公开(公告)号：US20040163966A1

公开(公告)日：2004-08-26

申请号：US10374944

申请日：2003-02-26

发明人： Neal J. Preimesberger

IPC分类号： C25D001/00

CPC分类号： C25C7/02 ,  Y10T29/49117 ,  Y10T29/49195 ,  Y10T29/4921 ,  Y10T29/49211 ,  Y10T29/49213 ,  Y10T29/5313 ,  Y10T29/53204 ,  Y10T29/53209 ,  Y10T29/5327

摘要： A copper welding rod is used in an arc-welding operation to form a bead that joins a copper starter sheet and a stainless steel hanger bar. The amperage level of the arc-welding equipment is set to generate heat at the weld site which is above the melting point of copper and below the melting point of stainless steel. This results in a welded joint between the copper bead and the hanger bar and a brazed joint between the copper bead and the starter sheet. Since brazing produces little or no fusion, the area of contact between the two dissimilar metals is limited to the interface between them, which significantly reduces the damaging effects of galvanic corrosion. Another improvement lies in the application of a corrosion-resistant metallic coating on the joint between the hanger bar and the starter sheet using a high velocity oxygen fuel flame spray technique.

摘要翻译： 在电弧焊接操作中使用铜焊条以形成连接铜起动片和不锈钢吊架杆的焊道。 电弧焊设备的电流强度设定为在焊接部位产生高于铜熔点并低于不锈钢熔点的热量。 这导致铜珠和衣架杆之间的焊接接头和铜珠和起始片之间的钎焊接头。 由于钎焊产生很少或没有熔合，所以两种不同金属之间的接触面积被限制在它们之间的界面上，这显着降低了电偶腐蚀的破坏性影响。 另一个改进在于使用高速氧燃料火焰喷涂技术在衣架杆和起动片之间的接合处施加耐腐蚀金属涂层。

公开(公告)号：US20040149568A1

公开(公告)日：2004-08-05

申请号：US10699097

申请日：2003-10-30

发明人： Lotien Richard Huang ,  James Christopher Sturm

IPC分类号： C25D001/00

CPC分类号： G01N27/44743 ,  B01L3/50273 ,  B01L3/502753 ,  B01L2200/027 ,  B01L2300/0816 ,  B01L2400/0415

摘要： The present invention provides an integrated microfluidic device comprising a sample chamber and a micro-fluidic channel, wherein the sample chamber contains two or more electrodes capable of generating an electric field in the sample chamber. The two or more electrodes create electric fields for sample elution, transfer, and unloading.

摘要翻译： 本发明提供了一种集成微流体装置，其包括样品室和微流体通道，其中样品室包含能够在样品室中产生电场的两个或更多个电极。 两个或更多个电极产生用于样品洗脱，转移和卸载的电场。

公开(公告)号：US20030224263A1

公开(公告)日：2003-12-04

申请号：US10390962

申请日：2003-03-18

发明人： Toshiharu Matsuoka

IPC分类号： G03F009/00 ,  G03F007/16 ,  G03F007/20 ,  G03F007/40 ,  C25D001/00

CPC分类号： C25D1/00 ,  C25D1/003 ,  C25D1/20

摘要： A process for producing a precision component is provided. In one embodiment of the process comprising adhering a resist on a surface of a metal material, forming resist coated parts and metal exposed parts by exposure to light and developing, and etching the metal exposed parts alone to form perforated parts or indented parts, the process is characterized in that a) at least a thin copper layer is included as a surface on which a resist is adhered, b) at least a nickel layer which is in contact with said copper layer is included, c) precision parts made by removing precise amount of metal are formed from said nickel layer, and d) the thickness of said thin copper layer is sufficiently thin to be made disappeared at the exposed metal surface parts by a nickel etching solution when said nickel layer is etched.

