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    Impedance matched reduced cross talk electrical connector system
    253.
    发明授权
    Impedance matched reduced cross talk electrical connector system 失效
    阻抗匹配减少串扰电连接器系统

    公开(公告)号：US5310363A

    公开(公告)日：1994-05-10

    申请号：US66974

    申请日：1993-05-25

    Applicant: Kenneth W. Brownell ,  Sterling A. Vaden

    Inventor： Kenneth W. Brownell ,  Sterling A. Vaden

    IPC: H04B3/32 ,  H05K1/02 ,  H01R23/02

    CPC classification number: H05K1/0228 ,  H01R13/6469 ,  H04B3/32 ,  H01R24/64 ,  H05K2201/09236 ,  H05K2201/09245 ,  H05K2201/10189 ,  Y10S439/941

    Abstract: There is provided an apparatus for reducing pair to pair cross talk which arises in electrical connectors due to closely spaced elongated parallel contacts while maintaining proper longitudinal balance and characteristic impedance of each pair. The cross talk which occurs within the connector is reduced by modifying certain circuit paths either inside or outside of the connector so that each conductor of a first pair which is parallel to and cross talking with an adjacent conductor of a second pair in the connector is relocated adjacent and parallel to the other conductor of the second pair over a predetermined distance. A substantial amount of incident reflected signal, due to impedance mismatch, is reduced by the addition of an additional circuit path, which carries the same signal as one of the relocated conductors of the first pair, at a position adjacent to the other conductor. It is preferred that the relocation of the circuit paths and the additional circuit path occur on a circuit board which is attached to the connector.

    Abstract translation: 提供了一种用于减少由于紧密间隔的细长平行触点而在电连接器中产生的配对串扰的装置，同时保持每对的适当的纵向平衡和特性阻抗。 通过修改连接器内部或外部的某些电路路径来减少连接器内的串扰，使得与连接器中的第二对的相邻导体平行并与之交叉的第一对导体的每个导体被重新定位 相邻并平行于第二对的另一导体预定距离。 由于阻抗不匹配而导致的大量入射反射信号通过在与另一导体相邻的位置附加一个附加电路路径来减少，该附加电路路径携带与第一对重定位导体之一相同的信号。 优选地，电路路径和附加电路路径的重定位发生在连接到连接器的电路板上。

    Electronic device
    257.
    发明授权
    Electronic device 有权

    公开(公告)号：US11982704B2

    公开(公告)日：2024-05-14

    申请号：US17216708

    申请日：2021-03-30

    Applicant: E Ink Holdings Inc.

    Inventor： Ruei-Huan Rao ,  Te-Lung Cheng

    IPC: G01R31/28 ,  H05K1/11

    CPC classification number: G01R31/2812 ,  H05K1/111 ,  H05K2201/09245 ,  H05K2201/09336 ,  H05K2201/09409 ,  H05K2201/10287

    Abstract: An electronic device includes a first substrate having a first bonding region, a first circuit, a second circuit, a third circuit, and a plurality of first conductive contacts. The first and second circuit are located at a first edge and a second edge of the first bonding region, the third circuit is located between the first and the second circuits. A second substrate having a second bonding region corresponding to the first bonding region in position and a fourth circuit, a fifth circuit, a sixth circuit, and a plurality of second conductive contacts. When the first substrate is bonded with the second substrate, the first circuit, the second circuit, the third circuit, the fourth circuit, the fifth circuit, and the sixth circuit form a loop, and the first and second conductive contacts are electrically connected to a plurality of signal circuits.

    INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR
    258.
    发明公开
    INTERMEDIATE CIRCUIT BOARD AND INTERMEDIATE ELECTRICAL CONNECTOR 审中-公开

    公开(公告)号：US20240147605A1

    公开(公告)日：2024-05-02

    申请号：US18499044

    申请日：2023-10-31

    Applicant: Hirose Electric Co., Ltd.

    Inventor： Xingyu CHENG ,  Shota YAMADA ,  Takafumi SUGAWARA ,  Nobuhiro TAMAI

    IPC: H05K1/02 ,  H01R13/6469

    CPC classification number: H05K1/0245 ,  H01R13/6469 ,  H05K1/0366 ,  H05K2201/09245

    Abstract: The intermediate circuit board has a plate-shaped substrate and a plurality of signal transmission line pairs for differential signal transmission extending on a major face of the substrate from one end to the other end of the substrate in the direction of connection to the counterpart connect bodies; the substrate has a fiber cloth formed by braiding a plurality of fibers used to reinforce the substrate in a mesh pattern and a plate-like member made of plastic having the fiber cloth embedded therein; the plurality of signal transmission line pairs have straight pairs and cross pairs disposed in an alternating manner in the width direction of the substrate; and the straight pairs and cross pairs, when viewed in the through-thickness direction of the substrate, are formed extending inclined at an angle relative to the fibers of the fiber cloth.

    System and method for skyrmion based logic device
    259.
    发明授权
    System and method for skyrmion based logic device 有权

    公开(公告)号：US11800647B1

    公开(公告)日：2023-10-24

    申请号：US17734058

    申请日：2022-04-30

    Applicant: Ceremorphic, Inc.

    Inventor： Akshaykumar Salimath ,  Sanghamitra Debroy ,  Venkat Mattela

    IPC: H05K1/02 ,  H05K3/10

    CPC classification number: H05K3/10 ,  H05K1/0296 ,  H05K2201/09236 ,  H05K2201/09245

    Abstract: A system and method for a logic device is disclosed. A plurality of nanotracks are disposed over a substrate, along a first axis, with at least a left nanotrack, a right nanotrack and a middle nanotrack disposed between the left nanotrack and the right nanotrack. At least one connector nanotrack is disposed to connect two adjacent nanotracks. An input value is defined at a first end of the plurality of nanotracks by selectively nucleating a skyrmion at the first end. Presence of the skyrmion is indicative of a first value and absence of the skyrmion indictive of a second value. The nucleated skyrmion moves towards the second end of the nanotrack when a charge current is passed along the first axis. The presence of the skyrmion sensed at the second end of the middle nanotrack indicates an output value of the first value.

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