类号： H01L21/56

CPC分类号： H01L33/60 ,  H01L24/97 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73204 ,  H01L2924/12041 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00014 ,  H01L2924/00

摘要： The invention relates to an LED package having a metal reflective layer for focusing and emitting light through a side of the package, and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, a light emitting diode chip disposed on the substrate, and an encapsulant covering the LED chip and the substrate to protect the LED chip. The LED package also includes a metal reflective layer surrounding side surfaces of the encapsulant to form a light transmitting surface on a top surface of the encapsulant. The invention minimizes light loss, improves luminance, can be mass-produced as a PCB type, and adopts EMC transfer molding to minimize irregular color distribution, thereby improving optical quality.

摘要翻译： 本发明涉及一种具有用于聚焦并通过封装侧发光的金属反射层的LED封装及其制造方法。 LED封装包括其上形成有电极的基板，设置在基板上的发光二极管芯片以及覆盖LED芯片和基板的密封剂以保护LED芯片。 LED封装还包括围绕密封剂的侧表面的金属反射层，以在密封剂的顶表面上形成透光表面。 本发明使光损失最小化，亮度提高，可以作为PCB类型批量生产，并采用EMC传递模塑，以减少不规则的颜色分布，从而提高光学质量。

公开(公告)号：US20100047941A1

公开(公告)日：2010-02-25

申请号：US12612268

申请日：2009-11-04

申请人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yoen Han ,  Dae Yeon Kim ,  Young Sam Park

发明人： Seon Goo Lee ,  Hun Joo Hahm ,  Jung Kyu Park ,  Kyung Taeg Han ,  Seong Yoen Han ,  Dae Yeon Kim ,  Young Sam Park

IPC分类号： H01L21/50

CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/58 ,  H01L2224/48091 ,  H01L2924/00014

摘要： An LED diode package includes a heat connecting part for mounting a light emitting part on an upper surface thereof, frames electrically connected to the light emitting part while holding the heat connecting part and a molded part fixing the heat connecting part and the frames together. The light emitting part generates light in response to current applied thereto, and the upper surface of the heat connecting part is protruded beyond an upper surface of the molded part to a predetermined height. This can optimize the unique beam angle of the light source thereby to maximize lighting efficiency as well as prevent overflow of the encapsulating material in the assembling process of the lens, which may otherwise soil adjacent components.

摘要翻译： LED二极管封装包括用于在其上表面上安装发光部分的热连接部分，同时保持热连接部分电连接到发光部分的框架和将热连接部分和框架固定在一起的模制部件。 发光部分响应于施加到其上的电流产生光，并且热连接部分的上表面超过模制部件的上表面突出到预定高度。 这可以优化光源的唯一光束角度，从而使照明效率最大化，并且防止在透镜的组装过程中封装材料的溢出，否则可能会污染相邻的部件。

公开(公告)号：US07462871B2

公开(公告)日：2008-12-09

申请号：US11497232

申请日：2006-08-02

申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Jong Uk Park ,  Chang Wook Kim

IPC分类号： H01L27/15

CPC分类号： H01L25/167 ,  H01L33/486 ,  H01L2224/48091 ,  H01L2224/48247 ,  Y10S257/918 ,  H01L2924/00014

摘要： In a side view LED, elongated first and second lead frames each have a finger extending therefrom. The finger of the first lead frame is disposed in parallel with that of the second lead frame. An LED chip and a protective device are mounted on mounting areas of the first and second lead frames, respectively and electrically connected to the first and second lead frames. A package body houses the first and second lead frames to form first and second opened areas. The first opened area is externally opened around the LED chip, the second opened area is externally opened around the protective device, and the partition wall is formed therebetween. First and second encapsulants are provided to the first and second opened areas, respectively to encapsulate the LED chip and protective device, respectively. At least the first encapsulant is transparent.

摘要翻译： 在侧视图LED中，细长的第一和第二引线框架各自具有从其延伸的指状物。 第一引线框架的指状物与第二引线框架的手指平行设置。 LED芯片和保护装置分别安装在第一和第二引线框架的安装区域上，并且电连接到第一引线框架和第二引线框架。 包装体容纳第一和第二引线框架以形成第一和第二开放区域。 第一开放区域围绕LED芯片外部打开，第二开放区域在保护装置周围被外部打开，并且间隔壁形成在其间。 第一和第二密封剂分别提供给第一和第二开放区域以分别封装LED芯片和保护装置。 至少第一密封剂是透明的。

公开(公告)号：US07458703B2

公开(公告)日：2008-12-02

申请号：US11488067

申请日：2006-07-18

申请人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

发明人： Kyung Taeg Han ,  Myoung Soo Choi ,  Seon Goo Lee ,  Seong Yeon Han ,  Hun Joo Hahm ,  Chang Ho Song

IPC分类号： F21V7/00

CPC分类号： H01L33/58 ,  G02B19/0028 ,  G02B19/0061 ,  G02B19/0071 ,  H01L33/60 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/48247 ,  H01L2924/3025 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2924/00

摘要： An LED package having a dual structure for lateral emission of light includes an LED chip, a lower structure, a lower lens and an upper lens. The lower structure includes a pair of electric connection parts, a package body, and a transparent encapsulant filled in the recess of the package body to seal the LED chip. The upper-hemispheric lower lens is fixed to an upper part of the lower structure with a bottom part thereof attached to an upper surface of the transparent encapsulant. The funnel-shaped upper lens is fixed to an upper end of the lower lens, and includes an axially symmetrical reflecting surface for laterally reflecting light from the lower lens, and an emitting surface for laterally emitting light reflected from the reflecting surface. The upper lens and the lower lens are separately molded and combined together to easily manufacture and efficiently install the LED package.

摘要翻译： 具有用于光的横向发射的双重结构的LED封装包括LED芯片，下部结构，下部透镜和上部透镜。 下部结构包括一对电连接部分，封装主体和填充在封装体的凹部中的透明密封剂，以密封LED芯片。 上半球下透镜固定到下结构的上部，其下部附接到透明密封剂的上表面。 漏斗状上透镜固定在下透镜的上端，并且包括用于横向反射来自下透镜的光的轴对称反射表面和用于横向发射从反射表面反射的光的发射表面。 上透镜和下透镜分别模制并组合在一起以容易地制造和有效地安装LED封装。

公开(公告)号：US07208772B2

公开(公告)日：2007-04-24

申请号：US11186971

申请日：2005-07-22

申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

IPC分类号： H01L29/22 ,  H01L23/48

CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/642 ,  H01L2224/16245 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/12041 ,  H01L2924/1815 ,  H01L2224/0401

摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并且具有用于传送的传热部 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

公开(公告)号：USD512029S1

公开(公告)日：2005-11-29

申请号：US29220264

申请日：2004-12-28

申请人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han

设计人： Chang Wook Kim ,  Seon Goo Lee ,  Kyung Taeg Han