摘要翻译： 提供了一种用于制造精密部件的方法。 在该方法的一个实施方案中，包括将抗蚀剂粘附在金属材料的表面上，通过曝光和显影形成抗蚀剂涂覆部分和金属暴露部分，并且单独蚀刻金属暴露部分以形成穿孔部分或凹入部分，该方法 其特征在于，a）至少包含薄铜层作为其上粘附有抗蚀剂的表面，b）至少包含与所述铜层接触的镍层，c）通过去除精确的 由所述镍层形成金属量，d）当所述镍层被蚀刻时，所述薄铜层的厚度足够薄，以使其在暴露的金属表面部分被镍蚀刻溶液消失。

公开(公告)号：US20030108481A1

公开(公告)日：2003-06-12

申请号：US10281968

申请日：2002-10-29

申请人： N.E. CHEMCAT CORPORATION ,  MITSUBISHI CHEMICAL CORPORATION

发明人： Hiroshi Igarashi ,  Masamichi Ueda ,  Mitsuo Suzuki ,  Shushichi Yoshimura ,  Shinichi Kanamaru

IPC分类号： C23C028/00 ,  C25D001/00 ,  C25C007/00 ,  C25B009/00 ,  H01M004/96 ,  H01M008/10 ,  C09C001/48

CPC分类号： H01M8/1004 ,  C01P2006/12 ,  C01P2006/14 ,  C01P2006/16 ,  C01P2006/19 ,  C09C1/50 ,  C09C1/56 ,  C25B9/10 ,  C25B11/12 ,  H01M4/8605 ,  H01M4/921 ,  H01M4/96

摘要： A carbon black is provided which is useful as an electrocatalyst carrier. The carbon black has a DBP oil absorption of 170 to 300 cm3/100 g, a specific surface area as measured by a BET method of 250 to 400 m2/g, a primary particle diameter value of 10 to 17 nm, and a total volume of open pores at the surface which have a pore radius of 10 to 30 nm of 0.40 to 2.0 cm3/g. The electrocatalyst can be used in electrochemical devices such as solid polymer electrolyte fuel cells.

摘要翻译： 提供了可用作电催化剂载体的炭黑。 碳黑的DBP吸油量为170〜300cm 3 / 100g，通过BET法测定的比表面积为250〜400m 2 / g，一次粒径值为10〜17nm，总体积 具有孔径为10〜30nm的表面的开孔为0.40〜2.0cm 3 / g。 电催化剂可用于电化学装置如固体聚合物电解质燃料电池。

公开(公告)号：US20030017359A1

公开(公告)日：2003-01-23

申请号：US10157466

申请日：2002-05-29

申请人： American Air Liquide, Inc.

发明人： Tracey J. Jacksier ,  Robert Benesch

IPC分类号： B32B015/00 ,  C25D005/10 ,  B32B015/10 ,  C25D001/00 ,  C21D009/08 ,  C22F001/00 ,  C21D001/00

CPC分类号： B08B9/28 ,  B08B9/22 ,  B08B2203/005 ,  C23C16/045 ,  C23G5/00 ,  F17C1/10 ,  F17C3/12 ,  F17C2201/0104 ,  F17C2201/0128 ,  F17C2201/052 ,  F17C2203/0604 ,  F17C2203/0636 ,  F17C2203/0639 ,  F17C2203/0643 ,  F17C2203/0646 ,  F17C2203/0648 ,  F17C2205/0323 ,  F17C2209/2172 ,  F17C2209/232 ,  F17C2221/037 ,  F17C2223/0123 ,  F17C2223/013 ,  F17C2223/0146 ,  F17C2223/0153 ,  F17C2260/053 ,  Y10T428/12736 ,  Y10T428/12972

摘要： Methods of passivating a metal surface are described, the methods comprising the steps of i) exposing the metal surface to a silicon-containing passivation material; ii) evacuating the metal surface; iii) exposing the treated surface to a gas composition having a concentration of reactive gas that is greater than an intended reactive gas concentration of gas to be transported by the metal surface; iv) evacuating the metal surface to remove substantially all of the gas composition to enable maintenance of an increased shelf-life, low concentration reactive gas at an intended concentration; and v) exposing the metal surface to the reactive gas at the intended reactive gas concentration. Manufactured products, high stability fluids, and methods of making same are also described.

摘要翻译： 描述了钝化金属表面的方法，所述方法包括以下步骤：i）将金属表面暴露于含硅钝化材料; ii）排空金属表面; iii）将经处理的表面暴露于具有大于由金属表面输送的气体的预期反应气体浓度的反应气体浓度的气体组合物; iv）抽出金属表面以去除基本上所有的气体组合物，以便维持预期浓度的增加的保质期低浓度反应气体; 和v）以预期的反应气体浓度将金属表面暴露于反应性气体。 还描述了制造产品，高稳定性流体及其制备方法。

公开(公告)号：US20020153260A1

公开(公告)日：2002-10-24

申请号：US09895470

申请日：2001-06-29

申请人： Shipley Company, L.L.C.

