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11.发明申请Valve actuation apparatus for internal combustion engine and method of adjusting lift thereof 失效用于内燃机的气门致动装置及其升程调节方法公开(公告)号：US20050028769A1
公开(公告)日：2005-02-10
申请号：US10899074
申请日：2004-07-27
Applicant: Tamotsu Todo , Yoshihiko Yamada , Yusuke Takagi
Inventor： Tamotsu Todo , Yoshihiko Yamada , Yusuke Takagi
CPC classification number: F01L13/0026 , F01L1/022 , F01L2013/0073 , F01L2103/00 , Y10T74/2102 , Y10T74/2107
Abstract: A VA apparatus includes a rocker arm coaxially swingably supported on a support shaft. The rocker arm is swung by torque transmitted from an engine to operate an engine valve and includes a first arm to which torque is transmitted and a second arm for operating the engine valve. The first and second arms are separate and distinct from each other, and are swingable relative to each other. Bolts are provided to fix the first and second arms in a predetermined relative angle position.
Abstract translation: VA装置包括同轴可摆动地支撑在支撑轴上的摇臂。 摇臂通过从发动机传递的扭矩摆动，以操作发动机气门，并且包括传递扭矩的第一臂和用于操作发动机气门的第二臂。 第一和第二臂彼此分离并且彼此不同，并且可相对于彼此摆动。 提供螺栓以将第一和第二臂固定在预定的相对角度位置。
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公开(公告)号：US4721388A
公开(公告)日：1988-01-26
申请号：US784501
申请日：1985-10-04
Applicant: Yusuke Takagi , Yoshio Kojima , Kazuo Moriguti , Tsunehiko Takakusagi
Inventor： Yusuke Takagi , Yoshio Kojima , Kazuo Moriguti , Tsunehiko Takakusagi
CPC classification number: G01B11/005
Abstract: This invention relates to a method of measuring the shape of an object in a non-contacting manner. The method comprises the steps of providing reference points on the object, the coordinates of which are known in an object coordinate system for expressing the shape of the object; applying a light spot on the reference points while moving a light spot detecting sensor to determine the coordinate values in a measuring coordinate system; determining the relative positional relation between the two coordinate systems by using coordinate values thus determined and the coordinate values in the object coordinate system; measuring points on the object to measure the shape of the object; and comparing the coordinate values, relating to shape of the object and determined in the measuring coordinate system, with reference values which are design values modulated with the relative positional value and converted into coordinate values in the measuring coordinate system in an arithmetic control unit, whereby a manufacturing error of said object is measured.
Abstract translation: 本发明涉及以非接触方式测量物体的形状的方法。 该方法包括以下步骤：在物体上提供参考点，其坐标在对象坐标系中已知，用于表示物体的形状; 在移动光点检测传感器的同时在参考点上施加光斑以确定测量坐标系中的坐标值; 通过使用如此确定的坐标值和对象坐标系中的坐标值来确定两个坐标系之间的相对位置关系; 物体上的测量点来测量物体的形状; 并且将与测量坐标系中确定的物体的形状相关的坐标值与作为在相对位置值调制的设计值的参考值进行比较，并将其转换为算术控制单元中的测量坐标系中的坐标值，由此 测量所述物体的制造误差。
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公开(公告)号：US08659130B2
公开(公告)日：2014-02-25
申请号：US13640512
申请日：2011-04-26
Applicant: Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
Inventor： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
IPC: H01L23/62
CPC classification number: H01L23/3675 , H01L23/4093 , H01L23/4334 , H01L23/473 , H01L24/34 , H01L25/162 , H01L25/18 , H01L2224/32245 , H01L2224/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/209 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
Abstract translation: 电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料， 所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。 壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成 辐射板。 中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。 密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。
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公开(公告)号：US20130062751A1
公开(公告)日：2013-03-14
申请号：US13640512
申请日：2011-04-26
Applicant: Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
Inventor： Yusuke Takagi , Kaoru Uchiyama , Tokihito Suwa , Kinya Nakatsu , Takeshi Tokuyama , Shinji Hiramitsu
CPC classification number: H01L23/3675 , H01L23/4093 , H01L23/4334 , H01L23/473 , H01L24/34 , H01L25/162 , H01L25/18 , H01L2224/32245 , H01L2224/33 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2224/83801 , H01L2224/84801 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K7/209 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
Abstract: A power module includes: a sealing body including a semiconductor element having a plurality of electrode surfaces, a first conductor plate connected to one electrode surface of the semiconductor element via solder, and a sealing material for sealing the semiconductor element and the first conductor plate, the sealing body having at least a first surface and a second surface on the opposite side of the first surface; and a case for housing the sealing body. The case is configured by a first heat radiation plate opposed to the first surface of the sealing body, a second heat radiation plate opposed to the second surface of the sealing body, and an intermediate member that connects the first heat radiation plate and the second heat radiation plate. The intermediate member has a first thin section having thickness smaller than the thickness of the first heat radiation plate, more easily elastically deformed than the first heat radiation plate, and formed to surround the first heat radiation plate. The sealing body is pressed against and fixed to the second heat radiation plate via the first heat radiation plate by elastic force generated in the first thin section.
