Abstract:
An apparatus for providing multiple screens and a method of dynamically configuring multiple screens are provided. The apparatus for providing multiple screens includes a digital signal processing module which receives predetermined information and restores a service based on the predetermined information, a service processing module which displays one or more logical screens associated with the service, and an output module which arranges the logical screens provided by the service processing module at different locations on a display screen. The logical screens have attribute information indicating whether the logical screens are visible on the display screen.
Abstract:
An apparatus for providing multiple screens and a method of dynamically configuring the multiple screens are provided. The apparatus for providing multiple screens uses flags included transferred packets in order to dynamically configure multiple screens that provide a plurality of contents on a physical display device and a method of dynamically configuring multiple screens. The apparatus for providing multiple screens includes a digital signal processing module which determines whether an application included in data information can be executed on a screen on the basis of received data information, and an operational module which operates the application on the screen on the basis of the determination result.
Abstract:
A field effect transistor can include a vertical channel protruding from a substrate including a source/drain region junction between the vertical channel and the substrate, and an insulating layer extending on a side wall of the vertical channel toward the substrate to beyond the source/drain region junction. The transistor can also include a nitride layer extending on the side wall away from the substrate to beyond the insulating layer, a second insulating layer extending on the side wall that is separated from the channel by the nitride layer, and a gate electrode extending on the side wall toward the substrate to beyond the source/drain region junction. Related methods are also disclosed.
Abstract:
A thermistor is disclosed, which comprises a resistance element having upper and lower surfaces and showing a resistance varying characteristics according to the change of temperature; first and second conductive layers formed on the upper surface of the resistance element and engaged to each other with a non-conductive gap interposed therebetween; first and second electrodes formed on the lower surface of the resistance element and electrically separated from each other; a first connector for electrically connecting the first conductive layer to the first electrode; and a second connector for electrically connecting the second conductive layer to the second electrode. Thus, the thermistor has a structurally point-symmetric shape, so it is possible to prevent the Tombstone phenomenon, caused by an asymmetric structure. Since the conductive layers having opposite polarities are engaged to each other with the non-conductive gap therebetween, the flow of current is increased and the resistance of the thermistor is decreased.
Abstract:
A method of fabricating a semiconductor device including a high-k dielectric for as a gate insulating layer is provided. The method includes forming a high-k dielectric layer and a conductive layer on a substrate, dry etching a portion of the conductive layer, performing a process to increase a wet etch rate of a remaining portion of the conductive layer, and forming a conductive layer pattern by wet etching the remaining portion of the conductive layer after performing the plasma process or the ion implantation. The process to increase the wet etch rate of the conductive layer including a plasma process and/or an ion implantation on the remaining portion of the conductive layer.
Abstract:
PTC conductive polymer composition includes organic polymer containing polyolefin components essentially consisting of 30˜40 w % high density polyethylene (HDPE), 20˜40 w % low density polyethylene (LDPE) and 10˜30 w % ethylene-acrylic-acid (EAA) or ethylene-vinyl-acetate (EVA), and 20˜30 w % high or low density polyethylene which is denaturated into maleic anhydride compound; 60˜120 w % electrical conductive particles dispersed into the organic polymer, the electrical conductive particles by weight of the organic polymer; and 0.2˜0.5 w % peroxidic cross-linking agent added for cross-linking reaction by weight of the organic polymer. Thus, it becomes possible to control PTC characteristics such as switching temperature and trip time of an electrical device by suitably adjusting an added amount of the polyethylene, which is denaturated into maleic anhydride compound.
Abstract:
High dielectric layers formed from layers of hafnium oxide, zirconium oxide, aluminum oxide, yttrium oxide, and/or other metal oxides and silicates disposed on silicon substrates or ozone oxide layers over silicon substrates may be nitrided and post thermally treated by oxidation, annealing, or a combination of oxidation and annealing to form high dielectric layers having superior mobility and interfacial characteristics.
Abstract:
A dielectric multilayer suitable for improving a performance of a microelectronic device and a method of fabricating the dielectric multilayer are provided. The dielectric multilayer of the microelectronic device comprises a composite layer which is formed of oxides of two or more different elements and in which a laminar structure is not formed, and a single layer which is formed on at least one surface of the composite layer and is formed of an oxide of a single element.
Abstract:
There are provided methods of fabricating a metal silicate layer on a semiconductor substrate using an atomic layer deposition technique. The methods include performing a metal silicate layer formation cycle at least one time in order to form a metal silicate layer having a desired thickness. The metal silicate layer formation cycle includes an operation of repeatedly performing a metal oxide layer formation cycle K times and an operation of repeatedly performing a silicon oxide layer formation cycle Q times. K and Q are integers ranging from 1 to 10 respectively. The metal oxide layer formation cycle includes the steps of supplying a metal source gas to a reactor containing the substrate, exhausting the metal source gas remaining in a reactor to clean the inside of the reactor, and then supplying an oxide gas into the reactor. The silicon oxide layer formation cycle includes supplying a silicon source gas, exhausting the silicon source gas remaining in the reactor to clean the inside of the reactor, and then supplying an oxide gas into the reactor.
Abstract:
High dielectric layers formed from layers of hafnium oxide, zirconium oxide, aluminum oxide, yttrium oxide, and/or other metal oxides and silicates disposed on silicon substrates may be nitrided and post thermally treated by oxidation, annealing, or a combination of oxidation and annealing to form high dielectric layers having superior mobility and interfacial characteristics.