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    MEMS device and interconnects for same
    281.
    发明申请
    MEMS device and interconnects for same 失效
    MEMS器件和互连相同

    公开(公告)号：US20070103028A1

    公开(公告)日：2007-05-10

    申请号：US11540485

    申请日：2006-09-29

    Applicant: Alan Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory U'Ren ,  Stephen Zee

    Inventor： Alan Lewis ,  Manish Kothari ,  John Batey ,  Teruo Sasagawa ,  Ming-Hau Tung ,  Gregory U'Ren ,  Stephen Zee

    IPC: H02N11/00

    CPC classification number: B81B7/0006 ,  B81B7/007 ,  B81B2201/047 ,  G02B26/001 ,  H02N1/006

    Abstract: A microelectromechanical systems device having an electrical interconnect between circuitry outside the device and at least one of an electrode and a movable layer within the device. At least a portion of the electrical interconnect is formed from the same material as a conductive layer between the electrode and a mechanical layer of the device. In an embodiment, this conductive layer is a sacrificial layer that is subsequently removed to form a cavity between the electrode and the movable layer. The sacrificial layer is preferably formed of molybdenum, doped silicon, tungsten, or titanium. According to another embodiment, the conductive layer is a movable reflective layer that preferably comprises aluminum.

    Abstract translation: 一种微机电系统装置，其具有在所述装置外部的电路和所述装置内的电极和可移动​​层中的至少一个之间的电互连。 电互连的至少一部分由与电极和器件的机械层之间的导电层相同的材料形成。 在一个实施例中，该导电层是牺牲层，其随后被去除以在电极和可移动​​层之间形成空腔。 牺牲层优选由钼，掺杂硅，钨或钛形成。 根据另一实施例，导电层是优选包括铝的可移动反射层。

    MEMS devices having support structures and methods of fabricating the same
    282.
    发明申请
    MEMS devices having support structures and methods of fabricating the same 有权
    具有支撑结构的MEMS器件及其制造方法

    公开(公告)号：US20070047900A1

    公开(公告)日：2007-03-01

    申请号：US11491490

    申请日：2006-07-21

    Applicant: Jeffrey Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

    Inventor： Jeffrey Sampsell ,  Clarence Chui ,  Manish Kothari ,  Mark Miles ,  Teruo Sasagawa ,  Wonsuk Chung ,  Ming-Hau Tung

    IPC: G02B6/00

    CPC classification number: G02B26/001 ,  B81B3/007 ,  B81B2201/047 ,  B81B2203/0307 ,  B81B2203/053

    Abstract: Embodiments of MEMS devices comprise a conductive movable layer spaced apart from a conductive fixed layer by a gap, and supported by rigid support structures, or rivets, overlying depressions in the conductive movable layer, or by posts underlying depressions in the conductive movable layer. In certain embodiments, both rivets and posts may be used. In certain embodiments, these support structures are formed from rigid inorganic materials, such as metals or oxides. In certain embodiments, etch barriers may also be deposited to facilitate the use of materials in the formation of support structures which are not selectively etchable with respect to other components within the MEMS device.

    Abstract translation: MEMS器件的实施例包括通过间隙与导电固定层间隔开的导电可移动层，并且由导电可移动层中的上凹部的刚性支撑结构或铆钉支撑，或由导电可移动层中的凹陷下方的柱支撑。 在某些实施例中，可以使用铆钉和柱。 在某些实施方案中，这些支撑结构由诸如金属或氧化物的刚性无机材料形成。 在某些实施例中，还可以沉积蚀刻阻挡层以促进材料在形成相对于MEMS器件内的其它部件不能选择性蚀刻的支撑结构的形成中的使用。

    Methods of fabricating interferometric modulators by selectively removing a material
    287.
    发明申请
    Methods of fabricating interferometric modulators by selectively removing a material 失效
    通过选择性去除材料制造干涉式调制器的方法

    公开(公告)号：US20060077502A1

    公开(公告)日：2006-04-13

    申请号：US11090778

    申请日：2005-03-25

    Applicant: Ming-Hau Tung ,  Manish Kothari ,  William Cummings

    Inventor： Ming-Hau Tung ,  Manish Kothari ,  William Cummings

    IPC: B29D11/00

    CPC classification number: B81C1/00174 ,  B81B2201/047 ,  B81B2203/0181 ,  B81C1/00182 ,  B81C2201/0109 ,  G02B26/001

