公开(公告)号：US06746896B1

公开(公告)日：2004-06-08

申请号：US09648777

申请日：2000-08-28

Applicant: Song-Hua Shi ,  Ching-Ping Wong

Inventor： Song-Hua Shi ,  Ching-Ping Wong

IPC: H01L2144

CPC classification number: H01L21/563 ,  B23K35/3613 ,  H01L21/6835 ,  H01L24/27 ,  H01L24/29 ,  H01L24/81 ,  H01L2221/6834 ,  H01L2221/68354 ,  H01L2224/13111 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/73104 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/81193 ,  H01L2224/8121 ,  H01L2224/81815 ,  H01L2224/83191 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01073 ,  H01L2924/01075 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/04953 ,  H01L2924/1579 ,  H01L2924/0665 ,  H01L2224/0401

Abstract: The present invention provides a novel process and its required fluxable materials for building low-cost flip-chip interconnect structures. The novel process involves two fluxable materials, fluxable wafer-level compressive-flow underfill material (WLCFU) and fluxable tacky film, and applies these two materials on a wafer level. The two materials can provide sufficient fluxing capability during solder reflow and significant improvement of the fatigue life of the formed solder interconnects after fully cured.

Abstract translation: 本发明提供了一种用于构建低成本倒装芯片互连结构的新型工艺及其所需的助熔材料。 该新工艺涉及两种助焊剂材料，助焊剂晶圆级压缩底层填充材料（WLCFU）和助焊剂粘合膜，并将这两种材料应用于晶圆级。 这两种材料可以在焊料回流期间提供足够的助熔能力，并且在完全固化后显着提高形成的焊料互连的疲劳寿命。

公开(公告)号：US5849680A

公开(公告)日：1998-12-15

申请号：US741984

申请日：1996-10-31

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C11D7/24 ,  C11D7/26 ,  C11D7/50 ,  C11D11/00 ,  H05K3/26 ,  B08B3/08 ,  C11D7/60

CPC classification number: H05K3/26 ,  C11D11/0047 ,  C11D7/5022 ,  C11D7/24 ,  C11D7/262 ,  C11D7/266 ,  H05K2203/0783 ,  H05K2203/121

Abstract: The specification describes a cleaning process for electronic devices and assemblies such as printed wiring boards. In the cleaning process deterioration of a terpene based cleaning solution, as evidenced by yellowing, is prevented using a copper chelating additive.

Abstract translation: 该说明书描述了用于诸如印刷线路板的电子设备和组件的清洁过程。 在清洗过程中，使用铜螯合添加剂可防止由黄变所证明的萜烯类清洗溶液的劣化。

公开(公告)号：US5568684A

公开(公告)日：1996-10-29

申请号：US181072

申请日：1994-01-14

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: H01L23/24 ,  H01L23/057 ,  H01L23/22 ,  B29C45/14 ,  B29C70/70

CPC classification number: H01L23/057 ,  H01L23/22 ,  H01L2224/16225 ,  H01L2924/19107 ,  Y10T29/49144 ,  Y10T29/49146

Abstract: An electronic device (12, 13) is substantially enclosed by a fluid encapsulant (17). The fluid encapsulant consists essentially of a silicone resin and a catalyst selected from the group consisting of platinum and tin. The silicone resin is selected from the group consisting of polydimethlysiloxane, polymethylphenylsiloxane, polydimethyldiphenylsiloxane, and mixtures thereof. Such silicone resins comprise molecules terminating in vinyl components and hydride components. The molar ratio of vinyl components to hydride components is maintained within the range of five to twenty. As will be explained more fully later, this ratio of vinyl components to hydride components assures that the resin will remain substantially a liquid even after cure, due to limited cross-linking or polymerization during the cure. The electronic device is contained within a container (16) having a sealed cover (18) for containing the liquid encapsulant during the operation of the electronic device.

Abstract translation: 电子设备（12,13）基本上由流体密封剂（17）封闭。 流体密封剂基本上由硅树脂和选自铂和锡的催化剂组成。 有机硅树脂选自聚二甲基硅氧烷，聚甲基苯基硅氧烷，聚二甲基二苯基硅氧烷及其混合物。 这种有机硅树脂包括终止于乙烯基组分和氢化物组分的分子。 乙烯基组分与氢化物组分的摩尔比保持在5至20的范围内。 如下文将更全面地说明的，乙烯基组分与氢化物组分的比率确保了即使在固化之后，由于固化期间交联或聚合的限制，树脂仍将基本上保持液体。 电子设备包含在具有用于在电子设备的操作期间容纳液体密封剂的密封盖（18）的容器（16）内。

