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公开(公告)号:US20180019754A1
公开(公告)日:2018-01-18
申请号:US15209875
申请日:2016-07-14
Applicant: Murata Manufacturing Co., Ltd.
Inventor: VILLE KAAJAKARI
CPC classification number: H03L1/04 , H03B5/30 , H03H9/02 , H03H9/02102 , H03H9/02448 , H03H9/08 , H03L1/028
Abstract: An oven controlled MEMS timing device that includes a very small oscillator that can be heated very rapidly with very low power. The MEMS device includes a rectangular frame, a heated platform positing in the frame, and a pair of support beams that extend from the rectangular frame and hold the platform within a cavity of the frame to thermally isolate the platform. Moreover, the device includes a resonator attached to the platform by a pair of anchor beams, a heater that heats the platform to maintain a target temperature for the resonator and a thermistor that measures a temperature of the platform to provide a control loop for the heater.
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公开(公告)号:US20170373693A1
公开(公告)日:2017-12-28
申请号:US15631857
申请日:2017-06-23
Applicant: SEIKO EPSON CORPORATION
Inventor: Manabu KONDO
IPC: H03L1/04
CPC classification number: H03L1/04 , H01L2224/48091 , H01L2924/16195 , H03B5/1203 , H03B5/1847 , H03H9/02102 , H03H9/08 , H03L1/028 , H01L2924/00014
Abstract: An oscillator includes a first package, an oscillation element housed in the first package, a first temperature controller housed in the first package, a second package adapted to house the first package, and a second temperature controller disposed outside the first package, and housed in the second package.
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公开(公告)号:US09838022B2
公开(公告)日:2017-12-05
申请号:US15406506
申请日:2017-01-13
Applicant: LAPIS Semiconductor Co., Ltd.
Inventor: Kazuya Yamada , Toshihisa Sone , Akihiro Takei , Yuichi Yoshida , Kengo Takemasa
CPC classification number: H03L1/026 , G01R1/44 , G01R21/00 , G01R22/061 , G01R22/10 , G01R35/04 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H03K3/011 , H03L1/02 , H03L1/027 , H03L1/04 , H01L2924/00 , H01L2224/45099
Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
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公开(公告)号:US20170279452A1
公开(公告)日:2017-09-28
申请号:US15462165
申请日:2017-03-17
Applicant: SEIKO EPSON CORPORATION
Inventor: Kenji HAYASHI
CPC classification number: H03L1/026 , H01L27/20 , H03B5/32 , H03B5/362 , H03B5/366 , H03J7/08 , H03L1/023 , H03L1/04
Abstract: An oscillator includes an oscillation circuit, an operation state signal generation circuit that generates an operation state signal based on an operation state of the oscillation circuit, and a first integrated circuit, the oscillation circuit and the operation state signal generation circuit are disposed outside the first integrated circuit, and the first integrated circuit includes a first digital interface circuit, a D/A conversion circuit that converts a digital signal input via the first digital interface circuit into an analog signal to generate a frequency control signal that controls a frequency of the oscillation circuit, and a terminal to which the operation state signal is input.
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公开(公告)号:US20170272082A1
公开(公告)日:2017-09-21
申请号:US15450370
申请日:2017-03-06
Applicant: SEIKO EPSON CORPORATION
Inventor: Naohisa OBATA , Takuya OWAKI
CPC classification number: H03L1/04 , H01L2224/48091 , H01L2924/16195 , H03B1/02 , H03B5/32 , H03B2201/038 , H03L1/026 , H01L2924/00014
Abstract: A temperature-compensated oscillator includes a resonator element, an oscillating circuit, and a temperature compensation circuit, and a frequency deviation with respect to a frequency at a time point when power supply starts is within a range of ±8 ppb at a time point when 10 seconds elapse from when the power supply starts, within a range of ±10 ppb at a time point when 20 seconds elapse from when the power supply starts, and within a range of ±10 ppb at a time point when 30 seconds elapse from when the power supply starts.
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公开(公告)号:US20170220918A1
公开(公告)日:2017-08-03
申请号:US15418719
申请日:2017-01-28
Applicant: NXP B.V.
Inventor: Robert Entner
IPC: G06K19/077 , H03L1/04
CPC classification number: G06K19/0772 , H03K3/011 , H03K3/0315 , H03L1/04
Abstract: The disclosure relates to a temperature-controlled oscillator. Embodiments disclosed include a temperature-compensated oscillator (100) comprising: a first capacitive charging circuit (101) connected between a supply voltage connection (104) and a common connection (105), comprising a first transistor (106) and a first capacitor (107), the first transistor (106) arranged to switch states when the first capacitor (107) is charged above a threshold voltage of the first transistor (106); a second capacitive charging circuit (102) connected between the supply voltage connection (104) and the common connection (105), comprising a second transistor (109) and a second capacitor (110) arranged to begin discharging when the first transistor (106) switches states, the second transistor (109) arranged to switch states when the second capacitor (110) is discharged below a voltage equal to a supply voltage (VDD) at the supply voltage connection (104) minus a threshold voltage of the second transistor (109); and a third capacitive charging circuit (103) connected between the supply voltage connection (104) and the common connection (105), comprising a third transistor (111) and a third capacitor (112) arranged to begin discharging when the second transistor (109) switches states, the third transistor (111) arranged to switch states when the third capacitor (112) discharges below a threshold voltage of the third transistor (111).
