公开(公告)号：US20030219543A1

公开(公告)日：2003-11-27

申请号：US10437925

申请日：2003-05-15

发明人： David Warichet ,  Karel Van Herck ,  Andre Van Lierde ,  Nathalie Gerain ,  Edward Matthijs

IPC分类号： B05D001/18 ,  C23C018/00

CPC分类号： C23C2/06 ,  C23C2/12 ,  C23C2/30

摘要： A flux for hot dip galvanization comprises from:null60 to 80 wt. % of zinc chloride (ZnCl2); 7 to 20 wt. % of ammonium chloride (NH4Cl); 2 to 20 wt. % of a fluidity modifying agent comprising at least one alkali or alkaline earth metal; 0.1 to 5 wt. % of a least one of the following compounds: NiCl2, CoCl2, MnCl2; and 0.1 to 1.5 wt. % of at least one of the following compounds: PbCl2, SnCl2, BiCl3, SbCl3.

摘要翻译： 用于热浸镀锌的焊剂包括：＆Circlef; 60至80wt。 ％氯化锌（ZnCl2）; 7〜20重量％ ％氯化铵（NH4Cl）; 2〜20重量％ ％的包含至少一种碱金属或碱土金属的流变改性剂; 0.1〜5重量％ ％以下化合物中的至少一种：NiCl 2，CoCl 2，MnCl 2; 和0.1〜1.5wt。 ％以下化合物中的至少一种：PbCl 2，SnCl 2，BiCl 3，SbCl 3。

公开(公告)号：US20030092957A1

公开(公告)日：2003-05-15

申请号：US10112764

申请日：2002-04-02

发明人： Neal A. Scott ,  Janet M. Hampikian

IPC分类号： C23C018/00 ,  C23C020/00 ,  A61N005/00

CPC分类号： A61N5/1015 ,  A61N5/1007 ,  A61N5/1014 ,  A61N5/1027 ,  A61N2005/1005 ,  A61N2005/1012 ,  A61N2005/1018 ,  A61N2005/1019 ,  C23C18/1208 ,  C23C18/1254 ,  Y10T428/12771 ,  Y10T428/12944 ,  Y10T428/12986 ,  Y10T428/31678

摘要： The present invention is directed to a brachytherapy device comprising a substrate comprising at least one radioactive coating layer formed thereon. The radioactive coating layer has a total radioactivity that varies in at least one dimension of the device. Methods of making radioactive coatings, such as electrochemical deposition, electroless deposition and sol-gel are also disclosed. Suitable substrates include medical devices, such as catheters, stents, brachytherapy devices and guidewires, or components thereof. The disclosed methods produce medical devices capable of generating asymmetric, or targeted, radiation fields that correspond to the morphology of a tumor. Methods of using these devices to treat cancer of the breast, brain, prostate, uterine, head and neck are also disclosed.

摘要翻译： 本发明涉及一种近程放射治疗装置，其包括其上形成有至少一个放射性涂层的基底。 放射性涂层具有在装置的至少一个维度上变化的总放射性。 还公开了制备放射性涂层的方法，例如电化学沉积，无电沉积和溶胶 - 凝胶。 合适的基材包括医疗装置，例如导管，支架，近距离放射治疗装置和导线，或其组件。 所公开的方法产生能够产生对应于肿瘤形态的不对称或靶向的辐射场的医疗装置。 还公开了使用这些装置来治疗乳腺，脑，前列腺，子宫，头颈部癌症的方法。

公开(公告)号：US20030059642A1

公开(公告)日：2003-03-27

申请号：US09963605

申请日：2001-09-27

发明人： Zequn Mei

IPC分类号： B32B015/02 ,  B05D007/00 ,  B05D001/18 ,  C23C018/00

CPC分类号： C23C18/31 ,  B22F1/025 ,  B23K35/0222 ,  B23K35/0227 ,  B23K35/0233 ,  B23K35/0244 ,  B23K35/025 ,  B23K35/26 ,  B23K35/262 ,  B23K35/282 ,  B23K35/36 ,  H05K3/3463 ,  H05K3/3484 ,  H05K2201/0218 ,  H05K2203/0435 ,  Y10T428/12181

摘要： Solder compositions, solder pastes and methods of manufacturing thereof having a solder material coated with a coating material by an immersion coating process or an electroless plating process. The solder composition and solder pastes are substantially lead-free and have melting temperatures approaching those of traditional tin-lead solders.

摘要翻译： 焊剂组合物，焊膏及其制造方法，其具有通过浸涂法或无电镀工艺涂覆有涂料的焊料材料。 焊料组合物和焊膏基本上是无铅的，并具有接近传统锡铅焊料的熔化温度。

公开(公告)号：US20020192458A1

公开(公告)日：2002-12-19

申请号：US10134469

申请日：2002-04-30

申请人： SUMITOMO METAL MINING CO., LTD.