公开(公告)号：US5405566A

公开(公告)日：1995-04-11

申请号：US135645

申请日：1993-10-14

Applicant: Peter F. Lilienthal, III ,  Ivan Pawlenko ,  Ching-Ping Wong

Inventor： Peter F. Lilienthal, III ,  Ivan Pawlenko ,  Ching-Ping Wong

IPC: B29C33/00 ,  B29C39/06 ,  B29C39/10 ,  B29L31/34

CPC classification number: B29C39/06 ,  B29C33/0016 ,  B29C33/0038 ,  B29C39/10 ,  B29K2105/0061 ,  Y10S425/044 ,  Y10S439/936

Abstract: A module, such as a terminal block (10), configured of a body (12) having an open end (20) and at least one window (24) spaced from the open end, is fixtured and sealed by way of a channel (28) comprised of a pair of parallel, spaced-apart, generally elastic walls (30,32) jointed by a bottom member (34). The walls (30,32) and the bottom member (34) run longitudinally a distance at least as long as the width of the terminal block (10) to allow the block to be received between, and to be held by, the walls. At least one protrusion extends out from a separate one of the walls (30,32) and the base member (34) for receipt in the window (24) in the terminal block to seal the same.

Abstract translation: 诸如端子块（10）的模块由具有开口端（20）的主体（12）和与开口端间隔开的至少一个窗口（24）构成，通过通道（...）固定和密封 28）包括由底部构件（34）连接的一对平行的，间隔开的，大致弹性的壁（30,32）。 壁（30,32）和底部构件（34）纵向延伸至少与端子块（10）的宽度一样长的距离，以允许块被容纳在壁之间并由壁保持。 至少一个突出部从单独的一个壁（30,32）和基部构件（34）中伸出，以便接收在端子块中的窗口（24）中，以密封它们。

公开(公告)号：US5213864A

公开(公告)日：1993-05-25

申请号：US802579

申请日：1991-12-05

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08G77/04 ,  H01B3/46 ,  H01L23/29

CPC classification number: H01B3/46 ,  C08G77/04 ,  H01L23/296 ,  H01L2224/48091 ,  H01L2224/48464 ,  Y10T428/23 ,  Y10T428/239 ,  Y10T428/31663

Abstract: An electronic device encapsulant comprises polydimethyldiphenylmethylphenylsiloxane in which the mole ratio of the sum of the methyl-phenyl and diphenyl groups to the dimethyl groups is in the range of ten to forty percent. The normal bi-functional hydride terminations are replaced with tri-functional or tetra-functional hydride terminations.

Abstract translation: 电子器件密封剂包括聚二甲基二苯基甲基苯基硅氧烷，其中甲基 - 苯基和二苯基与二甲基之和的摩尔比在十至百分之四十的范围内。 正常的双官能氢化物终端用三官能或四官能氢化物终止物代替。

公开(公告)号：US4720431A

公开(公告)日：1988-01-19

申请号：US872294

申请日：1986-05-21

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08L83/04 ,  C08L83/05 ,  C08L83/07 ,  H01B3/46 ,  H01L23/29 ,  H01L23/31 ,  B32B9/04

CPC classification number: H01L23/296 ,  C08L83/04 ,  C08G77/12 ,  C08G77/20 ,  H01L2924/0002 ,  Y10T428/31663

Abstract: The addition of a low viscosity (2 to 100 centipoise) polysiloxane such asolydimethylsiloxane to a two-part heat curable polysiloxane system substantially eliminates the formation of bubbles when such system is employed as a potting compound for encapsulating devices such as electronic devices.

Abstract translation: 当将这种系统用作用于封装诸如电子器件的装置的灌封化合物时，将低粘度（2至100厘泊）聚硅氧烷（例如聚二甲基硅氧烷）加入到两部分热固性聚硅氧烷体系中基本上消除了气泡的形成。

公开(公告)号：US4592959A

公开(公告)日：1986-06-03

申请号：US673011

申请日：1984-11-19

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08K5/09 ,  C08L83/04 ,  H01B3/46 ,  B32B9/06

CPC classification number: H01B3/46 ,  C08K5/09 ,  C08L83/04 ,  Y10S428/901 ,  Y10T428/31663

Abstract: A method of extending the shelf-life of an uncured silicone resin formulation which includes a primary amine therein comprises adding an acid to the formulation in a molar quantity approximately equal to the number of moles of primary amine present in the formulation, said acid being volatile at or below the curing temperature of the resin formulation.

