Abstract:
The present invention is directed to data communication systems and methods. More specifically, embodiments of the present invention provide a CML that uses one or more equalization modules to apply equalization via secondary windings of transformers that are coupled, directly or indirectly, to the CML outputs. The equalization modules comprises a DAC component that generates switching signals based on control signals received from an external equalization module. The equalization module also includes switchable resistors and/or capacitors. The switching signals are used to select switchable resistors and/or capacitors. By switching resistors and/or capacitors at the equalization module, the outputs of the CML are equalized. There are other embodiments as well.
Abstract:
An integrated optical modulator device. The device can include a driver module coupled to an optical modulator. The optical modulator is characterized by a raised cosine transfer function. This optical modulator can be coupled to a light source and a bias control module, which is configured to apply an off-quadrature bias to the optical modulator. This bias can be accomplished by applying an inverse of the modulator transfer function to the optical modulator in order to minimize a noise variance. This compression function can result in an optimized increased top eye opening for a signal associated with the optical modulator. Furthermore, the optical modulator can be coupled to an EDFA (Erbium Doped Fiber Amplifier) that is coupled to a filter coupled an O/E (Optical-to-Electrical) receiver.
Abstract:
In an example, an integrated system-on-chip device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. A control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
Abstract:
The present disclosure provides a detailed description of techniques for implementing a low power buffer with gain boost. More specifically, some embodiments of the present disclosure are directed to a buffer with a stacked transistor configuration, wherein the first transistor receives an input signal and the second transistor receives a complement of the input signal. The first transistor is configured to generate a non-inverting response to the input signal, and the second transistor is configured to generate an inverting response to the complement of the input signal, and to generate a negative gds effect, enabling the buffer to exhibit low power and unity gain across a wide bandwidth. In other embodiments, the stacked transistor configuration can be deployed in a full differential implementation. In other embodiments, the buffer can include techniques for improving linearity, DC level shifts, capacitive input loading, and output slewing, settling, and drive capabilities.
Abstract:
In an example, the present invention includes an integrated system on chip device. The device has a redundancy block is configured to add at least redundancy bit as a function of one or more data bits associated with data for data error detection and correction data. In an example, the driver module is coupled to the signal processing blocking using a uni-directional multi-lane bus configured with N lanes, whereupon N is greater than M such that a difference between N and M represents a redundant lane or lanes. The device also has a mapping block configured to associate the M lanes to a plurality of selected laser devices for a silicon photonics device.
Abstract:
The present invention is directed to optical communication systems and methods thereof. In various embodiments, the present invention provides method for linearizing Mach Zehnder modulators by digital pre-compensation and adjusting the gain of the driver and/or the modulation index. The pre-compensation can be implemented as a digital pre-compensation algorithm, which is a part of an adaptive feedback loop. There are other embodiments as well.
Abstract:
This disclosure relates to the field of amplifiers for multi-level optical communication and more particularly to techniques for trans-impedance amplifiers (TIA) with gain control. The claimed embodiments address the problem of implementing a low cost TIA that exhibits high linearity, low noise, low power, and wide bandwidth. More specifically, some claims are directed to approaches for providing TIA gain control using a plurality of inverter-based replica gain control cells controlled by a feedback loop to manage the current into the amplifying output stage and thereby the TIA output voltage.
Abstract:
The present invention includes a linear driver for Mach-Zehnder modulator (MZM) configured in a differential form with two waveguides carrying two traveling waves. Each waveguide comprises a MZM material configured with either a single segment in 3×MZM length or two split segments with one in 2×MZM length and another one in either 1× or 2×MZM length. By coupling a DC current source supplied with a modulation voltage with each segment thereof for providing electrical modulation signal overlapping with each of the two traveling waves. The modulated traveling waves in the two waveguides then are combined in one output signal by a multimode interference coupler. By properly choosing the configuration of MZM linear segments with optional length ratios, a low power consumption MZM linear driver provides either NRZ or PAM-4 modulation scheme to the input optical signals for telecommunication through silicon photonics.
Abstract:
The present invention is directed to signal processing system and electrical circuits. According to various embodiments, a DLL system includes a delay line provides multiple output signals associated with different clock phases. The delay line may be adjusted using a pair of bias voltages. A phase detector systems generates the bias voltages using the multiple output signals from the delay line. The multiple output signals include signals associated with the first phase, the last phase, and two adjacent phases. There are other embodiments as well.
Abstract:
In an example, the present invention includes an integrated system on chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. In an example, the device has a driver interface provided on the substrate member and coupled to the driver module and configured to be coupled to a silicon photonics device. The device also has an interface configured to communicate between the silicon photonics device and the control block.