发明人： Andre Egli ,  Anja Vinckier ,  Jochen Heber ,  Wan Zhang

IPC分类号： B32B015/01 ,  C09D005/00 ,  C23C018/00 ,  C25D003/30 ,  C25D005/00 ,  C25D001/00

CPC分类号： C25D3/30 ,  C25D3/32 ,  C25D3/60 ,  C25D7/12 ,  H05K3/244 ,  Y10S428/935 ,  Y10T428/12493 ,  Y10T428/12708 ,  Y10T428/12715 ,  Y10T428/24917 ,  Y10T428/31678

摘要： The present invention provides inter alias electroplating compositions, methods for use of the compositions and products formed by the compositions. Electroplating compositions of the invention are characterized in significant part by a grain refiner/stabilizer additive comprising one or more non-aromatic compounds having null electrons that can be delocalized, e.g., an null,null unsaturated system or other conjugated system that contains a proximate electron-withdrawing group. Compositions of the invention provide enhanced grain refinement and increased stability in metal plating solutions, particularly in tin and tin alloy plating formulations.

摘要翻译： 本发明提供了别名电镀组合物，用于由组合物形成的组合物和产品的方法。 本发明的电镀组合物的特征在于重要部分是晶粒细化剂/稳定剂添加剂，其包括一种或多种具有可以离域的具有π电子的非芳族化合物，例如α，β不饱和体系或其它包含邻近电子的共轭体系 牵引组。 本发明的组合物提供增强的晶粒细化和增加的金属电镀溶液的稳定性，特别是在锡和锡合金电镀配方中。

公开(公告)号：US20020020628A1

公开(公告)日：2002-02-21

申请号：US09919788

申请日：2001-07-31

发明人： Bulent M. Basol

IPC分类号： C25D005/18 ,  C25D001/00

CPC分类号： H01L21/7684 ,  C25D5/022 ,  C25D5/22 ,  C25D5/34 ,  H01L21/2885 ,  H01L21/76877 ,  H01L21/76879

摘要： The present invention relates to methods and apparatus for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, using an indirect external influence, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion, thus causing greater plating of the cavity portion relative to the top portion.

摘要翻译： 本发明涉及以非常理想的方式在基板表面上电镀导电材料的方法和装置。 本发明使用间接的外部影响，除了至少一种添加剂设置在空腔部分上，除去至少一种吸附在工件的顶部上的添加剂，从而允许导电材料的电镀在添加剂完全重新吸附到 顶部，从而导致空腔部分相对于顶部部分的电镀更大。

公开(公告)号：US20020008040A1

公开(公告)日：2002-01-24

申请号：US09861891

申请日：2001-05-22

发明人： Mikio Yamamoto

IPC分类号： C25B001/24 ,  C25D001/00

CPC分类号： C25B1/26 ,  C02F1/4674

摘要： A production apparatus of hypochlorite solution includes an electrolytic cell having a housing the interior of which is subdivided by a partition membrane to form therein anode and cathode chambers, and positive and negative electrodes respectively disposed within the anode and cathode chambers and opposed to each other through the partition membrane, wherein the positive and negative electrodes are applied with DC voltage to effect electrolysis of chloride solution such as sodium chloride solution or potassium chloride solution supplied into both the anode and cathode chambers, and wherein acid water and alkaline water respectively produced in the anode and cathode chambers are mixed to produce hypochlorite solution. In the production apparatus of hypochlorite solution, the anode chamber of the electrolytic cell is supplied with chloride solution through a supply conduit connected thereto, while the cathode chamber of the electrolytic cell is supplied with city service water through a supply conduit connected thereto.

