Abstract:
A semiconductor accelerometer includes a mass portion formed at a center of a silicon plate, a frame portion formed around the circumference of the silicon plate so as to surround the mass portion and a diaphragm portion formed in the silicon plate between the mass portion and the frame portion so as to bridge the mass portion with the frame portion, one of major surfaces of the silicon plate serving as a common continuous major surface for the mass portion, frame portion and diaphragm portion. Piezoresistance elements are formed on the common continuous major surface at the diaphraqm portion and an additional Au film is formed on the common continuous major surface at the mass portion. The additional Au film constitutes in combination with the mass portion a weight which responds to an acceleration acting thereon. The mass of the additional Au film is selected in such a manner that the center of gravity of the weight is located within an area in the mass portion having a depth corresponding to the thickness of the diaphragm portion.
Abstract:
The present invention relates to microstructures fabricated from semiconductor material and having a flexible member which is excited into various modes of resonance and in which such resonance is read optically. By coupling the microstructure to a surface or material of interest, a drive means will excite the flexible member into a characteristic resonance which when read optically gives indication of certain physical phenomena influencing the surface or material of interest. The microstructures of the present invention may be configured to self-resonate, as a so-called active device, under certain conditions. Many different physical phenomena may be quantified using the device of the present invention.
Abstract:
An apparatus for diagnosing the characteristic of an acceleration sensor and a method for diagnosis thereof are disclosed. The acceleration sensor includes a movable electrode (or mass part) displaced in accordance with an acceleration and a fixed electrode disposed opposite to the movable electrode. In a diagnosis mode, a signal for diagnosis is applied to the fixed electrode so that an electrostatic force as a force corresponding to a predetermined acceleration is generated between the fixed electrode and the movable electrode. In the case where the acceleration sensor is sound, the movable electrode or mass part is normally displaced. A failure of the acceleration sensor, the deterioration thereof in performance, a change in characteristic thereof caused from the lapse of time, or the like is self-diagnosed by detecting a change in capacitance between the movable electrode and the fixed electrode upon generation of the diagnosis signal. The force corresponding to the predetermined acceleration may be an electromagnetic force or a mechanical oscillation based on a piezoelectric element.
Abstract:
The present invention relates to the fabrication of diaphragm pressure sensors utilizing silicon-on-insulator technology where recrystallized silicon forms a diaphragm which incorporates electronic devices used in monitoring pressure. The diaphragm is alternatively comprised of a silicon nitride having the necessary mechanical properties with a recrystallized silicon layer positioned thereon to provide sensor electronics.
Abstract:
The present invention relates to the fabrication of diaphragm pressure sensors utilizing silicon-on-insulator technology where recrystallized silicon forms a diaphragm which may incorporate electronic devices used in monitoring pressure. The diaphragm is alternatively comprised of a silicon nitride having the necessary mechanical properties with a recrystallized silicon layer positioned thereon to provide sensor electronics.
Abstract:
An accelerometer is fabricated by forming a proofmass and at least one associated hinge in a silicon substrate through a variety of a etching and bonding processes is disclosed. The processes entail ion implantation and formation of an oxide support layer below the proofmass, integrally bonding two complementary proofmass and substrate structures together, and then removing the oxide support layer to leave the proofmass supported by the hinge within the body of silicon material. The proofmass may be electrically connected to a lead extending through an etched recess in one of the substrates, and the proofmass may be electrically isolated or separated from the substrates by an oxide layer and by a change in conductivity type of the semiconductor material wherein the hinge is structurally mounted to the substrates. In a bond and etch back process, the wafer is processed, sawed in half, and then bonded together again wherein the complementary halves are joined to obtain the finished accelerometer. As part of the bond and etch-back process, an anchor for bridging the silicon substrate to an oxide support substrate includes using a selective epitaxy or non-selective epitaxy process to grow the polysilicon anchors.
Abstract:
A triaxial sensor substrate is adapted for use in measuring the acceleration and angular rate of a moving body along three orthogonal axes. The triaxial sensor substrate includes three individual sensors that are arranged in the plane of the substrate at an angle of 120 degrees with respect to one another. Each sensor is formed from two accelerometers having their sensing axes canted at an angle with respect to the plane of the substrate and further being directed in opposite directions. The rate sensing axes thus lie along three orthogonal axes. In order to reduce or eliminate angular acceleration sensitivity, a two substrate configuration may be used. Each substrate includes three accelerometers that are arranged in the plane of the substrate at an angle of 120 degrees with respect to one another. The sensing axes of the accelerometers of the first substrate are canted at an angle with respect to the plane of the first substrate toward the central portion thereof so that they lie along three skewed axes. Similarly, the sensing axes of the accelerometers of the second substrate are canted at an angle with respect to the plane of the second substrate away from the central portion thereof so that they lie along same three but oppositely directed axes. The sensing axes of the first and second substrates are aligned to prevent angular acceleration sensitivity.
Abstract:
A detector for detecting a physical quantity as a quantity of electricity has a detection portion, a portion for stimulating the detection portion and a signal processing portion, wherein a calibration signal is supplied from the signal processing portion to the detection portion via the stimulating portion so as to measure a specific response of the detection portion, whereby self-calibration and correction of the characteristic of the detector are performed in accordance with an amount of a change in the response.
Abstract:
A crash detection apparatus of an air bag system comprises a detection unit for detecting acceleration caused therein by an automobile and outputting electric signals corresponding to the acceleration, a discrimination unit for discriminating, from the signals from the detection unit, a crash signal which is outputted on the basis of the acceleration caused by crash of the automobile, the crash signal being inputted into an inflator to inflate an air bag. The detection unit is a capacitance type semiconductor detector comprising a pair of fixed electrodes and a cantilevered movable electrode disposed between the fixed electrodes and fixed at an end thereof, and a servo control unit is electrically connected to the detection unit so as to form a negative feedback loop, of a detection signal. The servo control unit serves for applying electric energy temporarily to the detection unit to cause electrostatic force in the detection means for restricting movement of the movable electrode caused by acceleration at an initial position thereof. A diagnostic unit is provided for diagnosing the crash detection apparatus on whether or not the crash detection apparatus functions correctly, the diagnostic unit being electrically connected to the servo control unit to input a diagnostic signal to the negative feedback loop thereby to apply electrostatic force for diagnosis between the fixed electrode and the movable electrode.
Abstract:
A capacitive micro-sensor includes a sandwich of three silicon wafers, a peripheral stripe of each surface of the central plate being assembled to a corresponding stripe of an opposing external plate through an insulating layer. At least one of the external plates forms a first electrode, the central plate forms a second electrode and at least one portion of the central plate forms a variable capacity with at least one of the external layers. At least one of the insulating layers is formed by a sandwich of a first insulating layer, a conductive layer and a second insulating layer, the conductive layer being associated with connection means.