公开(公告)号：US20170373637A1

公开(公告)日：2017-12-28

申请号：US15622274

申请日：2017-06-14

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: H03B5/04 ,  H03B5/32 ,  H03B1/02

CPC classification number: H03B5/04 ,  H01L2224/48091 ,  H01L2924/16195 ,  H03B1/02 ,  H03B5/32 ,  H03H9/02102 ,  H03H9/0519 ,  H03H9/0547 ,  H03H9/08 ,  H03H9/1021 ,  H01L2924/00014

Abstract: An oscillator includes a first package including a first base, and a first lid bonded to the first base, a first temperature controller housed in the first package, and mounted on the first base, a second temperature controller housed in the first package, and mounted on the first base, and a circuit element housed in the first package, mounted on the first base, and including at least a part of an oscillation circuit, the circuit element is disposed between the first temperature controller and the second temperature controller in a planar view.

公开(公告)号：US20160293827A1

公开(公告)日：2016-10-06

申请号：US15086620

申请日：2016-03-31

Applicant: Seiko Epson Corporation

Inventor： Tetsuya OTSUKI ,  Shiro MURAKAMI ,  Tomohiro ARAI ,  Mitsuhiro WADA ,  Hiroshi ITO ,  Manabu SHIRAKI ,  Manabu KONDO ,  Muneyoshi HAMA

IPC: H01L41/047 ,  H03H9/215 ,  H01L41/29 ,  C23C14/18 ,  C23C14/34

CPC classification number: H01L41/0477 ,  C23C14/0036 ,  C23C14/025 ,  C23C14/0641 ,  C23C14/185 ,  H01L41/29 ,  H03H9/02023 ,  H03H9/0509 ,  H03H9/0514 ,  H03H9/0519 ,  H03H9/0547 ,  H03H9/131 ,  H03H9/171 ,  H03H9/215

Abstract: An electronic device includes a base material, a first metal film disposed on the base material and containing nitrogen and chromium, and a second metal film disposed on the first metal film and containing gold. In the first metal film, the number of nitrogen atoms may be between 20% to 100% of the number of chromium atoms. Further, the distribution of nitrogen atoms in the first metal film is larger in a third region sandwiched between a first region on the base material side of the first metal film and a second region on the second metal film side than in the first region and in the second region.

Abstract translation: 电子设备包括基材，设置在基材上并含有氮和铬的第一金属膜和设置在第一金属膜上并含有金的第二金属膜。 在第一金属膜中，氮原子数可以是铬原子数的20％至100％。 此外，第一金属膜中的氮原子的分布在夹在第一金属膜的基材侧的第一区域和第二金属膜侧的第二区域之间的第三区域比在第一区域中分布更大， 第二个地区。

公开(公告)号：US20150282322A1

公开(公告)日：2015-10-01

申请号：US14659178

申请日：2015-03-16

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: H05K1/18

CPC classification number: H05K1/18 ,  H05K1/0212 ,  H05K3/4697 ,  H05K2201/09845 ,  H05K2201/10068 ,  H05K2201/10075 ,  H05K2201/10151 ,  H05K2201/10219 ,  H05K2201/10515 ,  H05K2201/10553 ,  H05K2201/1056

Abstract: An electronic component includes a pedestal plate that has a first surface made of a metal and a second surface being an opposite surface to the first surface, a heating element arranged on the first surface of the pedestal plate, and a resonator element arranged on the heating element. The pedestal plate overlaps the resonator element in a plan view.

Abstract translation: 一种电子部件，包括具有由金属构成的第一表面和与第一表面相反的表面的第二表面的基座板，布置在基座板的第一表面上的加热元件和布置在加热器上的谐振元件 元件。 基座板在平面图中与谐振器元件重叠。

公开(公告)号：US20140292422A1

公开(公告)日：2014-10-02

申请号：US14220587

申请日：2014-03-20

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: H03B5/04 ,  H03B5/30

CPC classification number: H03B5/30 ,  H03H9/0552 ,  H03H9/1021

Abstract: A quartz crystal oscillator as a resonation device includes a substrate, a quartz crystal resonator as a resonator attached with a heating element, terminals adapted to fix the resonator and the substrate to each other, and intermediate members having an electrical insulation property and lower in thermal conductivity than the terminals. The intermediate members intervene between the resonator and the substrate via the terminals, and a gap is disposed between the quartz crystal resonator and the substrate.

Abstract translation: 作为谐振装置的石英晶体振荡器包括基板，作为附加有加热元件的谐振器的石英晶体谐振器，适于将谐振器和基板固定的端子，以及具有电绝缘性能和热导率低的中间部件 电导率比端子。 中间构件经由端子介入谐振器和基板之间，并且在石英晶体谐振器和基板之间设置间隙。

公开(公告)号：US20230268886A1

公开(公告)日：2023-08-24

申请号：US18171723

申请日：2023-02-21

Applicant: SEIKO EPSON CORPORATION

Inventor： Norihito MATSUKAWA ,  Manabu KONDO

IPC: H03B5/32 ,  H03L1/04 ,  H03H9/19 ,  H01L23/00 ,  H01L23/40

CPC classification number: H03B5/32 ,  H03L1/04 ,  H03H9/19 ,  H01L24/05 ,  H01L24/48 ,  H01L23/40 ,  H01L2224/0557 ,  H01L2224/484

Abstract: An oscillator includes a first resonator element, a first package that accommodates the first resonator element, a relay substrate on which the first package is mounted, a heater element that is attached to the first package or the relay substrate, a second package that accommodates the first package, and a heat insulating member that is provided at least between the second package and the relay substrate or between the relay substrate and the first package.

