COMPOSITION FOR FORMING A COATING FILM FOR REMOVING FOREIGN MATTERS

    公开(公告)号:US20230250314A1

    公开(公告)日:2023-08-10

    申请号:US18015659

    申请日:2021-07-20

    CPC classification number: C09D201/06 H01L21/568 H01L2221/68386

    Abstract: A simple method for removing foreign substances that are formed on a substrate during a semiconductor device production process and a composition for forming a coating film for foreign substance removal, said coating film being used in the above-described method. A composition for forming a coating film for foreign substance removal, said composition containing a polymer and a solvent and being capable of forming a coating film that dissolves in a developer liquid, wherein: the polymer is selected from among phenolic novolacs, polyhydroxystyrene derivatives and carboxylic acid-containing polymers; and the polymer is contained in an amount of 50% by mass or more relative to the total solid content in the composition.

    Coating composition
    207.
    发明授权

    公开(公告)号:US10472537B2

    公开(公告)日:2019-11-12

    申请号:US15765099

    申请日:2016-09-08

    Abstract: There is provided a coating composition with excellent storage stability, and with excellent mar resistance for obtained coating films. The coating composition comprises a hydroxyl group-containing resin (A), a curing agent (B) and a dispersion of acrylic resin-coated silica particles (C), the dispersion of acrylic resin-coated silica particles (C) being an acrylic resin-coated silica particle dispersion obtained by reacting silica particles with a polymerizable unsaturated group (c1) and a polymerizable unsaturated monomer (c2) in a mass ratio of (c1):(c2)=20:80 to 90:10, the polymerizable unsaturated monomer (c2) including a specific polymerizable unsaturated monomer (c2-1) as at least a portion of its components, and the molecular weight of the resin covering the silica particles being 400 to 6000.

    Under layer composition and method of manufacturing semiconductor device

    公开(公告)号:US10083832B1

    公开(公告)日:2018-09-25

    申请号:US15468109

    申请日:2017-03-24

    Abstract: Under layer composition and methods of manufacturing semiconductor devices are disclosed. The method of manufacturing semiconductor device includes the following steps. A layer of an under layer composition is formed, wherein the under layer composition includes a polymeric material and a cross-linker, and the cross-linker includes at least one decomposable functional group. A curing process is performed on the layer of the under layer composition to form an under layer, wherein the cross-linker is crosslinked with the polymeric material to form a crosslinked polymeric material having the at least one decomposable functional group. A patterned photoresist layer is formed over the under layer. An etching process is performed to transfer a pattern of the patterned photoresist layer to the under layer. The under layer is removed by decomposing the decomposable functional group.

    CURING ACCELERATOR FOR OXIDATIVELY POLYMERIZABLE UNSATURATED RESIN, PRINTING INK AND COATING MATERIAL

    公开(公告)号:US20180237645A1

    公开(公告)日:2018-08-23

    申请号:US15752746

    申请日:2016-09-01

    Abstract: To provide a curing accelerator for an oxidatively polymerizable unsaturated resin which can decrease the amount of cobalt metal soap used and has curing performance equal to or higher than excellent curing performance of the cobalt metal soap, and a printing ink and a coating material using the same. A curing accelerator for an oxidatively polymerizable unsaturated resin including a manganese or cobalt complex (α) containing quinolinol compound ions represented by Structural Formula (1) as a ligand, and a printing ink and a coating material including the curing accelerator. In the formula, R1 is any of a hydrogen atom, a hydrocarbon group having 1 to 6 carbon atoms, an alkoxy group having 1 to 6 carbon atoms, a hydroxyl group, an amino group, a nitro group, a nitroso group, a sulfo group, and a halogen atom, and n is an integer of 1 to 6.

    Bioinert article and its use
    210.
    发明授权

    公开(公告)号:US10047230B2

    公开(公告)日:2018-08-14

    申请号:US15021250

    申请日:2014-09-08

    Abstract: An article, comprising a substrate and a polymer film attached to the substrate is provided, the polymer film comprising a first layer of a first polymer functionalized by a first functionalization compound covalently bound to said first polymer and bearing at least one catecholic group being present on a surface of the first layer. The polymer film is a layered film, a top layer of which is formed by the first layer, the layered film comprising at least one further layer of at least one further polymer functionalized by a further functionalization compound covalently bound to said further polymer and bearing at least one catecholic group being present on a surface of the at least one further layer, wherein an average ratio of catecholic groups per polymer molecule is equal to or less than 1 in case of the first polymer and greater than 1 in case of the further polymer.

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