发明人： Kenji Kato ,  Masaya Yukinobu

IPC分类号： B05D003/02 ,  C23C018/00

CPC分类号： H01J29/28 ,  C09D5/24 ,  Y10T428/12896 ,  Y10T428/25 ,  Y10T428/2991

摘要： The present invention relates to a transparent conductive layered structure having a transparent substrate and a transparent conductive layer and transparent coating layer formed in succession on this substrate, used in, for instance, the front panel of CRT, etc., display devices. The main components of said transparent conductive layer are noble metal microparticles with a mean particle diameter of 1 to 100 nm, wherein the microparticles are made from gold and/or platinum and silver and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %, and a binder matrix. Moreover, the main components of the coating liquid used to form a transparent conductive layer in the production of a transparent conductive layered structure are solvent and noble metal-coated silver microparticles with a mean particle diameter of 1 to 100 nm dispersed in this solvent, wherein the surface of the silver microparticles is coated with gold or platinum only or a compound of gold and platinum and the gold and/or platinum content is within a range exceeding 50 wt % up to 95 wt %.

摘要翻译： 本发明涉及一种透明导电层状结构，其具有透明基板和透明导电层以及在该基板上连续形成的透明涂层，例如用于CRT等的前面板，显示装置。 所述透明导电层的主要成分是平均粒径为1〜100nm的贵金属微粒，其中微粒由金和/或铂和银制成，金和/或铂含量在超过50的范围内 wt％至多95重量％，和粘合剂基质。 此外，在制造透明导电层状结构体中用于形成透明导电层的涂布液的主要成分是分散在该溶剂中的平均粒径为1〜100nm的贵金属被覆银的银微粒，其中， 银微粒的表面仅涂覆金或铂或金和铂的化合物，金和/或铂含量在超过50重量％至95重量％的范围内。

公开(公告)号：US20040084322A1

公开(公告)日：2004-05-06

申请号：US10288113

申请日：2002-11-05

申请人： COLUMBIA CHEMICAL CORPORATION

发明人： Robert J. Ludwig ,  William E. Rosenberg

IPC分类号： C23C018/00 ,  C25D003/22

CPC分类号： C25D3/22

摘要： An aqueous alkaline non-cyanide zinc electroplating bath containing zinc ions for producing bright electrodeposits of zinc and a brightening agent comprising a polymeric quaternary amine and a reducing sugar, and a compound that forms a reducing sugar upon hydrolysis.

公开(公告)号：US20040055503A1

公开(公告)日：2004-03-25

申请号：US10253942

申请日：2002-09-23

发明人： Syed M. Hasan

IPC分类号： C23C018/00 ,  C09K003/00 ,  H01B013/00

CPC分类号： H05K3/381 ,  C23C18/2033 ,  C23C18/2086 ,  C25D5/56 ,  H05K1/034 ,  H05K3/181 ,  H05K3/426 ,  H05K2201/015 ,  Y10S428/901 ,  Y10T428/3154 ,  Y10T428/31544

摘要： A method and solution to activate and metallize the surface of a fluorocarbon material, suitable for circuit boards is disclosed. The surface of fluorocarbon materials is both hydrophobic and oleophobic, and highly inert and repellent to oils, dyes, adhesive and coatings. The method of the present invention makes such fluorocarbon materials wettable with metallizing solutions and chemicals, and also bondable with adhesives and coatings. The method comprises contacting said fluorocarbon surface with a mixture comprising a cyclic amide, a quaternary ammonium compound, a cationic or nonionic surfactant, a glycolether and an organic acid.

摘要翻译： 公开了一种激活和金属化适合于电路板的碳氟化合物材料的表面的方法和解决方案。 氟碳材料的表面是疏水性和疏油性，并且对油，染料，粘合剂和涂料具有高度惰性和驱避性。 本发明的方法使得这种碳氟化合物材料可以用金属化溶液和化学品润湿，并且还可与粘合剂和涂层粘合。 该方法包括使所述碳氟表面与包含环酰胺，季铵化合物，阳离子或非离子表面活性剂，乙二醇醚和有机酸的混合物接触。

公开(公告)号：US20020046679A1

公开(公告)日：2002-04-25

申请号：US09986620

申请日：2001-11-09

申请人： Hideo HONMA

发明人： Hideo Honma ,  Tomoyuki Fujinami ,  Nobuo Ebina

IPC分类号： B05D001/18 ,  C23C018/00

CPC分类号： C23C18/40 ,  Y10T428/12514 ,  Y10T428/12903

摘要： A copper metal film having 105 to 109 micropores per square centimeter and a product plated with the film. The copper metal film is obtained by immersing a work in an electroless plating solution which contains copper ions, a completing agent, a hypophosphorus acid compound, a metal catalyst for initiating reduction, and a compound having an acetylenic bond.

