Synthetic rubber pressure-sensitive adhesive, pressure-sensitive adhesive sheet, and polishing member laminate

    公开(公告)号:US11434396B2

    公开(公告)日:2022-09-06

    申请号:US16618100

    申请日:2018-05-28

    发明人: Tadashi Abe

    摘要: The invention provides a synthetic rubber pressure-sensitive adhesive which has excellent heat resistance and substrate adhesiveness, is capable of inhibiting offset, peeling or the like even in a high-temperature environment and is suitable for applications in a high-temperature environment, a pressure-sensitive adhesive sheet and a polishing member laminate. The synthetic rubber pressure-sensitive adhesive of the invention contains: a synthetic rubber (A) including a styrene-isoprene block copolymer, an adhesion-imparting resin (B), and a fatty acid ester (C) with a weight reduction rate of 1 wt % or less after being heated at 150° C. for 10 minutes. Based on 100 parts by weight of the synthetic rubber (A), the content of the adhesion-imparting resin (B) is set as α parts by weight to 60 parts by weight, and the content of the fatty acid ester (C) is set as 0.1 parts by weight to 10 parts by weight.

    Composition for pattern formation, and pattern-forming method

    公开(公告)号:US11370872B2

    公开(公告)日:2022-06-28

    申请号:US16240070

    申请日:2019-01-04

    申请人: JSR CORPORATION

    摘要: A composition for pattern formation includes a first polymer, a second polymer and a solvent. The first polymer includes: a first block including a first structural unit derived from a substituted or unsubstituted styrene; and a second block including a second structural unit other than the first structural unit. The second polymer includes: the first structural unit; and a group bonding to at least one end of a main chain thereof and including a polar group. The polar group is preferably a hydroxy group or a carboxyl group. A number average molecular weight of the second polymer is preferably no greater than 6,000. A mass ratio of the second polymer to the first polymer is preferably no less than 0.15 and no greater than 0.4. The solvent preferably comprises a compound comprising a hydroxyl group and an alkyl ester group.