摘要:
The present invention relates to a door striker unit for a vehicle. The door striker unit for a vehicle includes a retainer connected to a rear side of the vehicle's side outer panel, a engaging plate connected to a rear surface of the retainer, and a striker connected to the engaging plate and positioned on a front side of the vehicle's side outer panel, wherein the engaging plate includes a welding portion welded to the retainer, an engaging portion having an integral bolt engaging portion for connection with the striker, and a connecting portion integrally connecting the welding portion and the engaging portion, wherein the connecting portion comprises a protruding curved portion.
摘要:
Semiconductor device having an on-chip type electrostatic discharge (ESD) protection circuit and a method of manufacturing the same are provided. The on-chip type ESD protection circuit may include a first junction diode having a first conductive type region contacting a second conductive type region in a semiconductor substrate, and a first schottky diode having a metallic material layer arranged on and contacting the first conductive type region of the semiconductor substrate.
摘要:
A stabilizer circuit for a high-voltage discharge lamp is provided. The stabilizer comprises an electromagnetic interference (EMI) filter; a rectifying unit; a power factor correction (PFC) circuit; a buck converter; a commutator; an igniter; a high-voltage discharge lamp; a current detector; a voltage detector; an igniter voltage controller for receiving the voltage output from the igniter and controlling the voltage when abnormality in the high-voltage discharge lamp occurs.
摘要:
A method of fabricating a semiconductor device having a non-volatile memory cell includes forming an insulation layer as an uppermost/outermost portion of the memory cell to enhance the charge retention capability of the memory cell. The insulation layer is formed after the gate structure and integrate dielectric of the non-volatile memory cell, and a gate of a logic transistor are formed. The insulation layer thus enhances the function of the intergrate dielectric. Subsequently, a conductive layer is formed on the substrate including over the gate of the logic transistor. A silicide layer is then formed on the gate of the logic transistor and on the substrate adjacent opposite sides of the gate. The insulation layer thus also serves prevent the formation of a silicide layer on the non-volatile memory cell.
摘要:
An EEPROM includes a semiconductor substrate and a device isolation region defining first, second and third active regions in the semiconductor substrate. The EEPROM also includes at least one first insulation region in at least one first trench in the first active region. A floating gate insulation layer is disposed on the at least one first insulation region and the first, second and third active regions and a floating gate conduction layer is disposed on the floating gate insulation layer. Impurity-containing regions may be disposed in each of the first, second and third active regions at respective sides of the floating gate conduction layer. The floating gate insulation layer may include at least one thinned portion proximate the at least one first insulation region, which may aid Fowler-Nordheim tunneling at this site.
摘要:
A dual port semiconductor memory device, including PMOS scan transistors, is provided. The dual port semiconductor memory device includes two PMOS transistors, two NMOS pull-down transistors, two NMOS pass transistors, and a PMOS scan transistor. The scan transistor being PMOS, noise margins can be improved. In addition, these seven transistors are arranged in two n-wells and 2 p-wells, while n-wells and p-wells are arranged in series and in alternating fashion. Therefore, the length of a memory cell along the minor axis of the memory cell is relatively short. This memory cell layout helps shorten the length of a bit line by arranging a pair of bitlines in parallel with well boundaries, i.e., in the direction of the short axis of the memory cell, and makes it possible to prevent crosstalk between a bitline and a complementary bitline by arranging conductive lines between the bitline and the complementary bitline.
摘要:
A dual port semiconductor memory device, including PMOS scan transistors, is provided. The dual port semiconductor memory device includes two PMOS transistors, two NMOS pull-down transistors, two NMOS pass transistors, and a PMOS scan transistor. The scan transistor being PMOS, noise margins can be improved. In addition, these seven transistors are arranged in two n-wells and 2 p-wells, while n-wells and p-wells are arranged in series and in alternating fashion. Therefore, the length of a memory cell along the minor axis of the memory cell is relatively short. This memory cell layout helps shorten the length of a bit line by arranging a pair of bitlines in parallel with well boundaries, i.e., in the direction of the short axis of the memory cell, and makes it possible to prevent crosstalk between a bitline and a complementary bitline by arranging conductive lines between the bitline and the complementary bitline.
摘要:
A silicon-on-insulator (SOI) device and a method for manufacturing the same includes a substrate, which includes a base layer, a buried oxide layer, and a semiconductor layer, and an isolation layer which is formed in a trench that defines an active region on the semiconductor layer. The trench comprises a first region having a depth smaller than the thickness of the semiconductor layer and a second region having a depth as much as the thickness of the semiconductor layer. The isolation layer includes an oxide layer and a nitride liner that are sequentially formed along the surface of the trench and a dielectric layer that fills the trench.
摘要:
A method of fabricating a semiconductor device having a non-volatile memory cell includes forming an insulation layer as an uppermost/outermost portion of the memory cell to enhance the charge retention capability of the memory cell. The insulation layer is formed after the gate structure and integrate dielectric of the non-volatile memory cell, and a gate of a logic transistor are formed. The insulation layer thus enhances the function of the intergate dielectric. Subsequently, a conductive layer is formed on the substrate including over the gate of the logic transistor. A silicide layer is then formed on the gate of the logic transistor and on the substrate adjacent opposite sides of the gate. The insulation layer thus also serves prevent the formation of a silicide layer on the non-volatile memory cell.
摘要:
The present invention relates to an SOI semiconductor device and a method for fabricating an SOI semiconductor device, in which the portions formed with silicide layers are laterally restricted by spacers to a predetermined range in the diffusion regions to be used for diodes or well resistors. In this manner, it is possible to fix the length of distance between the sides of a silicide layer and a diffusion region, greater than that available in the prior art techniques, thereby minimizing power leakage at the sides of the diffusion regions. In the SOI semiconductor device thus constructed, the diffusion regions to be used for diodes (or well resistors) are constructed with spacers in a double junction structure of different density of impurity layers (for instance, a P− or N− layer respectively surrounds a P+ or N+ layer), in other words, only onto a high density of impurity layer, the P+ or N+ layer, or in a single junction structure in which the spacers restrict a range of space for forming the silicide layer in the diffusion region.
摘要翻译:SOI半导体器件及SOI半导体器件的制造方法本发明涉及一种SOI半导体器件的制造方法,其中由硅化物层形成的部分在隔离层中被横向限制在用于二极管或阱电阻器的扩散区域中的预定范围内。 以这种方式,可以固定硅化物层和扩散区域的侧面之间的距离长度,大于现有技术中可用的距离,从而最小化扩散区域侧面的功率泄漏。 在如此构造的SOI半导体器件中,用于二极管(或阱电阻器)的扩散区域由具有不同密度杂质层的双结结构中的间隔物构成(例如,P-或N-层分别围绕 P +或N +层),换句话说,仅在高密度的杂质层,P +或N +层上,或在单结结构中,其中间隔物限制在扩散区域中形成硅化物层的空间范围。