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    Planar reactor
    223.
    发明授权
    Planar reactor 有权

    公开(公告)号：US10134522B2

    公开(公告)日：2018-11-20

    申请号：US15046423

    申请日：2016-02-17

    Applicant: CYNTEC CO., LTD.

    Inventor： Wei Zhang ,  Chu-Keng Lin ,  Hung-Chih Lin ,  Hsieh-Shen Hsieh

    IPC: H01F27/08 ,  H01F27/10 ,  H01F27/02 ,  H01F17/00 ,  H01F17/06 ,  H01F27/24 ,  H01F27/34 ,  H01F27/29

    Abstract: A planar reactor includes a core and a coil. The core includes an upper board, a lower board and a pillar. The pillar is located between the upper board and the lower board. A winding space is located among the upper board, the lower board and the pillar. The coil is wound around the pillar and located in the winding space. The pillar and at least one of the upper board and the lower board are coplanar at a first side of the planar reactor. The pillar is sunk into the winding space from a second side of the planar reactor, wherein the first side is opposite to the second side. A first end of the coil is exposed from the first side of the planar reactor. A second end of the coil is hidden in the winding space partially or wholly at the second side of the planar reactor.

    Method of manufacturing magnetic core elements
    225.
    发明授权
    Method of manufacturing magnetic core elements 有权

    公开(公告)号：US10121585B2

    公开(公告)日：2018-11-06

    申请号：US14746854

    申请日：2015-06-23

    Applicant: CYNTEC CO., LTD.

    Inventor： Hsieh-Shen Hsieh ,  Shih-Feng Chien ,  Yu-Lun Chang ,  Chih-Hung Wei

    IPC: H01F41/02 ,  H01F27/24 ,  H01F27/245

    Abstract: A method of manufacturing magnetic core elements includes preparing a plurality of magnetic green sheets and a plurality of non-magnetic green sheets; alternately laminating the plurality of magnetic green sheets and non-magnetic green sheets directly upon one another, thereby forming a green sheet laminate; cutting the green sheet laminate into individual bodies with desired dimension; and sintering the individual bodies, thereby forming a magnetic core element with discretely distributed gaps.

    Stacked electronic structure
    226.
    发明授权
    Stacked electronic structure 有权

    公开(公告)号：US10034379B2

    公开(公告)日：2018-07-24

    申请号：US15297190

    申请日：2016-10-19

    Applicant: CYNTEC CO., LTD.

    Inventor： Chi-Feng Huang ,  Bau-Ru Lu ,  Da-Jung Chen

    IPC: H05K1/18 ,  H01F27/29 ,  H01F27/06

    Abstract: A stacked electronic structure is provided. The stacked electronic structure includes: a magnetic device, electronic devices, and a substrate. The substrate is disposed under the magnetic device. First and second electronic devices are disposed between a bottom surface of the magnetic device and a top surface of the substrate. The first and second electronic devices comprise first and third terminals, disposed on first and second surfaces thereof, respectively, electrically connected to the magnetic device without using the substrate. The first and second electronic devices also comprise second and fourth terminals, disposed on second and fourth surfaces thereof, respectively, electrically connected to the substrate.

    Optoelectronic module and method of producing same
    229.
    发明授权
    Optoelectronic module and method of producing same 有权

    公开(公告)号：US09772459B2

    公开(公告)日：2017-09-26

    申请号：US14970231

    申请日：2015-12-15

    Applicant: CYNTEC CO., LTD.

    Inventor： Ming-Che Wu

    IPC: G02B6/12 ,  G02B6/42

    CPC classification number: G02B6/4245 ,  G02B6/423 ,  G02B6/4246 ,  G02B6/428

    Abstract: An optoelectronic module includes an interposer base having first and second recesses formed on a specified surface thereof; a joint material layer filled in the first and second recesses; a first optoelectronic element placed in the first recess and coupled to the interposer base via the joint material layer, wherein an optical signal is emitted from or passes through a lateral surface of the first optoelectronic element; and a second optoelectronic element placed in the second recess and coupled to the interposer base via the joint material layer, wherein a lateral surface of the second optoelectronic element faces the lateral surface of the first optoelectronic element for coupling to and receiving the optical signal emitted from or passing through the lateral surface of the first optoelectronic element. A fixture is used to place the first and second optoelectronic elements into the first and second recesses while controlling some critical distances.

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