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    MIXED-TECHNOLOGY COMBINATION OF PROGRAMMABLE ELEMENTS
    13.
    发明申请
    MIXED-TECHNOLOGY COMBINATION OF PROGRAMMABLE ELEMENTS 有权
    混合技术组合可编程元件

    公开(公告)号：US20130314175A1

    公开(公告)日：2013-11-28

    申请号：US13873964

    申请日：2013-04-30

    Applicant: Wispry, Inc.

    Inventor： Arthur S. Morris, III

    IPC: H03H7/01

    CPC classification number: H03J5/0209 ,  B81B7/008 ,  B81B2201/01 ,  B81B2207/053 ,  B81C1/00238 ,  B81C2203/0785 ,  H01L23/5223 ,  H01L27/0688 ,  H01L28/40 ,  H01L28/60 ,  H01L2924/0002 ,  H03J2200/10 ,  Y10T29/49105 ,  H01L2924/00

    Abstract: The present subject matter relates to systems and methods for arranging and controlling programmable combinations of tuning elements in which more than one form of switching technology is combined in a single array. Specifically, such an array can include one or more first switchable elements including a first switching technology (e.g., one or more solid-state-controlled devices) and one or more second switchable elements including a second switching technology that is different than the first switching technology (e.g., one or more micro-electro-mechanical capacitors). The one or more first switchable elements and the one or more second switchable elements can be configured, however, to deliver a combined variable reactance.

    Abstract translation: 本主题涉及用于布置和控制调谐元件的可编程组合的系统和方法，其中多个形式的开关技术组合在单个阵列中。 具体地，这样的阵列可以包括一个或多个第一可切换元件，包括第一切换技术（例如，一个或多个固态控制设备）和一个或多个第二可切换元件，其包括与第一开关不同的第二开关技术 技术（例如，一个或多个微电机电容器）。 然而，可以配置一个或多个第一可切换元件和一个或多个第二可切换元件以传递组合的可变电抗。

    Micro-electromechanical varactor with enhanced tuning range
    16.
    发明授权
    Micro-electromechanical varactor with enhanced tuning range 有权
    具有增强调谐范围的微机电变容二极管

    公开(公告)号：US06696343B1

    公开(公告)日：2004-02-24

    申请号：US10459978

    申请日：2003-06-12

    Applicant: Anil K. Chinthakindi ,  Robert A. Groves ,  Kenneth J. Stein ,  Seshadri Subbanna ,  Richard P. Volant

    Inventor： Anil K. Chinthakindi ,  Robert A. Groves ,  Kenneth J. Stein ,  Seshadri Subbanna ,  Richard P. Volant

    IPC: H01L2120

    CPC classification number: H01G5/18 ,  B81B2201/01 ,  H01G5/011 ,  Y10S257/924

    Abstract: A three-dimensional micro- electromechanical (MEM) varactor is described wherein a movable beam and fixed electrode are respectively fabricated on separate substrates coupled to each other. The movable beam with comb-drive electrodes are fabricated on the “chip side” while the fixed bottom electrode is fabricated on a separated substrate “carrier side”. Upon fabrication of the device on both surfaces of the substrate, the chip side device is diced and “flipped over”, aligned and joined to the “carrier” substrate to form the final device. Comb-drive (fins) electrodes are used for actuation while the motion of the electrode provides changes in capacitance. Due to the constant driving forces involved, a large capacitance tuning range can be obtained. The three dimensional aspect of the device avails large surface area. When large aspect ratio features are provided, a lower actuation voltage can be used. Upon fabrication, the MEMS device is completely encapsulated, requiring no additional packaging of the device. Further, since alignment and bonding can be done on a wafer scale (wafer scale MEMS packaging), an improved device yield can be obtained at a lower cost.

    Abstract translation: 描述了三维微机电（MEM）变容二极管，其中可移动光束和固定电极分别制造在彼此耦合的分开的基板上。 具有梳状驱动电极的可移动光束在“芯片侧”上制造，而固定底部电极制造在分离的基板“载体侧”上。 在衬底的两个表面上制造器件时，芯片侧器件被切割并“翻转”，对准并接合到“载体”衬底以形成最终器件。 梳状驱动（鳍）电极用于致动，同时电极的运动提供电容的变化。 由于所涉及的驱动力恒定，可以获得大的电容调谐范围。 该装置的三维方面具有较大的表面积。 当提供大的纵横比特征时，可以使用较低的致动电压。 在制造时，MEMS器件被完全封装，不需要额外的器件封装。 此外，由于可以在晶片规模（晶片级MEMS封装）上进行取向和接合，所以可以以更低的成本获得改进的器件产量。

    System for protecting mems product under ESD event
    17.
    发明授权
    System for protecting mems product under ESD event 有权

    公开(公告)号：US11802040B2

    公开(公告)日：2023-10-31

    申请号：US17151654

    申请日：2021-01-18

    Applicant: AAC Technologies (Nanjing) Co., Ltd.

    Inventor： David Molinero Giles

    IPC: B81B7/00 ,  B81B3/00

    CPC classification number: B81B7/0022 ,  B81B3/0086 ,  B81B7/0064 ,  B81B2201/01

    Abstract: The present invention discloses a system for protecting a MEMS product from an ESD event, including, a control circuit; a MEMS product, electrically connected with the control circuit; an ESD protection device, electrically connected with the control circuit, and electrically connected with the MEMS product in parallel; wherein, the ESD protection device comprises: a top electrode assembly electrically connected with the control circuit; a flexible beam comprising a first electrode layer electrically connected with the control circuit, a second electrode layer electrically connected with the MEMS product, and a moving metal contact electrically connected with the second electrode layer; a bottom electrode assembly having a bottom electrode layer electrically connected with the MEMS product and a fixed metal contact electrically connected with the bottom electrode layer and facing the moving metal contact.

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