公开(公告)号：USD684940S1

公开(公告)日：2013-06-25

申请号：US29419104

申请日：2012-04-25

Applicant: Chen-Fu Chu ,  Chao-Chen Cheng ,  Hao-Chun Cheng

Designer： Chen-Fu Chu ,  Chao-Chen Cheng ,  Hao-Chun Cheng

公开(公告)号：US20130141806A1

公开(公告)日：2013-06-06

申请号：US13431992

申请日：2012-03-28

Applicant: CHUN-CHENG KO

Inventor： CHUN-CHENG KO

IPC: G02B7/02 ,  B32B3/00

CPC classification number: G02B7/006 ,  G02B7/02 ,  Y10T428/24752

Abstract: A glass filter assembly includes a circular glass substrate, an annular first anti-fragility layer, and a second anti-fragility layer. The circular glass substrate includes a first surface and a second surface opposite to the first surface. The first anti-fragility layer is concentrically adhered to the first surface. The outer diameter of the first anti-fragility layer is greater than or equal to the diameter of the circular glass substrate while the inner diameter of the first anti-fragility layer is smaller than the diameter of the circular glass substrate. The second anti-fragility layer is concentrically adhered to the second surface. The outer diameter of the second anti-fragility layer is greater than the diameter of the circular glass substrate while the inner diameter of the second anti-fragility layer is smaller than the diameter of the circular glass substrate.

Abstract translation: 玻璃过滤器组件包括圆形玻璃基底，环形第一抗脆性层和第二抗脆性层。 圆形玻璃基板包括第一表面和与第一表面相对的第二表面。 第一个抗脆性层同心地粘在第一个表面上。 第一抗脆层的外径大于或等于圆形玻璃基板的直径，而第一防脆层的内径小于圆形玻璃基板的直径。 第二抗脆性层同心地粘附在第二表面上。 第二抗脆性层的外径大于圆形玻璃基板的直径，而第二抗脆性层的内径小于圆形玻璃基板的直径。

公开(公告)号：US20130115735A1

公开(公告)日：2013-05-09

申请号：US13289719

申请日：2011-11-04

Applicant: Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Meng-Tse Chen ,  Hsiu-Jen Lin ,  Chun-Cheng Lin ,  Wen-Hsiung Lu ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/98 ,  B29C35/08

CPC classification number: H01L24/97 ,  B29C33/68 ,  B29C43/18 ,  H01L21/563 ,  H01L21/566 ,  H01L2224/16225 ,  H01L2924/01322 ,  H01L2924/181 ,  H01L2924/00

Abstract: Methods and apparatus for a forming molded underfills. A method is disclosed including loading a flip chip substrate into a selected one of the upper mold chase and lower mold chase of a mold press at a first temperature; positioning a molded underfill material in the at least one of the upper and lower mold chases while maintaining the first temperature which is lower than a melting temperature of the molded underfill material; forming a sealed mold cavity and creating a vacuum in the mold cavity; raising the temperature of the molded underfill material to a second temperature greater than the melting point to cause the molded underfill material to flow over the flip chip substrate forming an underfill layer and forming an overmolded layer; and cooling the flip chip substrate to a third temperature substantially lower than the melting temperature of the molded underfill material. An apparatus is disclosed.

Abstract translation: 用于成型模制底部填料的方法和装置。 公开了一种方法，其包括在第一温度下将倒装芯片衬底加载到模压机的上模追逐和下模追逐中的所选择的一个中; 将模制的底部填充材料定位在上模具和下模具中的至少一个中，同时保持低于模制的底部填充材料的熔融温度的第一温度; 形成密封的模腔并在模腔中产生真空; 将模制的底部填充材料的温度提高到大于熔点的第二温度，以使模制的底部填充材料在形成底部填充层的倒装芯片衬底上流动并形成包覆成型层; 并将所述倒装芯片基板冷却至基本上低于所述模制底部填充材料的熔融温度的第三温度。 公开了一种装置。

公开(公告)号：US20130095611A1

公开(公告)日：2013-04-18

申请号：US13276143

申请日：2011-10-18

Applicant: Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

Inventor： Kuei-Wei Huang ,  Wei-Hung Lin ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Meng-Tse Chen ,  Ming-Da Cheng ,  Chung-Shi Liu

IPC: H01L21/56

Abstract: Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.

Abstract translation: 公开了半导体器件的封装方法。 在一个实施例中，封装半导体器件的方法包括提供包括多个封装衬底的工件。 在多个包装基板之间移除一部分工件。 模具附接到多个封装基板中的每一个。

公开(公告)号：US20130089952A1

公开(公告)日：2013-04-11

申请号：US13270890

申请日：2011-10-11

Applicant: Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

Inventor： Wen-Hsiung Lu ,  Ming-Da Cheng ,  Wei-Hung Lin ,  Kuei-Wei Huang ,  Chih-Wei Lin ,  Chun-Cheng Lin ,  Chung-Shi Liu