摘要翻译： 铜金属膜，每平方厘米具有105至109个微孔，镀有镀膜的产品。 通过将工件浸渍在含有铜离子，完成剂，次磷酸化合物，用于引发还原的金属催化剂和具有炔属键的化合物的化学镀溶液中而获得铜金属膜。

公开(公告)号：US20030203111A1

公开(公告)日：2003-10-30

申请号：US10453829

申请日：2003-06-02

发明人： Wei-Wei Zhuang ,  Lawrence J. Charneski ,  David R. Evans ,  Sheng Teng Hsu

IPC分类号： C23C016/00 ,  B05D003/02 ,  C09D005/00 ,  B22F007/00 ,  C23C018/00 ,  C23C020/00

CPC分类号： H01L21/28556 ,  C23C16/18

摘要： A method for chemical vapor deposition of copper metal thin film on a substrate includes heating a substrate onto which the copper metal thin film is to be deposited in a chemical vapor deposition chamber; vaporizing a precursor containing the copper metal, wherein the precursor is a compound of (null-methylstyrene)Cu(I)(hfac), where hfac is hexafluoroacetylacetonate, and (hfac)Cu(I)L, where L is an alkene; introducing the vaporized precursor into the chemical vapor deposition chamber adjacent the heated substrate; and condensing the vaporized precursor onto the substrate thereby depositing copper metal onto the substrate. A copper metal precursor for use in the chemical vapor deposition of a copper metal thin film is a compound of (null-methylstyrene)Cu(I)(hfac), where hfac is hexafluoroacetylacetonate, and (hfac)Cu(I)L, where L is an alkene taken from the group of alkenes consisting of 1-pentene, 1-hexene and trimethylvinylsilane.

摘要翻译： 铜基金属薄膜在基板上进行化学气相沉积的方法包括在化学气相沉积室中加热要沉积铜金属薄膜的基板; 蒸发含有铜金属的前体，其中前体是（α-甲基苯乙烯）Cu（I）（hfac）的化合物，其中hfac是六氟乙酰丙酮化物，和（hfac）Cu（I）L，其中L是烯烃; 将蒸发的前体引入与加热的基底相邻的化学气相沉积室; 并将蒸发的前体冷凝到基底上，从而将铜金属沉积到基底上。 用于铜金属薄膜的化学气相沉积的铜金属前体是（α-甲基苯乙烯）Cu（I）（hfac）的化合物，其中hfac是六氟乙酰丙酮化物，和（hfac）Cu（I）L，其中 L是从由1-戊烯，1-己烯和三甲基乙烯基硅烷组成的烯烃族中获得的烯烃。

公开(公告)号：US20030008157A1

公开(公告)日：2003-01-09

申请号：US10168104

申请日：2002-06-17

发明人： Hiroshi Shiho ,  Hitoshi Kato ,  Yasuo Matsuki ,  Satoshi Ebata ,  Yoichiro Maruyama ,  Yasuaki Yokoyama

IPC分类号： C23C018/00 ,  C07F001/00 ,  B05B001/00 ,  C09D005/10 ,  B05D003/02 ,  C09D005/00 ,  C23C020/00 ,  C07F001/12

CPC分类号： C07F15/0046 ,  Y10T428/31678

摘要： A composition capable of forming a metal ruthenium film and a ruthenium oxide film by a simple application/baking process, a process for forming a metal ruthenium film and a ruthenium oxide film from the composition, a metal ruthenium film and a ruthenium oxide film formed by the process, and electrodes formed of the films. A solution composition comprising a specific ruthenium complex. The coating film of this solution composition is heated in an atmosphere containing no oxygen or an atmosphere containing oxygen to form a metal ruthenium film or a ruthenium oxide film, respectively, and electrodes formed of the films.

摘要翻译： 通过简单的涂布/烘烤法，能够形成金属钌膜和氧化钌膜的组合物，从组合物形成金属钌膜和氧化钌膜的方法，金属钌膜和氧化钌膜由 该工艺和由膜形成的电极。 包含特定钌络合物的溶液组合物。 该溶液组合物的涂膜在不含氧气或含氧气氛的气氛中分别加热形成金属钌膜或氧化钌膜，以及由该膜形成的电极。

公开(公告)号：US20020051851A1

公开(公告)日：2002-05-02

申请号：US10001132

申请日：2001-10-23

申请人： Sulzer Metco AG

发明人： Gerard Barbezat

IPC分类号： C23C018/00

CPC分类号： C23C4/16 ,  C23C4/08

摘要： To improve the machining and processing, respectively, as well as the tribologic properties of ferrous coatings for the working surfaces of combustion engine cylinder blocks applied by a plasma spraying operation, a ferrous coating having a content of bound oxygen in the amount of between 1 to 4% by weight is suggested. Such coatings can be realized, for example, by adding an amount of 200 to 1000 normalized liters air per minute during the plasma spraying operation.

摘要翻译： 为了改进加工和加工，以及通过等离子喷涂操作施加的内燃机气缸体的工作表面的含铁涂层的摩擦学特性，含有结合氧含量为1〜 建议4％重量。 这样的涂层可以例如通过在等离子喷涂操作期间通过添加200至1000标准升温空气/分钟的量来实现。