Abstract:
A voltage regulator having an output terminal adapted to being connected to a load, including an operational amplifier having its non-inverting input connected to a reference voltage, and its inverting input connected to the output terminal, an inverting amplifier having its input connected to the output of the operational amplifier, a capacitive impedance connected between the input and the output of the inverting amplifier, a power switch controlled by the output of the inverter amplifier, arranged to connect the output terminal to a first supply voltage, said capacitive impedance including a short-circuitable portion associated with active short-circuit means when the current flowing through the load is greater than a predetermined current.
Abstract:
A biasing structure for a memory cell storage element, for setting an operating voltage at an accession electrode of the memory cell storage element. The biasing structure includes a biasing transistor coupled to the accession electrode and adapted to set the operating voltage based on a biasing voltage received at a control electrode of the biasing transistor, and a biasing voltage generator for generating the biasing voltage. The biasing voltage generator includes a feedback voltage regulation structure adapted track changes in a threshold voltage of the biasing transistor, so as to keep the operating voltage at the accession electrode of the memory cell storage element substantially stable against operating condition changes.
Abstract:
A device for controlling a voltage-controlled switch, including two circuits respectively for setting to the high level and for setting to the low level a control terminal of the voltage-controlled switch, one at least of the circuits including a power transistor capable of connecting the control terminal to a high, respectively low voltage, a bipolar control transistor having its emitter, respectively its collector, connected to the control terminal of the power transistor, the base of the control transistor being likely to receive a control current and a first diode connected between a first predetermined voltage smaller than the high voltage, and the base of the control transistor.
Abstract:
An integrated circuit including a buried layer of determined conductivity type in a plane substantially parallel to the plane of a main circuit surface, in which the median portion of this buried layer is filled with a metal-type material.
Abstract:
A multiposition microswitch that includes a cavity, a mobile portion made of a deformable material extending above the cavity, at least three conductive tracks extending on the cavity bottom, and a contact pad on the lower surface of the mobile part. The mobile part is capable of deforming, under the action of a stressing mechanism, from an idle position where the contact pad is distant from the conductive tracks to an on position from among several distinct on positions. The contact pad electrically connects, in each distinct on position, at least two of the at least three conductive tracks, at least one of the conductive tracks connected to the contact pad in each distinct on position being different from the conductive tracks connected to the contact pad in the other distinct on positions.
Abstract:
An electronic circuit, having a test mode in application of the “internal scan path” technique, includes a plurality of configurable cells and a control circuit. The electronic circuit is adapted to working in a standard mode of operation or in a test mode during which the control circuit is active and configures the configurable cells either in a functional state or in a chained state. The electronic circuit furthermore includes a validation circuit that performs the following operations successively when it receives an instruction for changing the mode of operation (TEST, FIN) of the electronic circuit: produce initialization signals (INIT1, INIT2, . . . , INITN) to command the initialization of all the configurable cells, and then produce a mode-changing signal (VAL).
Abstract:
The invention concerns a low-capacity vertical diode designed to be mounted by a front surface made in a semiconductor substrate (1), comprising a first zone projecting relative to the surface of the substrate including at least a semiconductor layer (3) doped with a type of conductivity opposite to that of the substrate, the upper surface of the semiconductor layer bearing a first solder bump (23). The diode comprises a second zone including on the substrate a thick strip conductor (16) bearing at least second solder bumps (24), said first and second solder bumps defining a plane parallel to the substrate plane.
Abstract:
This invention relates to an energy management system in an energy distribution network (DSTR) comprising an energy source (SE1) and a number of energy consumers (K1, K2, K3) distributed in different consumption locations, this system comprising the installation of distributed energy operation means (RXE) and distributed information transmission means (RTI) in each consumption location, and installation of centralised distributed energy management means (CGED) and centralised information transmission means (CTI) in the network (DSTR), transmitting control signals (SC) to the distributed energy operation means (RXE) passing through the distributed information transmission means (RTI).
Abstract:
A FIFO memory with a frequency f and a size of M n-bit words, to successively store n-bit words received serially at an input and give said words serially at an output in the order in which they are stored, comprises a basic memory with a frequency f/2, capable of simultaneously storing two n-bit words successively received at the input of the FIFO memory. The memory also comprises a storage circuit to store either one n-bit word received at the input of the FIFO memory or simultaneously two n-bit words produced by the basic memory and to produce, at the output OUT of the FIFO memory, one of the words that said storage circuit stores.
Abstract:
An integrated circuit with a D.C./D.C. voltage regulator and its manufacturing process, including at least one power stage provided with at least two transistors and with at least one capacitor connecting a control electrode of the transistor to a reference voltage, a same control stage of the regulator providing a control signal of said transistors, the power stage being formed under a rail that provides supply signals of the integrated circuit, the rail providing at least two limiting supply voltages coming from the outside of the integrated circuit and at least one voltage regulated by the voltage regulator.