公开(公告)号：US09960849B1

公开(公告)日：2018-05-01

申请号：US15388383

申请日：2016-12-22

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha N. Oster ,  Telesphor Kamgaing ,  Emanuel Cohen

IPC: H04B10/00 ,  H04B10/2575 ,  H04J14/00

CPC classification number: H04B10/2575

Abstract: Embodiments of the present disclosure may relate to a transmitter to transmit a radio frequency (RF) signal to a receiver via a dielectric waveguide where the transmitter includes a plurality of mixers to generate modulated RF signals and a combiner to combine the modulated RF signals. Embodiments may also include a receiver to receive, from a dielectric waveguide, a RF signal where the receiver includes a splitter to split the RF signal into a plurality of signal paths, a plurality of filters, and a plurality of demodulators. Embodiments may also include a dielectric waveguide communication apparatus that may include the transmitter and the receiver. Other embodiments may be described and/or claimed.

公开(公告)号：US20180097269A1

公开(公告)日：2018-04-05

申请号：US15282086

申请日：2016-09-30

Applicant: Intel Corporation

Inventor： Georgios C. Dogiamis ,  Sasha Oster ,  Telesphor Kamgaing ,  Adel A. Elsherbini ,  Johanna M. Swan ,  Shawna M. Liff ,  Aleksandar Aleksov ,  Brandon M. Rawlings ,  Richard J. Dischler

IPC: H01P3/16 ,  G06F1/18

CPC classification number: H01P3/122 ,  G06F1/182 ,  H01P3/14 ,  H01P3/16 ,  H01P11/006

Abstract: An apparatus comprises a plurality of waveguides, wherein the waveguides include a dielectric material; an outer shell; and a supporting feature within the outer shell, wherein the waveguides are arranged separate from each other within the outer shell by the supporting feature.

公开(公告)号：US09820384B2

公开(公告)日：2017-11-14

申请号：US14102676

申请日：2013-12-11

Applicant: Intel Corporation

Inventor： Sasha Oster ,  Robert L. Sankman ,  Charles Gealer ,  Omkar Karhade ,  John S. Guzek ,  Ravi V. Mahajan ,  James C. Matayabas, Jr. ,  Johanna Swan ,  Feras Eid ,  Shawna Liff ,  Timothy McIntosh ,  Telesphor Kamgaing ,  Adel Elsherbini ,  Kemal Aygun

IPC: H05K1/18 ,  H05K13/04 ,  H01L23/00 ,  H05K1/03 ,  G06F1/16 ,  H01L21/56

CPC classification number: H05K1/189 ,  G06F1/163 ,  H01L21/568 ,  H01L24/19 ,  H01L24/96 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/24137 ,  H01L2924/12042 ,  H01L2924/181 ,  H01L2924/18162 ,  H05K1/0393 ,  H05K1/181 ,  H05K1/185 ,  H05K13/0469 ,  H05K2201/0137 ,  H05K2203/1469 ,  Y10T29/49146 ,  H01L2924/00

Abstract: This disclosure relates generally to devices, systems, and methods for making a flexible microelectronic assembly. In an example, a polymer is molded over a microelectronic component, the polymer mold assuming a substantially rigid state following the molding. A routing layer is formed with respect to the microelectronic component and the polymer mold, the routing layer including traces electrically coupled to the microelectronic component. An input is applied to the polymer mold, the polymer mold transitioning from the substantially rigid state to a substantially flexible state upon application of the input.

公开(公告)号：US09773742B2

公开(公告)日：2017-09-26

申请号：US14132729

申请日：2013-12-18

Applicant: Intel Corporation

Inventor： Telesphor Kamgaing ,  Adel Elsherbini ,  Valluri Rao

IPC: H01Q21/06 ,  H01Q1/38 ,  H01L23/66 ,  H01Q21/00 ,  H01L21/48 ,  H01L23/498 ,  H01L21/52 ,  H01Q1/22 ,  H01Q23/00 ,  H01L23/00

CPC classification number: H01L23/66 ,  H01L21/4853 ,  H01L21/52 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L24/19 ,  H01L24/20 ,  H01L2223/6622 ,  H01L2223/6677 ,  H01L2223/6683 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/73267 ,  H01L2924/15192 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/18162 ,  H01L2924/3025 ,  H01Q1/2283 ,  H01Q1/38 ,  H01Q21/0006 ,  H01Q21/0093 ,  H01Q23/00

Abstract: Embodiments of an embedded mm-wave radio integrated circuit into a substrate of a phased array module are disclosed. In some embodiments, the phased array module includes a first set of substrate layers made of a first material. The mm-wave radio integrated circuit may be embedded in the first set of substrate layers. A second set of substrate layers may be coupled to the first set of substrate layers. The second set of substrate layers may be made of a second material that has a lower electrical loss than the first material. The second set of substrate layers may include a plurality of antenna elements coupled through vias to the mm-wave radio integrated circuit.

公开(公告)号：US20170170544A1

公开(公告)日：2017-06-15

申请号：US15445618

申请日：2017-02-28

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing

IPC: H01Q1/22 ,  H01Q21/00

CPC classification number: H01Q1/2283 ,  H01Q21/0025 ,  H01Q21/0087 ,  Y10T29/49016

Abstract: A high performance antenna incorporated on a microelectronic substrate by forming low-loss dielectric material structures in the microelectronic substrates and forming the antenna on the low-loss dielectric material structures. The low-loss dielectric material structures may be fabricated by forming a cavity in a build-up layer of the microelectronic substrate and filling the cavity with a low-loss dielectric material.

公开(公告)号：US20160308287A1

公开(公告)日：2016-10-20

申请号：US15197531

申请日：2016-06-29

Applicant: INTEL CORPORATION

Inventor： Telesphor Kamgaing ,  Adel A. Elsherbini

IPC: H01Q21/29 ,  H01Q3/24 ,  H01Q1/36 ,  H01Q21/06 ,  H01Q1/50 ,  H01Q3/26

CPC classification number: H01Q21/293 ,  H01L2224/16225 ,  H01P11/00 ,  H01Q1/36 ,  H01Q1/50 ,  H01Q3/24 ,  H01Q3/26 ,  H01Q15/08 ,  H01Q21/061 ,  H01Q21/065 ,  H01Q23/00 ,  H01Q25/00 ,  Y10T29/49016 ,  Y10T29/49018

Abstract: Embodiments of the present disclosure are directed to a single-package communications device that includes an antenna module with a plurality of independently selectable arrays of antenna elements. The antenna elements of the different arrays may send and/or receive data signals over different ranges of signal angles. The communications device may further include a switch module to separately activate the individual arrays. In some embodiments, a radio frequency (RF) communications module may be included in the package of the communications device. In some embodiments, the RF communications module may be configured to communicate over a millimeter-wave (mm-wave) network using the plurality of arrays of antenna elements.

Abstract translation: 本公开的实施例涉及一种单包装通信设备，其包括具有多个可独立选择的天线元件阵列的天线模块。 不同阵列的天线元件可以在不同的信号角度范围上发送和/或接收数据信号。 通信设备还可以包括用于单独地激活各个阵列的交换机模块。 在一些实施例中，射频（RF）通信模块可以包括在通信设备的包中。 在一些实施例中，RF通信模块可以被配置为使用多个天线元件阵列在毫米波（mm波）网络上进行通信。