公开(公告)号：US20240268021A1

公开(公告)日：2024-08-08

申请号：US18434910

申请日：2024-02-07

Applicant: IBIDEN CO., LTD.

Inventor： Susumu KAGOHASHI ,  Kiyohiro ISHIKAWA

IPC: H05K1/05 ,  H05K1/02 ,  H05K1/11 ,  H05K3/16

CPC classification number: H05K1/05 ,  H05K1/0298 ,  H05K1/115 ,  H05K3/16 ,  H05K2201/0209 ,  H05K2201/0242 ,  H05K2203/0723

Abstract: A printed wiring board includes a first conductor layer, a resin insulating layer including inorganic particles and resin, a second conductor layer including a seed layer and an electrolytic plating layer, and a via conductor connecting the first conductor layer and second conductor layer and including the seed layer and electrolytic plating layer extending from the second conductor layer. The inorganic particles include first particles, second particles, third particles and fourth particles formed such that the first and second particles are solid particles, the third and fourth particles are hollow particles, the first and third particles form an inner wall surface of the opening in the resin insulating layer, the second and fourth particles are embedded in the resin insulating layer, the first particles have shapes that are different from shapes of the second particles, and the third particles have shapes that are different from shapes of the fourth particles.

公开(公告)号：US20240043654A1

公开(公告)日：2024-02-08

申请号：US18021632

申请日：2021-08-17

Applicant: LG INNOTEK CO., LTD.

Inventor： Byeong Kyun CHOI ,  Min Young HWANG ,  Moo Seong KIM ,  Jin Seok LEE

IPC: C08K3/22 ,  C08K3/34 ,  H05K1/03 ,  H01L23/498

CPC classification number: C08K3/22 ,  C08K3/34 ,  H05K1/036 ,  H05K1/0373 ,  H01L23/49894 ,  H01L23/49822 ,  C08K2003/2244 ,  C08K2003/2241 ,  H05K2201/0242 ,  H05K2201/0209 ,  H05K2201/0269

Abstract: A resin composition for a semiconductor package according to an embodiment includes a resin composition that is a composite of a resin and a filler disposed in the resin, wherein the filler includes at least one concave portion provided on a surface, wherein a content of the filler has a range of 10 vol. % to 40 vol % of a total volume of the resin composition, and wherein a porosity corresponds to a volume occupied by the concave portion in a total volume of the filler and has a range of 20% to 35%.

公开(公告)号：US20180168036A1

公开(公告)日：2018-06-14

申请号：US15878398

申请日：2018-01-23

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. BAHL ,  Konstantine KARAVAKIS

IPC: H05K1/03 ,  H05K3/18 ,  H05K3/46 ,  H05K3/42 ,  H05K3/38 ,  H05K1/02 ,  H05K1/11 ,  H05K1/09

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.

公开(公告)号：US09706650B1

公开(公告)日：2017-07-11

申请号：US15240133

申请日：2016-08-18

Applicant: Sierra Circuits, Inc.

Inventor： Kenneth S. Bahl ,  Konstantine Karavakis

IPC: H05K1/03 ,  H05K3/18 ,  H05K1/02 ,  H05K1/09 ,  H05K3/42 ,  H05K3/46 ,  H05K1/11 ,  H05K3/38

CPC classification number: H05K1/0313 ,  H05K1/0296 ,  H05K1/0353 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/09 ,  H05K1/115 ,  H05K3/18 ,  H05K3/181 ,  H05K3/182 ,  H05K3/387 ,  H05K3/422 ,  H05K3/429 ,  H05K3/4632 ,  H05K2201/0209 ,  H05K2201/0227 ,  H05K2201/0242 ,  H05K2201/0376 ,  H05K2203/0716

Abstract: A catalytic resin is formed by mixing a resin and either homogeneous or heterogeneous catalytic particles, the resin infused into a woven glass fabric to form an A-stage pre-preg, the A-stage pre-preg cured into a B-stage pre-preg, thereafter held in a vacuum and between pressure plates at a gel point temperature for a duration of time sufficient for the catalytic particles to migrate away from the resin rich surfaces of the pre-preg, thereby forming a C-stage pre-preg after cooling. The C-stage pre-preg subsequently has trenches formed by removing the resin rich surface, the trenches extending into the depth of the catalytic particles, optionally including drilled holes to form vias, and the C-stage pre-preg with trenches and holes placed in an electroless bath, whereby traces form in the trenches and holes where the surface of the cured pre-preg has been removed.