公开(公告)号：US20190379325A1

公开(公告)日：2019-12-12

申请号：US16432989

申请日：2019-06-06

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO ,  Kazuhiko SHIMODAIRA ,  Kenji HAYASHI

IPC: H03B5/04 ,  H01L41/053 ,  H01L23/055 ,  H01L41/047 ,  H01L25/16 ,  H01L23/34 ,  B60R16/023

Abstract: An oscillator includes a board having a first surface, and provided with a housing section opening on the first surface, a resonator including a resonator element and a resonator package configured to house the resonator element, a heat generator attached to the resonator, electrically connected to the resonator package, and disposed inside the housing section, and a plurality of lead terminals connected to the board, and configured to support the resonator.

公开(公告)号：US20180045912A1

公开(公告)日：2018-02-15

申请号：US15793290

申请日：2017-10-25

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: G02B7/18 ,  G02B26/08 ,  B81B7/00 ,  B81C1/00 ,  G03B21/00 ,  G02B5/20

Abstract: An electro-optical apparatus has an element substrate that is provided with a mirror and a sealing member which seals the mirror, and the sealing member includes a light-transmitting cover which faces the mirror opposite from the element substrate. An infrared cut filter is laminated on the light-transmitting cover.

公开(公告)号：US20170330766A1

公开(公告)日：2017-11-16

申请号：US15667076

申请日：2017-08-02

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: H01L21/48 ,  H01L23/31 ,  H01L23/495 ,  H03H9/10 ,  H01L21/56 ,  H01L23/34 ,  H01L23/00

CPC classification number: H01L21/4842 ,  H01L21/56 ,  H01L23/3185 ,  H01L23/345 ,  H01L23/49572 ,  H01L24/81 ,  H01L2224/16245 ,  H01L2224/81192 ,  H01L2224/81815 ,  H01L2224/8192 ,  H01L2224/83102 ,  H03H9/10 ,  Y10T29/4913 ,  H01L2924/00014

Abstract: An electronic device includes: an electronic component including an external connection terminal; and a lead frame (metal member) connected to the external connection terminal. The lead frame is disposed with a pad. The pad overlaps the external connection terminal in plan view, and at least a portion of the pad is located outside the external shape of the electronic component in plan view. The pad and the external connection terminal are connected by means of a conductive bonding member. The pad and the electronic component are bonded together with a resin. The resin extends to a region of the pad located outside the external shape of the electronic component in plan view.

公开(公告)号：US20170146794A1

公开(公告)日：2017-05-25

申请号：US15381282

申请日：2016-12-16

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: G02B26/08 ,  H01L23/31 ,  H01L23/528 ,  H01L23/00 ,  H01L21/78 ,  H01L23/544

CPC classification number: G02B26/0833 ,  H01L23/3121 ,  H01L23/5283 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54453 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal.

公开(公告)号：US20160282608A1

公开(公告)日：2016-09-29

申请号：US15018086

申请日：2016-02-08

Applicant: SEIKO EPSON CORPORATION

Inventor： Manabu KONDO

IPC: G02B26/08 ,  H01L21/78

CPC classification number: G02B26/0833 ,  H01L23/3121 ,  H01L23/5283 ,  H01L23/544 ,  H01L24/48 ,  H01L24/49 ,  H01L2223/54453 ,  H01L2224/48091 ,  H01L2924/00014 ,  H01L2224/45099

Abstract: After a first wafer on which mirrors and terminals are formed and a second wafer for sealing are stacked and bonded together, the first wafer and the second wafer are diced to manufacture electro-optical devices. In doing so, in a second surface of the second wafer, recesses overlapping the mirrors in a plan view are previously formed, and also grooves overlapping the terminals in the plan view are previously formed. For this reason, when the second wafer is diced along the grooves by advancing a dicing blade for second wafer from a third surface of the second wafer, the dicing blade for second wafer can be prevented from coming into contact with the terminal.

Abstract translation: 在其上形成有反射镜和端子的第一晶片和用于密封的第二晶片被堆叠并结合在一起之后，第一晶片和第二晶片被切割以制造电光器件。 在这样做时，在第二晶片的第二表面中，预先形成与平面图中的反射镜重叠的凹槽，并且预先形成与平面图中的端子重叠的凹槽。 为此，当从第二晶片的第三表面推进用于第二晶片的切割刀片沿着凹槽切割第二晶片时，可以防止用于第二晶片的切割刀片与端子接触。