摘要翻译： 次氯酸盐溶液的生产装置包括具有壳体的电解槽，其内部由分隔膜细分成阳极和阴极室，分别设置在阳极室和阴极室内并且彼此相对通过的正极和负极 分隔膜，其中正电极和负电极施加直流电压，以实现供应到阳极和阴极室中的氯化钠溶液或氯化钾溶液的氯化物溶液的电解，并且其中分别在阳极和阴极室中产生的酸性水和碱性水 将阳极和阴极室混合以产生次氯酸盐溶液。 在次氯酸盐溶液的制造装置中，通过与其连接的供给管道向电解槽的阳极室供给氯化物溶液，同时通过与其连接的供给管道向电解槽供给城市用水。

公开(公告)号：US20010047944A1

公开(公告)日：2001-12-06

申请号：US09817694

申请日：2001-03-26

发明人： Gonzalo Amador ,  Roger J. Stierman

IPC分类号： C25D001/00 ,  G01F001/64 ,  G01N017/00

CPC分类号： H01L21/288 ,  C23C18/1619 ,  C23C18/1669 ,  H01L24/02 ,  H01L24/11 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13099 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/45147 ,  H01L2924/00011 ,  H01L2924/01004 ,  H01L2924/01006 ,  H01L2924/01011 ,  H01L2924/01013 ,  H01L2924/01014 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01327 ,  H01L2924/14 ,  H01L2924/3025 ,  H01L2924/00 ,  H01L2924/00014

摘要： A method and an apparatus for uniform electroless plating of layers onto exposed metallizations in integrated circuits such as bond pads. The apparatus provides means for holding a plurality of wafers, and rotating each wafer at constant speed and synchronous within the plurality. Immersed in a plating solution flowing in substantially laminar motion and at constant speed, the method creates periodic superposition of directions and speeds of the motion of the wafers and the motion of the plating solution. The invention creates periodically changing wafer portions where the directions and speeds are additive and where the directions and speeds are opposed and subtractive. Consequently, highly uniformly layers are electrolessly plated onto the exposed metallizations of bond pads. If the plated layers are bondable metals, the process transforms otherwise unbondable pad metallization into bondable pads.

摘要翻译： 一种用于在诸如接合焊盘的集成电路中的均匀化学镀电镀到暴露的金属化的方法和装置。 该装置提供用于保持多个晶片的装置，并且在多个晶片内以恒定速度和同步旋转每个晶片。 浸入基本层流运动和恒定速度流动的镀液中，该方法产生晶片的运动方向和速度以及镀液的运动的周期性重叠。 本发明创造周期性变化的晶片部分，其中方向和速度是相加的，并且其方向和速度是相反的和减法的。 因此，高度均匀的层被无电镀在接合焊盘的暴露的金属化上。 如果镀层是可结合的金属，则该工艺将其它不可焊接的焊盘金属化转变成可粘合的焊盘。

公开(公告)号：US20010028936A1

公开(公告)日：2001-10-11

申请号：US09772928

申请日：2001-01-31

发明人： Madoka Nishiyama ,  Seiji Morita

IPC分类号： B29D011/00 ,  C25D001/00 ,  G11B003/70

CPC分类号： B29C45/2632 ,  B29D17/005 ,  C25D1/10 ,  G11B7/261 ,  G11B7/263

摘要： A substrate having a photoresist coated thereon is exposed to exposure light along a line through a lens 1. The exposure position is moved from the initial position O1 to a position O2 that is separated from the initial position by a distance corresponding to the sum of a groove width Gw and a land width Lw. The exposure is carried out along a line parallel to the initial exposure line. By repeating this, exposed areas having a width Lw and a separation Gw are formed on the photoresist. The photoresist is developed to remove the exposed areas of the photoresist. A resin or the like is pressed on it to form a replica. From the replica, a stamper is manufactured using an electroforming method. Finally, a grooved molding substrate is manufactured from a glass or resin using the stamper. Although the land width Lw is defined by the effective spot diameter null of the optical system, the groove width Gw can be less than this value.

摘要翻译： 将其上涂覆有光致抗蚀剂的基板暴露于沿着穿过透镜1的线的曝光光。曝光位置从初始位置O1移动到与初始位置分开一定距离的位置O2，该距离对应于 槽宽Gw和焊盘宽度Lw。 沿着与初始曝光线平行的线进行曝光。 通过重复，在光致抗蚀剂上形成具有宽度Lw和分离Gw的曝光区域。 显影光致抗蚀剂以除去光致抗蚀剂的曝光区域。 树脂等压在其上以形成副本。 从复制品，使用电铸方法制造压模。 最后，使用压模由玻璃或树脂制造带槽的成型基板。 尽管平面宽度Lw由光学系统的有效光斑直径φi限定，但是槽宽度Gw可以小于该值。