公开(公告)号：US20040203237A1

公开(公告)日：2004-10-14

申请号：US10789829

申请日：2004-02-27

Applicant: STMICROELECTRONICS LTD.

Inventor： Brian Laffoley

IPC: H01L021/302 ,  H01L021/461

CPC classification number: H05K1/141 ,  H01L24/05 ,  H01L24/16 ,  H01L2224/16058 ,  H01L2224/16105 ,  H01L2224/16108 ,  H01L2224/16238 ,  H01L2924/14 ,  H05K3/0052 ,  H05K3/3442 ,  H05K3/368 ,  H05K3/403 ,  H05K2201/049 ,  H05K2201/09181 ,  H05K2201/09427 ,  H05K2201/10727 ,  Y02P70/613 ,  Y10T29/4913 ,  Y10T29/49144 ,  Y10T29/49149 ,  Y10T29/49169 ,  H01L2924/00

Abstract: A method of mounting an electronic component having at least one contact extending across a part of its undersurface may include providing a support smaller in area than the undersurface of the component and having a contact pad for connection to the contact. The contact pad may have a first portion extending across an upper surface of the support adjacent one edge and a second portion extending from the edge across a side surface of the support. The method may also include positioning the electronic component and the support with the undersurface of the component adjacent the upper surface of the support. This is done so that the first portion of the contact pad is aligned with and spaced apart from a first portion of the contact, and the second portion of the contact pad is aligned with and disposed inwardly of a second portion of the contact.

Abstract translation: 安装具有延伸穿过其下表面的一部分的至少一个触点的电子部件的方法可以包括提供比部件的下表面更小的面积的支撑件，并具有用于连接到触头的接触垫。 接触垫可以具有延伸穿过支撑件的上表面邻近一个边缘的第一部分和从边缘延伸穿过支撑件的侧表面的第二部分。 该方法还可以包括将电子部件和支撑件定位成邻近支撑件的上表面的部件的下表面。 这样做使得接触垫的第一部分与接触件的第一部分对齐并且与接触垫的第一部分间隔开，并且接触垫的第二部分与接触件的第二部分对齐并设置在接触件的第二部分的内侧。

公开(公告)号：US20030231252A1

公开(公告)日：2003-12-18

申请号：US10325646

申请日：2002-12-18

Applicant: STMicroelectronics Ltd

Inventor： Keith Findlater ,  Jonathan Ephriam David Hurwitz

IPC: H04N005/335

CPC classification number: H04N5/363 ,  H04N5/3575 ,  H04N5/374 ,  H04N5/378

Abstract: A solid state image sensor may include a pixel array of an active pixel type including three transistors and a photodiode for each pixel. Pixel reset values may be read out one row at a time and stored in a frame store. Pixel signal values may also be read out a row at a time. The stored reset values may be subtracted, for example, by a read/write/modify circuit to remove kTC noise. The readout of the reset and signal values may be interleaved, and the offset between read and reset for each row may be selected to control frame exposure.

Abstract translation: 固态图像传感器可以包括每个像素包括三个晶体管和光电二极管的有源像素类型的像素阵列。 像素复位值可以一次读出一行并存储在帧存储器中。 像素信号值也可以一次读出一行。 可以例如通过读/写/修改电路减去存储的复位值以去除kTC噪声。 可以对复位和信号值的读出进行交织，并且可以选择每行的读取和复位之间的偏移量以控制帧曝光。

公开(公告)号：US20020191091A1

公开(公告)日：2002-12-19

申请号：US10156721

申请日：2002-05-28

Applicant: STMicroelectronics Ltd

Inventor： Jeff Raynor

IPC: H04N005/217

CPC classification number: H04N1/32128 ,  H04N2201/3205 ,  H04N2201/3215

Abstract: A method is for generating a key from the fixed pattern noise (FPN) of a CMOS image sensor to be used in generating a digital authentication signature. The key may be generated by temporarily disabling the FPN cancellation circuit that is conventionally included in the system, and generating a substantially nullblacknull image to produce a digitized FPN signal. The key may then be generated from characteristics of the FPN, such as by comparing pairs of pixels, for example.