Abstract translation: 电源模块包括：密封体，包括具有多个电极表面的半导体元件，通过焊料连接到半导体元件的一个电极表面的第一导体板和用于密封半导体元件和第一导体板的密封材料， 所述密封体具有在所述第一表面的相对侧上的至少第一表面和第二表面; 以及用于容纳密封体的壳体。 壳体由与密封体的第一面相对的第一散热板，与密封体的第二面相对的第二散热板，以及将第一散热板和第二热连接的中间部件构成 辐射板。 中间构件具有厚度小于第一散热板的厚度的第一薄部分，比第一散热板更容易弹性变形，并且形成为围绕第一散热板。 密封体经由第一散热板通过在第一薄部分中产生的弹力被压靠并固定到第二散热板。
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公开(公告)号：US20120211266A1
公开(公告)日：2012-08-23
申请号：US13397867
申请日：2012-02-16
Applicant: Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
Inventor： Akira Harao , Mototatsu Matsunaga , Yusuke Takagi , Akinori Saneto
CPC classification number: H05K3/445 , H05K1/0366 , H05K1/056 , H05K3/325 , H05K2201/1059 , H05K2201/1081
Abstract: The present invention is to provide a wiring board which can prevent whitening. The wiring board is made of a fiber reinforced resin plate, and has a through hole and a whitening prevention portion. The whitening prevention portion is made only with matrix resin forming the fiber reinforced resin plate, and is integrally formed in the fiber reinforced resin plate. Furthermore, the whitening prevention portion is arranged around the through hole.
Abstract translation: 本发明提供一种可防止白化的布线板。 布线板由纤维增强树脂板制成，具有通孔和防止白化部分。 美白防止部仅由形成纤维增强树脂板的基质树脂制成，并且一体地形成在纤维增强树脂板中。 此外，防止白化部分围绕通孔布置。
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Patent Agency Ranking
公开(公告)号：USD651170S1
公开(公告)日：2011-12-27
申请号：US29354621
申请日：2010-01-27
Applicant: Masashi Yura , Shinichi Fujino , Yusuke Takagi , Toshiya Satoh , Kinya Nakatsu , Takeshi Tokuyama
Designer： Masashi Yura , Shinichi Fujino , Yusuke Takagi , Toshiya Satoh , Kinya Nakatsu , Takeshi Tokuyama
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公开(公告)号：US20110299265A1
公开(公告)日：2011-12-08
申请号：US12920296
申请日：2009-10-30
Applicant: Kinya Nakatsu , Hiroshi Hozoji , Takeshi Tokuyama , Yusuke Takagi , Toshiya Satoh , Taku Oyama , Takanori Ninomiya
Inventor： Kinya Nakatsu , Hiroshi Hozoji , Takeshi Tokuyama , Yusuke Takagi , Toshiya Satoh , Taku Oyama , Takanori Ninomiya
IPC: H05K7/00
CPC classification number: H02M7/003 , B60L11/14 , B60L11/18 , B60L11/1803 , B60L2200/26 , B60L2210/40 , H01L21/4882 , H01L23/36 , H01L23/473 , H01L24/33 , H01L25/072 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H02M7/44 , H02M7/5395 , H02M2001/327 , H02P27/08 , H05K7/20409 , H05K7/205 , H05K7/209 , H05K7/20927 , Y02T10/70 , Y02T10/7005 , Y02T10/7077 , H01L2924/00 , H01L2924/00012
Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.