Abstract translation: 包括伯胺在内的未固化的有机硅树脂配方的保质期的方法包括以约等于制剂中存在的伯胺的摩尔数的摩尔量向制剂中加入酸，所述酸是挥发性的 处于或低于树脂制剂的固化温度。

公开(公告)号：US4508758A

公开(公告)日：1985-04-02

申请号：US453004

申请日：1982-12-27

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: C08L83/00 ,  C08L83/04 ,  H01L21/56 ,  H01L23/29 ,  H01L23/31 ,  B05D5/12

CPC classification number: H01L21/56 ,  H01L23/296 ,  H01L2924/0002 ,  Y10T29/49146

Abstract: In the manufacture of encapsulated hybrid circuits from a substrate having a plurality of such circuits contained thereon, individual devices are first mounted on the circuit, encapsulant having a yield point stress and viscosity so as not to creep or flow is applied around the periphery of each circuit on the substrate so as to form a wall or dam around each such circuit except for the bonding pads for external connection of each circuit, a second encapsulant is then flow coated over the circuit and devices contained thereon within the previously formed wall such that the second encapsulant is retained within the wall. The encapsulants are then cured or dried and the individual encapsulated circuit can then be further processed such as by separating the individual circuits on the substrate and applying external connectors to the bonding pads.

Abstract translation: 在从包含多个这样的电路的基板制造封装的混合电路中，首先将单独的器件安装在电路上，具有屈服点应力和粘度的密封剂，以便不会蠕变或流动施加在每个 电路，以便除了用于每个电路的外部连接的接合焊盘之外围绕每个这样的电路形成一个壁或坝，然后将第二密封剂流过涂覆在电路上，并且其上装载在先前形成的壁内的装置，使得 第二密封剂保留在壁内。 然后将密封剂固化或干燥，然后可以进一步处理单个封装的电路，例如通过分离衬底上的各个电路并将外部连接器施加到接合焊盘。

公开(公告)号：US4171240A

公开(公告)日：1979-10-16

申请号：US900367

申请日：1978-04-26

Applicant: Ching-Ping Wong

Inventor： Ching-Ping Wong

IPC: G03F7/42 ,  H05K3/00 ,  H05K3/28 ,  B29C17/08

CPC classification number: G03F7/422 ,  H05K3/288 ,  H05K2203/0769 ,  H05K2203/0783 ,  H05K2203/0786 ,  H05K2203/0789 ,  H05K2203/0796 ,  H05K3/002

Abstract: A method of removing a cured epoxy from a surface is disclosed. The method comprises treating at least the epoxy with a suitable swelling agent to swell the epoxy. The swelled epoxy is then treated with an oxidizing agent to oxidize the swelled epoxy. The oxidized epoxy is then treated with an etchant comprising sulfuric acid to remove the epoxy from the surface.

Abstract translation: 公开了从表面除去固化的环氧树脂的方法。 该方法包括用合适的溶胀剂处理至​​少环氧树脂以溶胀环氧树脂。 然后用氧化剂处理溶胀的环氧化物以氧化溶胀的环氧树脂。 然后用包含硫酸的蚀刻剂处理氧化的环氧树脂以从表面除去环氧树脂。

公开(公告)号：US07414416B2

公开(公告)日：2008-08-19

申请号：US10506518

申请日：2003-03-05

Applicant: Kenneth S. Watkins, Jr. ,  Shelby J. Morris ,  Daniel D. Masakowski ,  Ching Ping Wong ,  Shijian Luo

Inventor： Kenneth S. Watkins, Jr. ,  Shelby J. Morris ,  Daniel D. Masakowski ,  Ching Ping Wong ,  Shijian Luo

IPC: G01N17/00 ,  G01N33/44 ,  G01N27/04 ,  G01N27/20 ,  G01R31/12

CPC classification number: G01R31/1227 ,  G01N17/00 ,  G01N27/041 ,  G01N33/445

Abstract: An electrical condition monitoring method utilizes measurement of electrical resistivity of an age sensor made of a conductive matrix or composite disposed in a polymeric structure such as an electrical cable. The conductive matrix comprises a base polymer and conductive filler. The method includes communicating the resistivity to a measuring instrument and correlating resistivity of the conductive matrix of the polymeric structure with resistivity of an accelerated-aged conductive composite.

Abstract translation: 电气状态监测方法利用由诸如电缆的聚合物结构中布置的导电基体或复合材料制成的年龄传感器的电阻率的测量。 导电基质包括基础聚合物和导电填料。 该方法包括将电阻率传递到测量仪器，并将聚合物结构的导电基体的电阻率与加速老化的导电复合材料的电阻率相关联。