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    Thin multi-chip flex module
    211.
    发明授权
    Thin multi-chip flex module 有权
    薄多芯片柔性模块

    公开(公告)号：US07724530B2

    公开(公告)日：2010-05-25

    申请号：US12317890

    申请日：2008-12-30

    Applicant: James E. Clayton ,  Zakaryae Fathi

    Inventor： James E. Clayton ,  Zakaryae Fathi

    IPC: H05K1/00 ,  H05K7/20

    CPC classification number: H05K1/189 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/07811 ,  H01L2924/15311 ,  H05K1/147 ,  H05K3/0061 ,  H05K2201/043 ,  H05K2201/056 ,  H05K2201/09109 ,  H05K2201/10159 ,  H05K2201/1056 ,  Y10T29/49124 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49179 ,  H01L2924/00

    Abstract: A multichip module comprises a multilayer substrate circuit having conductive patterns on its surface(s) to which microelectronic device(s) are attached. A part of the substrate is flexible and bifurcated. Two rigid members are attached lengthwise, one on either side of the substrate, and the free ends of the bifurcation are reflexed respectively about these members and bonded to them. Electrodes are located on the bifurcations so that they will be exposed outwardly and/or downwardly after reflexing. The module may further be provided with protective heat spreading covers. The electrodes and rigid members may be configured to engage a mating socket or they may be solderable to a printed circuit board.

    Abstract translation: 多芯片模块包括在其表面上具有导电图案的多层衬底电路，微电子器件附接到多个衬底电路。 基板的一部分是柔性的并且分叉。 两个刚性构件纵向连接，一个位于衬底的两侧，并且分叉的自由端分别围绕这些构件反射并结合到它们上。 电极位于分叉处，使得它们在反射之后将向外和/或向下暴露。 模块还可以设置有保护性散热罩。 电极和刚性构件可以被配置为接合配合插座，或者它们可焊接到印刷电路板。

    Stacked module systems
    212.
    发明授权
    Stacked module systems 有权
    堆叠模块系统

    公开(公告)号：US07656678B2

    公开(公告)日：2010-02-02

    申请号：US11263627

    申请日：2005-10-31

    Applicant: Julian Partridge ,  James Douglas Wehrly, Jr. ,  David L. Roper ,  Joseph Villani

    Inventor： Julian Partridge ,  James Douglas Wehrly, Jr. ,  David L. Roper ,  Joseph Villani

    IPC: H05K7/10 ,  H05K7/12

    CPC classification number: H01L23/49833 ,  H01L23/5385 ,  H01L25/0652 ,  H01L25/0657 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06579 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K3/305 ,  H05K2201/056 ,  H05K2201/10734 ,  Y02P70/613 ,  H01L2224/0401

    Abstract: The present invention stacks integrated circuit packages into circuit modules. In a preferred embodiment, solder paste and primary adhesive respectively are applied to selected locations on the flex circuitry. Supplemental adhesive is applied to additional locations on the flex circuitry, CSP, or other component. The flex circuitry and the CSP are brought into proximity with each other. During solder reflow operation, a force is applied and the CSP collapses toward the flex circuitry, displacing the primary adhesive and the supplemental adhesive. The supplemental adhesive establishes a bond providing additional support to the flex circuitry. In another embodiment, CSPs or other integrated circuit packages are bonded to each other or to other components with a combination of adhesives. A rapid bond adhesive maintains alignment of the bonded packages and/or components during assembly, and a structural bond adhesive provides additional strength and/or structural integrity to the bond.

    Abstract translation: 本发明将集成电路封装堆叠成电路模块。 在优选实施例中，焊膏和主粘合剂分别施加到柔性电路上的选定位置。 补充粘合剂应用于柔性电路，CSP或其他部件上的附加位置。 柔性电路和CSP彼此接近。 在回流焊接操作期间，施加力并且CSP朝向柔性电路折叠，使主粘合剂和补充粘合剂移位。 补充粘合剂建立了粘合，为柔性电路提供额外的支撑。 在另一个实施例中，CSP或其他集成电路封装通过粘合剂的组合彼此结合或连接到其它部件。 快速粘合粘合剂在组装期间保持粘合的包装和/或部件的对准，并且结构粘合粘合剂为粘合剂提供附加的强度和/或结构完整性。

    High capacity thin module system and method
    216.
    发明授权
    High capacity thin module system and method 有权
    大容量薄模块系统及方法