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公开(公告)号:US09685889B2
公开(公告)日:2017-06-20
申请号:US14268447
申请日:2014-05-02
Applicant: Seiko Epson Corporation
Inventor: Kyo Horie
CPC classification number: H02N2/001 , H01L2224/16225 , H01L2924/15192 , H03B1/02 , H03B5/32 , H03L1/022 , H03L1/028 , H03L1/04
Abstract: A piezoelectric device includes an insulating substrate, a piezoelectric vibration device that is mounted on a device mounting pad, a metal lid member that seals the piezoelectric vibration device in an airtight manner, an external pad that is arranged outside the insulating substrate, an oscillation circuit, a temperature compensation circuit, and a temperature sensor. The lid member and the temperature sensor or the lid member and the IC component are connected to each other so as to be heat-transferable, and a heat transfer member having thermal conductivity higher than that of the material of the insulating substrate is additionally included.
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18.
公开(公告)号:US20170155393A1
公开(公告)日:2017-06-01
申请号:US15351553
申请日:2016-11-15
Applicant: Seiko Epson Corporation
Inventor: Masashi HATTORI
CPC classification number: H03L1/026 , H03B5/32 , H03L1/04 , H03L7/08 , H03L7/091 , H03L7/093 , H03L7/0992
Abstract: A circuit device includes an A/D conversion section adapted to output temperature detection data, a temperature compensation section adapted to perform a temperature compensation process of the oscillation frequency based on the temperature detection data, and an oscillation signal generation circuit adapted to generate an oscillation signal using frequency control data from the temperature compensation section and a resonator. The frequency control data from the temperature compensation section is input to the oscillation signal generation circuit during a normal operation, and during a period other than the normal operation, data generated by a PLL circuit for comparing an input signal based on an output signal of the oscillation signal generation circuit and a reference signal with each other is input to the oscillation signal generation circuit.
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公开(公告)号:US20170126233A1
公开(公告)日:2017-05-04
申请号:US15406506
申请日:2017-01-13
Applicant: LAPIS Semiconductor Co., Ltd.
Inventor: Kazuya YAMADA , Toshihisa SONE , Akihiro TAKEI , Yuichi YOSHIDA , Kengo TAKEMASA
CPC classification number: H03L1/026 , G01R1/44 , G01R21/00 , G01R22/061 , G01R22/10 , G01R35/04 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L2224/05554 , H01L2224/05624 , H01L2224/05647 , H01L2224/48091 , H01L2224/48247 , H01L2224/49171 , H01L2924/00014 , H01L2924/1461 , H01L2924/3025 , H03K3/011 , H03L1/02 , H03L1/027 , H03L1/04 , H01L2924/00 , H01L2224/45099
Abstract: A semiconductor device includes an oscillator that oscillates at a specific frequency, a semiconductor integrated circuit that integrates a temperature sensor that detects a peripheral temperature, and a controller that is electrically connected to the oscillator and that corrects temperature dependent error in the oscillation frequency of the oscillator based on the temperature detected by the temperature sensor and a sealing member that integrally seals the oscillator and the semiconductor integrated circuit.
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公开(公告)号:US20170117909A1
公开(公告)日:2017-04-27
申请号:US15289311
申请日:2016-10-10
Applicant: Seiko Epson Corporation
Inventor: Yasutaka IMAI
IPC: H03L7/26 , H01L33/10 , H01L33/64 , H01S5/183 , H01L33/50 , H01S5/343 , H01S5/187 , H03L1/04 , H01L33/40
CPC classification number: H03L7/26 , H01L25/167 , H01L27/15 , H01L33/10 , H01L33/40 , H01L33/50 , H01L33/642 , H01S5/0264 , H01S5/0425 , H01S5/0683 , H01S5/183 , H01S5/18302 , H01S5/18311 , H01S5/187 , H01S5/34313 , H01S2301/176 , H03L1/04
Abstract: An atomic oscillator includes: a gas cell sealing alkali metal atoms; a light source emitting light to the gas cell; and a light detection unit detecting a light amount of light transmitted through the gas cell, in which the light source includes a substrate, a first mirror layer disposed on an upper portion of the substrate, an active layer disposed on an upper portion of the first mirror layer, a second mirror layer disposed on an upper portion of the active layer, a first contact layer disposed on an upper portion of the second mirror layer, a light absorption layer disposed on an upper portion of the first contact layer, and a second contact layer disposed on an upper portion of the light absorption layer.
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