    Abstract: Methods for making MEMS devices such as interferometric modulators involve selectively removing a sacrificial portion of a material to form an internal cavity, leaving behind a remaining portion of the material to form a post structure. The material may be blanket deposited and selectively altered to define sacrificial portions that are selectively removable relative to the remaining portions. Alternatively, a material layer can be laterally recessed away from openings in a covering layer. These methods may be used to make unreleased and released interferometric modulators.

    Abstract translation: 用于制造诸如干涉式调制器的MEMS器件的方法包括选择性地去除材料的牺牲部分以形成内部空腔，留下材料的剩余部分以形成柱状结构。 该材料可以被毯式沉积并选择性地改变以限定相对于其余部分可选择性地移除的牺牲部分。 替代地，材料层可以横向凹入远离覆盖层中的开口。 这些方法可用于制造未释放和释放的干涉式调制器。

    Measurement of the dynamic characteristics of interferometric modulators
    288.
    发明申请
    Measurement of the dynamic characteristics of interferometric modulators 失效
    干涉式调制器的动态特性测量

    公开(公告)号：US20060077401A1

    公开(公告)日：2006-04-13

    申请号：US11223824

    申请日：2005-09-09

    Applicant: Manish Kothari ,  Yongkang Tang ,  Brian Gally ,  William Cummings

    Inventor： Manish Kothari ,  Yongkang Tang ,  Brian Gally ,  William Cummings

    IPC: G01B11/14

    CPC classification number: G09G3/3466 ,  G02B26/001 ,  G09G3/006 ,  G09G2310/06

    Abstract: Various systems and methods of lighting a display are disclosed. In one embodiment, for example, a method includes applying a voltage waveform to the interferometric modulators, applying a voltage pulse to the interferometric modulators, detecting reflectivity of light from the interferometric modulators, and determining one or more quality parameters of the interferometric modulators based on the detecting reflectivity of light, where the applied voltage pulse causes the interferometric modulators to vary between an actuated and a non-actuated state, or an non-actuated state and an actuated state.

    Abstract translation: 公开了照明显示器的各种系统和方法。 在一个实施例中，例如，一种方法包括将电压波形施加到干涉式调制器，向干涉式调制器施加电压脉冲，检测来自干涉式调制器的光的反射率，以及基于以下步骤确定干涉式调制器的一个或多个质量参数： 光的检测反射率，其中所施加的电压脉冲导致干涉式调制器在致动和非致动状态之间变化，或者非致动状态和致动状态。

    Apparatus and method for arranging devices into an interconnected array
    289.
    发明申请
    Apparatus and method for arranging devices into an interconnected array 审中-公开
    将设备布置成互连阵列的装置和方法

    公开(公告)号：US20060077126A1

    公开(公告)日：2006-04-13

    申请号：US11078025

    申请日：2005-03-11

    Applicant: Manish Kothari

    Inventor： Manish Kothari

    IPC: G09G3/04

    CPC classification number: B81B7/04 ,  B81B2201/045 ,  G02B26/001 ,  G02F1/13336 ,  G09G3/3466 ,  G09G2300/026 ,  G09G2300/06

    Abstract: Apparatus and methods for arranging devices having a reduced area between adjacent devices are provided. In an exemplary embodiment, display devices in an array are provided wherein a gap between the display devices is reduced to less than or equal to ⅛th of a pixel pitch. Exemplary embodiments use wire bonding to provide an electrical connection to an active area of the display to components on the display backplate, thereby reducing the ledge area and gap between display devices in an interconnected array.

    Abstract translation: 提供了用于布置在相邻设备之间具有减小的面积的设备的设备和方法。 在示例性实施例中，提供阵列中的显示装置，其中显示装置之间的间隙减小到小于或等于像素间距的1/8以上。 示例性实施例使用引线接合来提供与显示器背板上的部件的显示器的有效区域的电连接，由此减小了互连阵列中的突出区域和显示设备之间的间隙。

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