    公开(公告)号：US07606042B2

    公开(公告)日：2009-10-20

    申请号：US11869644

    申请日：2007-10-09

    Applicant: Paul Goodwin

    Inventor： Paul Goodwin

    IPC: H05K1/00

    CPC classification number: G11C5/04 ,  H01L25/105 ,  H01L2224/16225 ,  H01L2924/00011 ,  H01L2924/00014 ,  H05K1/0203 ,  H05K1/118 ,  H05K1/181 ,  H05K1/189 ,  H05K3/0061 ,  H05K2201/056 ,  H05K2201/1056 ,  H05K2201/10734 ,  H05K2201/2018 ,  H05K2203/1572 ,  H01L2224/0401

    Abstract: Multiple DIMM circuits or instantiations are presented in a single module. In some embodiments, memory integrated circuits (preferably CSPs) and accompanying AMBs, or accompanying memory registers, are arranged in two ranks in two fields on each side of a flexible circuit. The flexible circuit has expansion contacts disposed along one side. The flexible circuit is disposed about a supporting substrate or board to place one complete DIMM circuit or instantiation on each side of the constructed module. In alternative but also preferred embodiments, the ICs on the side of the flexible circuit closest to the substrate are disposed, at least partially, in what are, in a preferred embodiment, windows, pockets, or cutaway areas in the substrate. Other embodiments may only populate one side of the flexible circuit or may only remove enough substrate material to reduce but not eliminate the entire substrate contribution to overall profile. The flexible circuit may exhibit one or two more conductive layers, and may have changes in the layered structure of have split layers. Other embodiments may stagger or offset the ICs or include greater numbers of ICs.

    Abstract translation: 多个DIMM电路或实例被呈现在单个模块中。 在一些实施例中，存储器集成电路（优选CSP）和伴随的AMB或伴随的存储器寄存器被布置在柔性电路的每一侧的两个场中的两个等级中。 柔性电路具有沿着一侧设置的扩展触点。 柔性电路围绕支撑衬底或板设置，以在构造的模块的每一侧上放置一个完整的DIMM电路或实例化。 在替代但也优选的实施例中，最靠近基板的柔性电路一侧的IC至少部分地设置在优选实施例中在基板中的窗口，凹穴或切口区域中。 其他实施例可以仅填充柔性电路的一侧，或者可以仅移除足够的衬底材料以减少但不消除整个衬底对整体轮廓的贡献。 柔性电路可以表现出一个或两个更多的导电层，并且可以具有分层的层状结构的变化。 其他实施例可能错开或偏移IC或包括更多数量的IC。

    Optical pickup device, disk drive unit, and disk drive device
    218.
    发明授权
    Optical pickup device, disk drive unit, and disk drive device 失效
    光学拾取装置，磁盘驱动装置和磁盘驱动装置

    公开(公告)号：US07540003B2

    公开(公告)日：2009-05-26

    申请号：US10548837

    申请日：2005-02-21

    Applicant: Kiyoshi Omori ,  Satoshi Muto

    Inventor： Kiyoshi Omori ,  Satoshi Muto

    IPC: G11B17/03

    CPC classification number: G11B7/12 ,  G11B7/08582 ,  H05K1/028 ,  H05K2201/052 ,  H05K2201/053 ,  H05K2201/056 ,  H05K2201/09063 ,  H05K2201/10121

    Abstract: The present invention is directed to an optical pick-up apparatus used for recording/reproduction of an optical disk, which comprises an optical pick-up (17) caused to undergo feed operation in the radial direction of optical disk (2), and for performing write or read operation of information signals with respect to the rotating optical disk, and a flexible printed wiring board (45) having one end portion (45a) connected to the optical pick-up, and the other end portion (45d) provided in a manner extended in the feed direction of the optical pick-up. The flexible printed wiring board includes a folded portion (45g) folded back toward the bottom surface portion side of the optical pick-up, and a bending displacement portion (45h) for allowing folded position of the folded portion to undergo displacement in a manner following the feed operation of the optical pick-up, wherein a slit (47) for escaping a projected portion (17b) projected from the bottom surface portion of the optical pick-up is provided at the folded portion.