Abstract translation: 一种用于从用于产生数字认证签名的CMOS图像传感器的固定模式噪声（FPN）产生密钥的方法。 可以通过临时禁用系统中常规包括的FPN消除电路并产生基本上“黑”的图像以产生数字化的FPN信号来产生密钥。 然后，可以例如通过比较像素对，从FPN的特征产生密钥。

公开(公告)号：US20020175703A1

公开(公告)日：2002-11-28

申请号：US10145390

申请日：2002-05-14

Applicant: STMicroelectronics Ltd.

Inventor： Ankur Bal

IPC: H03K019/173

CPC classification number: H03K19/17728

Abstract: A look-up table circuit includes address decoder circuitry that includes circuitry for utilizing the address decoder circuitry for producing secondary functions concurrently with operation of the address decoding operations. This eliminates or reduces secondary functions.

Abstract translation: 查找表电路包括地址解码器电路，其包括用于利用地址解码器电路与地址解码操作的操作同时产生辅助功能的电路。 这消除或减少了次要功能。

公开(公告)号：US20020091894A1

公开(公告)日：2002-07-11

申请号：US09917226

申请日：2001-07-27

Applicant: STMicroelectronics Ltd.

Inventor： Anurag Garg

IPC: G06F012/00 ,  G06F012/14 ,  G06F012/16 ,  G06F013/00 ,  G06F013/28

CPC classification number: G11C17/16 ,  G06F2213/0038 ,  G11C11/5692

Abstract: A high bit density, high speed, via and metal BE type programmable ROM core cell architecture for storing large amounts of non-volatile data and having a relatively fast turn around time is provided. The ROM core cell may include memory cells organized in rows and columns where each of the memory cells includes three transistors and two bit lines. The arrangement between the three transistors and two bit lines may be such that each of the memory cells is capable of storing four bits of data.

Abstract translation: 提供了用于存储大量非易失性数据并且具有相对较快的周转时间的高比特密度，高速度，通孔和金属BE型可编程ROM核心单元架构。 ROM核心单元可以包括以行和列组织的存储单元，其中每个存储单元包括三个晶体管和两个位线。 三个晶体管和两个位线之间的布置可以使得每个存储器单元能够存储四位数据。

公开(公告)号：US20020067415A1

公开(公告)日：2002-06-06

申请号：US09891134

申请日：2001-06-25

Applicant: STMicroelectronics Ltd

Inventor： Peter Brian Denyer ,  Jonathan Ephriam David Hurwitz

IPC: H04N005/335

CPC classification number: H04N5/363

Abstract: A method of operating a solid state image sensor having an image sensing array that includes a plurality of active pixels comprises resetting each pixel, and after successive time periods reading outputs from each pixel to obtain multiple sets of image data having different dynamic ranges without resetting the pixels between the successive time periods. The sets of image data are combined to obtain a resultant set of image data having a further dynamic range different from the individual dynamic ranges of the multiple data sets. Images are obtained having low noise, a wide dynamic range, and are resistant to lighting-induced flicker.

Abstract translation: 一种操作具有包括多个有源像素的图像感测阵列的固态图像传感器的方法包括重置每个像素，并且在连续的时间周期之后读取每个像素的输出以获得具有不同动态范围的多组图像数据，而不重置 连续时间段之间的像素。 组合图像数据组合以获得具有与多个数据集的各个动态范围不同的更大动态范围的图像数据的合成集合。 获得具有低噪声，宽动态范围并且耐受照明引起的闪烁的图像。

公开(公告)号：US12148778B2

公开(公告)日：2024-11-19

申请号：US17243195

申请日：2021-04-28

Applicant: STMICROELECTRONICS LTD.

