Abstract:
A multicast communication method for relaying a multicast packet from a first member node to a plurality of second member nodes in a wireless network is provided, wherein the first member node and the second member nodes belong to a same group and can communicate with each other via a plurality of non-member nodes. In the multicast communication method, a number and distances of the second member nodes are recorded. The multicast packet is received from the first member node, and a waiting time is determined according to the number and the distances of the second member nodes. Whether the multicast packet is broadcasted by any other relay node is monitored during the waiting time. If the multicast packet is already broadcasted to all the second member nodes by other relay node, the multicast packet is not broadcasted; otherwise, the multicast packet is broadcasted after the waiting time elapses.
Abstract:
A flash memory and a manufacturing method and an operating method thereof are provided. The flash memory includes a substrate, a charge-trapping structure, a first gate, a second gate, a third gate, a first doped region and a second doped region. The substrate has a protrusion portion. The charge-trapping structure is disposed over the substrate. The first gate and the second gate are disposed respectively over the charge-trapping structure at two sides of the protrusion portion. The top surfaces of the first gate and the second gate are lower than the top surface of the charge-trapping structure located on the top of the protrusion portion. The third gate is disposed over the charge-trapping structure located on the top of the protrusion portion. The first doped region and the second doped region are disposed respectively in the substrate at two sides of the protrusion portion.
Abstract:
Data processing method and system with multiple input units are disclosed. The method comprises the following steps. First of all, a plurality of antenna boards which are partially overlapped and form an integration antenna board with multiple regions are provided. Then signals from the antenna boards are processed through signal processing units corresponding to the antenna boards, and the processed signals are transmitted to an integration processing unit. Finally, the processed signals are integrated and processed via the integration processing unit and integrated signals of the integration antenna board are outputted.
Abstract:
A semiconductor device includes a semiconductor substrate, wherein the semiconductor substrate includes a core area for core circuits and a peripheral area for peripheral circuits. The semiconductor device includes a core oxide on the semiconductor substrate in the core area, a portion of the core oxide being nitrided, a first polysilicon pattern on the core oxide, an I/O oxide including pure oxide on the semiconductor substrate in the peripheral area, and a second polysilicon pattern on the I/O oxide.
Abstract:
A rectifier driving circuit of the present invention, has a first driving element and a second driving element, switching element comprises a FET, a first driving element comprises the voltage drop resistor, a second driving element comprises the series-connected circuit of the diodes, the driving element for driving a FET, may be achieved rectify function.
Abstract:
A novel method for enhancing interface adhesion between adjacent dielectric layers, particularly between an etch stop layer and an overlying dielectric layer having a low dielectric constant (k) in the formation of metal interconnects during the fabrication of integrated circuits on semiconductor wafer substrates. The method may include providing a substrate, providing an etch stop layer on the substrate, providing an oxygen-rich dielectric pre-layer on the etch stop layer and providing a major dielectric layer on the oxygen-rich dielectric pre-layer. Metal interconnects are then formed in the dielectric layers. The oxygen-rich dielectric pre-layer between the etch stop layer and the upper dielectric layer prevents or minimizes peeling and cracking of the layers induced by stresses that are caused by chemical mechanical planarization of metal layers and/or chip packaging.
Abstract:
An embodiment of the present invention discloses an input device, which comprises an electromagnetic input unit for inputting by a stylus pen, a touch input unit for inputting by fingers or pen, a first micro controller for controlling the electromagnetic input unit, a second micro controller for controlling the touch input unit, and a major controller for controlling the first and second micro controller.
Abstract:
The memory device is described, which includes a substrate, a conductive layer, a plurality of charge storage layers and a plurality of doped regions. The substrate has a plurality of trenches formed therein. The conductive layer is disposed on the substrate and fills the trenches. The charge storage layers are disposed between the substrate and the conductive layer in the trenches respectively, wherein the charge storage layers are separated from each other. The doped regions are configured in the substrate under bottoms of the trenches, respectively.
Abstract:
A cap layer for a copper interconnect structure formed in a first dielectric layer is provided. In an embodiment, the cap layer may be formed by an in-situ deposition process in which a process gas comprising germanium, arsenic, tungsten, or gallium is introduced, thereby forming a copper-metal cap layer. In another embodiment, a copper-metal silicide cap is provided. In this embodiment, silane is introduced before, during, or after a process gas is introduced, the process gas comprising germanium, arsenic, tungsten, or gallium. Thereafter, an optional etch stop layer may be formed, and a second dielectric layer may be formed over the etch stop layer or the first dielectric layer.
Abstract:
A multicast communication method for relaying a multicast packet from a first member node to a plurality of second member nodes in a wireless network is provided, wherein the first member node and the second member nodes belong to a same group and can communicate with each other via a plurality of non-member nodes. In the multicast communication method, a number and distances of the second member nodes are recorded. The multicast packet is received from the first member node, and a waiting time is determined according to the number and the distances of the second member nodes. Whether the multicast packet is broadcasted by any other relay node is monitored during the waiting time. If the multicast packet is already broadcasted to all the second member nodes by other relay node, the multicast packet is not broadcasted; otherwise, the multicast packet is broadcasted after the waiting time elapses.