    Abstract translation: 本发明涉及一种用于记录/再现光盘的光学拾取装置，其包括在光盘（2）的径向上进行进给操作的光学拾取器（17），并且 执行关于旋转光盘的信息信号的写入或读取操作，以及具有连接到光学拾取器的一个端部（45a）的柔性印刷布线板（45），以及设置在光学拾取器中的另一个端部（45d） 在光学拾取器的进给方向上延伸的方式。 柔性印刷线路板包括朝向光学拾取器的底面部分侧折回的折叠部分（45g），以及弯曲位移部分（45h），用于允许折叠部分的折叠位置以下列方式进行位移： 光拾取器的进给操作，其中在折叠部分处设置用于从突出部分（17b）突出的用于从光学拾取器的底表面部分突出的狭缝（47）。

    Optical Pickup Device and Optical Disc Apparatus Using the Same
    219.
    发明申请
    Optical Pickup Device and Optical Disc Apparatus Using the Same 审中-公开
    光拾取装置及其使用的光盘装置

    公开(公告)号：US20090119692A1

    公开(公告)日：2009-05-07

    申请号：US12265742

    申请日：2008-11-06

    Applicant: Shinya Fujimori ,  Nobuyuki Maeda ,  Tetsuo Ito ,  Shoji Ueda ,  Shinya Iizaka ,  Akihiro Ooba ,  Shoji Matsumoto ,  Katsuhiko Kimura ,  Toru Shibata

    Inventor： Shinya Fujimori ,  Nobuyuki Maeda ,  Tetsuo Ito ,  Shoji Ueda ,  Shinya Iizaka ,  Akihiro Ooba ,  Shoji Matsumoto ,  Katsuhiko Kimura ,  Toru Shibata

    IPC: G11B33/12

    CPC classification number: G11B7/08 ,  H05K1/189 ,  H05K2201/056

    Abstract: An optical pickup device includes an optical system unit, a circuit board to control the optical system unit, and send and receive signals, a housing to place the optical system unit and the circuit board, and a flexible printed circuit board to connect electrically with the circuit board, extend to an outside from the housing, and fold back an extended portion, an extended direction of which is changed, in which the flexible printed circuit board is folded back so as to be faced to a side surface of the housing positioned at an extended proximal portion of the flexible printed circuit board, and a dead space of an optical disc apparatus to be mounted with the optical pickup device can be effectively used without making the apparatus large and thick, taking an inner space widely.

    Abstract translation: 一种光拾取装置，包括光学系统单元，用于控制光学系统单元的电路板以及发送和接收信号，用于放置光学系统单元和电路板的外壳以及柔性印刷电路板，以与 电路板从壳体延伸到外部，并且折回延伸方向延伸的延伸部分，其中柔性印刷电路板被折回，以便面对位于壳体的壳体的侧表面 柔性印刷电路板的延伸的近端部分以及与光学拾取装置一起安装的光盘装置的死空间可以有效地使用，而不会使装置大而厚，从而使内部空间广泛。

    Coil assembly, head suspension assembly, disk device, and method of manufacturing head suspension assembly
    220.
    发明授权
    Coil assembly, head suspension assembly, disk device, and method of manufacturing head suspension assembly 有权
    线圈组件，头悬挂组件，磁盘装置和制造磁头悬挂组件的方法

    公开(公告)号：US07518832B2

    公开(公告)日：2009-04-14

    申请号：US11413212

    申请日：2006-04-28

    Applicant: Akitoshi Suzuki

    Inventor： Akitoshi Suzuki

    IPC: G11B5/55

    CPC classification number: H05K1/118 ,  G11B5/4833 ,  G11B5/4846 ,  H05K1/147 ,  H05K3/363 ,  H05K2201/056

    Abstract: A coil assembly of a disk device includes a support frame on which a voice coil is fixed and a board unit connected to the support frame. The board unit has a main FPC extending from a base portion and a connecting portion extending from one side of an extended end portion of the main FPC. The connecting portion comprises a first connecting portion which extends in a longitudinal direction of the main FPC and has a plurality of first connection pads, a junction portion extending from the first connecting portion, and a second connecting portion which extends in the longitudinal direction of the main FPC from the junction portion and has a plurality of second connection pads. The first and second connecting portions are fixed to first and second support surfaces, respectively, of the support frame.

    Abstract translation: 盘装置的线圈组件包括固定有音圈的支撑框架和连接到支撑框架的板单元。 板单元具有从基部延伸的主FPC和从主FPC的延伸端部的一侧延伸的连接部。 连接部分包括沿着主FPC的纵向方向延伸的第一连接部分，并且具有多个第一连接焊盘，从第一连接部分延伸的接合部分和沿第一连接部分的纵向方向延伸的第二连接部分 主FPC，其具有多个第二连接焊盘。 第一和第二连接部分分别固定在支撑框架的第一和第二支撑表面上。

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