Inventor： Yu-Tsung Lin

IPC: H01L27/146 ,  G02B3/00 ,  G03F7/00

Abstract: A method of forming a device, the method including: depositing a first photoresist layer over a substrate, forming an array of seed lenses by patterning and reflowing the first photoresist layer, a dimension of the array of seed lenses varying across the substrate, forming a second photoresist layer over the array of seed lenses, and forming a microlens array by patterning and reflowing the second photoresist layer.

公开(公告)号：US12001012B2

公开(公告)日：2024-06-04

申请号：US17238596

申请日：2021-04-23

Applicant: STMicroelectronics S.r.l. ,  STMicroelectronics Ltd

Inventor： Davide Terzi ,  Gianluca Mendicino ,  Dadi Sharon

IPC: G02B26/10 ,  B81B3/00 ,  G02B26/08 ,  G09G3/34 ,  H02N2/10 ,  H02N2/14 ,  H03H9/15 ,  H10N30/20 ,  H10N30/853

CPC classification number: G02B26/101 ,  B81B3/0021 ,  G02B26/0858 ,  G09G3/346 ,  H02N2/103 ,  H02N2/145 ,  H03H9/15 ,  H10N30/204 ,  B81B2201/032 ,  H10N30/8554

Abstract: Disclosed herein is a microelectromechanical (MEMS) device, including a rotor and a first piezoelectric actuator mechanically coupled to the rotor. The first piezoelectric actuator is electrically coupled between a first signal node and a common voltage node. A second piezoelectric actuator is mechanically coupled to the rotor, and is electrically coupled between a second signal node and the common voltage node. Control circuitry includes a drive circuit configured to drive the first and second piezoelectric actuators, a sense circuit configured to process sense signals generated by the first and second pizeoelectric actuators, and a multiplexing circuit. The multiplexing circuit is configured to alternate between connecting the drive circuit to the first piezoelectric actuator while connecting the sense circuit to the second piezoelectric actuator, and connecting the drive circuit to the second piezoelectric actuator while connecting the sense circuit to the first piezoelectric actuator.

公开(公告)号：US11887958B2

公开(公告)日：2024-01-30

申请号：US17403752

申请日：2021-08-16

Applicant: STMICROELECTRONICS LTD

Inventor： Cheng-Yang Su

IPC: H01L23/00

CPC classification number: H01L24/14 ,  H01L24/11 ,  H01L2224/11462 ,  H01L2224/1403 ,  H01L2224/1405

Abstract: A die including a first contact with a first shape (e.g., ring-shaped) and a second contact with a second shape (e.g., cylindrical shaped) different from the first shape. The first contact has an opening that extends through a central region of a surface of the first contact. A first solder portion is coupled to the surface of the first contact and the first solder portion has the first shape. A second solder portion is coupled to a surface of the second contact and the second solder portion has the second shape. The first solder portion and the second solder portion both have respective points furthest away from a substrate of the die. These respective points of the first solder portion and the second solder portion are co-planar with each other such that a standoff height of the die remains consistent when coupled to a PCB or an electronic component.

公开(公告)号：US11742437B2

公开(公告)日：2023-08-29

申请号：US17187510

申请日：2021-02-26

Applicant: STMICROELECTRONICS LTD ,  STMICROELECTRONICS PTE LTD

Inventor： David Gani ,  Yiying Kuo

IPC: H01L31/0203 ,  H01L31/18 ,  H01L31/0392 ,  H01L31/02 ,  H01L21/78

CPC classification number: H01L31/0203 ,  H01L21/78 ,  H01L31/02002 ,  H01L31/02005 ,  H01L31/0392 ,  H01L31/1876 ,  H01L31/1896

Abstract: The present disclosure is directed to a package, such as a wafer level chip scale package (WLCSP), with a die coupled to a central portion of a transparent substrate. The transparent substrate includes a central portion having and a peripheral portion surrounding the central portion. The package includes a conductive layer coupled to a contact of the die within the package that extends from the transparent substrate to an active surface of the package. The active surface is utilized to mount the package within an electronic device or to a printed circuit board (PCB) accordingly. The package includes a first insulating layer separating the die from the conductive layer, and a second insulating layer on the conductive layer.