Abstract translation: 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面相互面对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其设置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚性或厚度小于基板的刚度或厚度。
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公开(公告)号：US06877466B2
公开(公告)日：2005-04-12
申请号：US10780656
申请日：2004-02-19
Applicant: Shigeki Shindou , Masaki Toriumi , Yusuke Takagi
Inventor： Shigeki Shindou , Masaki Toriumi , Yusuke Takagi
CPC classification number: F01L13/0036 , F01L1/024 , F01L1/34 , F01L2001/0537 , F01L2800/00 , F02B75/22
Abstract: A variable valve operating system for a two-bank engine includes a variable valve-lift and working-angle control mechanism changing at least one of a valve lift and a working angle of each of engine valves arranged in each of cylinder banks, and two variable valve timing control mechanisms provided for each of the banks for changing valve timings independently of each other. A control unit responds a failure in one of the variable valve timing control mechanisms for failsafe purposes. The control unit includes a failsafe section capable of executing a failsafe operating mode in which at least one of the valve lift and the working angle of each of engine valves is increasingly compensated for by the variable valve-lift and working-angle control mechanism, when the one variable valve timing control mechanism is failed.
Abstract translation: 用于双排发动机的可变气门操作系统包括可变气门升程和工作角度控制机构，其改变布置在每个气缸组中的每个发动机气门的气门升程和工作角度中的至少一个， 为每个组提供的气门正时控制机构用于彼此独立地改变气门正时。 控制单元在故障安全目的的可变气门正时控制机构之一中作出故障。 控制单元包括能够执行故障保护操作模式的故障保护部分，其中通过可变气门升程和工作角度控制机构来逐渐补偿每个发动机气门的气门升程和工作角度中的至少一个， 一个可变气门正时控制机构失效。
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公开(公告)号：US08946567B2
公开(公告)日：2015-02-03
申请号：US12920296
申请日：2009-10-30
Applicant: Kinya Nakatsu , Hiroshi Hozoji , Takeshi Tokuyama , Yusuke Takagi , Toshiya Satoh , Taku Oyama , Takanori Ninomiya
Inventor： Kinya Nakatsu , Hiroshi Hozoji , Takeshi Tokuyama , Yusuke Takagi , Toshiya Satoh , Taku Oyama , Takanori Ninomiya
CPC classification number: H02M7/003 , B60L11/14 , B60L11/18 , B60L11/1803 , B60L2200/26 , B60L2210/40 , H01L21/4882 , H01L23/36 , H01L23/473 , H01L24/33 , H01L25/072 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/351 , H02M7/44 , H02M7/5395 , H02M2001/327 , H02P27/08 , H05K7/20409 , H05K7/205 , H05K7/209 , H05K7/20927 , Y02T10/70 , Y02T10/7005 , Y02T10/7077 , H01L2924/00 , H01L2924/00012
Abstract: A power module and a power converter device including the power module include: two base plates with their main surfaces facing each other; a semiconductor circuit unit disposed between the two base plates; a connecting member that is connected to the two base plates and forms a housing region in which the semiconductor circuit unit is housed; and an insulating member that is placed between the base plate and the semiconductor circuit unit and secures electrical insulation of the base plate and the semiconductor circuit unit. A rigidity or thickness of the connecting member is less than a rigidity or thickness of the base plate.
Abstract translation: 包括功率模块的功率模块和功率转换器装置包括：两个基板，它们的主表面相互面对; 设置在所述两个基板之间的半导体电路单元; 连接构件，其连接到所述两个基板并形成容纳所述半导体电路单元的壳体区域; 以及绝缘构件，其设置在所述基板和所述半导体电路单元之间，并且确保所述基板和所述半导体电路单元的电绝缘。 连接构件的刚性或厚度小于基板的刚度或厚度。
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公开(公告)号：US20140369014A1
公开(公告)日：2014-12-18
申请号：US14363208
申请日：2012-08-22
Applicant: Yusuke Takagi
Inventor： Yusuke Takagi
CPC classification number: H05K1/183 , H05K1/05 , H05K1/056 , H05K1/11 , H05K1/182 , H05K2201/09472 , H05K2201/09745 , H05K2201/09972 , H05K2201/10439 , H05K2203/0169 , H05K2203/0323
Abstract: A wiring board comprises a base substrate that is a metal core substrate, and including an opening in which an interior component that is an electric component or an electronic component is to be mounted, and a terminal placement section on which a terminal of the interior component is to be mounted, the terminal placement section being formed around the opening of the base substrate, and inwardly recessed from a surface of the base substrate so that a part of the interior component is to be placed within the opening.
Abstract translation: 布线板包括作为金属芯基板的基底基板，并且包括其中将要安装作为电气部件或电子部件的内部部件的开口，以及端子放置部，其内部部件的端子 将要安装的端子放置部分围绕基底基板的开口形成，并且从基底基板的表面向内凹入，使得内部部件的一部分被放置在开口内。
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