IPC: H01L21/60 ,  H01L23/12 ,  H01L21/603

CPC classification number: H01L21/6835 ,  H01L21/561 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/562 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/97 ,  H01L2221/68372 ,  H01L2224/0401 ,  H01L2224/05027 ,  H01L2224/05124 ,  H01L2224/05554 ,  H01L2224/05572 ,  H01L2224/05599 ,  H01L2224/11444 ,  H01L2224/1145 ,  H01L2224/11452 ,  H01L2224/11462 ,  H01L2224/13082 ,  H01L2224/13083 ,  H01L2224/13111 ,  H01L2224/13116 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/13169 ,  H01L2224/14135 ,  H01L2224/16225 ,  H01L2224/16238 ,  H01L2224/2919 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/75754 ,  H01L2224/7698 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83102 ,  H01L2224/9205 ,  H01L2224/92125 ,  H01L2224/95001 ,  H01L2224/97 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/351 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2924/3841 ,  Y10T29/41 ,  H01L2924/00 ,  H01L2224/81 ,  H01L2924/00012 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2224/05552 ,  H01L2924/013

Abstract: Packaging process tools and packaging methods for semiconductor devices are disclosed. In one embodiment, a packaging process tool for semiconductor devices includes a mechanical structure including a frame. The frame includes a plurality of apertures adapted to retain a plurality of integrated circuit dies therein. The frame includes at least one hollow region.

Abstract translation: 公开了用于半导体器件的封装处理工具和封装方法。 在一个实施例中，用于半导体器件的封装处理工具包括包括框架的机械结构。 框架包括适于将多个集成电路管芯保持在其中的多个孔。 框架包括至少一个中空区域。

公开(公告)号：US20130059118A1

公开(公告)日：2013-03-07

申请号：US13306949

申请日：2011-11-29

Applicant: Yung-Hui Yeh ,  Chun-Cheng Cheng ,  Chyi-Ming Leu ,  Yung-Lung Tseng

Inventor： Yung-Hui Yeh ,  Chun-Cheng Cheng ,  Chyi-Ming Leu ,  Yung-Lung Tseng

IPC: B32B3/00 ,  B32B37/12 ,  B32B38/10 ,  B32B37/14

CPC classification number: H01L29/78603 ,  H01L27/1218 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/24355

Abstract: A flexible substrate structure including a flexible metal carrier, a surface-modified layer and a flexible plastic substrate is provided. The flexible metal carrier includes a first region and a second region. The surface-modified layer is located on and contacts with the first region of the flexible metal carrier. The flexible plastic substrate is located over the first region and the second region. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier.

Abstract translation: 提供了包括柔性金属载体，表面改性层和柔性塑料基底的柔性基底结构。 柔性金属载体包括第一区域和第二区域。 表面改性层位于柔性金属载体的第一区域上并与其接触。 柔性塑料基板位于第一区域和第二区域之上。 第一区域上的柔性塑料基板与表面改性层接触。 第二区域上的柔性塑料基板与柔性金属载体接触。

公开(公告)号：US20130059081A1

公开(公告)日：2013-03-07

申请号：US13600220

申请日：2012-08-31

Applicant: Yung-Hui Yeh ,  Chun-Cheng Cheng ,  Chyi-Ming Leu ,  Yung-Lung Tseng

Inventor： Yung-Hui Yeh ,  Chun-Cheng Cheng ,  Chyi-Ming Leu ,  Yung-Lung Tseng

IPC: B05D5/00 ,  B05D3/12

CPC classification number: H01L29/78603 ,  H01L27/1218 ,  Y10T156/10 ,  Y10T156/1052 ,  Y10T428/24355

Abstract: A method of fabricating a flexible substrate structure is provided. A flexible metal carrier including at least one first region and at least one second region is provided. A surface-modified layer is formed on the first region of the flexible metal carrier. A flexible plastic substrate is formed over the first region and the second region of the flexible metal carrier. The flexible plastic substrate over the first region contacts with the surface-modified layer. The flexible plastic substrate over the second region contacts with the flexible metal carrier.

Abstract translation: 提供一种制造柔性基板结构的方法。 提供了包括至少一个第一区域和至少一个第二区域的柔性金属载体。 在柔性金属载体的第一区域上形成表面改性层。 在柔性金属载体的第一区域和第二区域上形成柔性塑料基板。 第一区域上的柔性塑料基板与表面改性层接触。 第二区域上的柔性塑料基板与柔性金属载体接触。

公开(公告)号：US08350828B2

公开(公告)日：2013-01-08

申请号：US12649521

申请日：2009-12-30

Applicant: Chun-Cheng Ko

Inventor： Chun-Cheng Ko

IPC: G06F3/042

CPC classification number: G06F3/0428

Abstract: An exemplary touch screen apparatus comprises a display screen, a first reflector, a first infrared light source, and an infrared light receiving unit. The display screen includes a display area. The first reflector is disposed outside said display screen and surrounds the display area. The first reflector has a first focal point, and the first infrared light source is disposed on the first focal point. The infrared light receiving unit is capable of receiving the infrared light from the display screen.

Abstract translation: 示例性触摸屏设备包括显示屏，第一反射器，第一红外光源和红外光接收单元。 显示屏幕包括显示区域。 第一反射器设置在所述显示屏之外并且围绕显示区域。 第一反射器具有第一焦点，第一红外光源设置在第一焦点上。 红外光接收单元能够从显示屏接收红外光。

公开(公告)号：US08319753B2

公开(公告)日：2012-11-27

申请号：US12718093

申请日：2010-03-05

Applicant: Chun-Cheng Ko

Inventor： Chun-Cheng Ko

IPC: G06F3/033 ,  G06F3/042

CPC classification number: G06F3/03542

Abstract: An optical pen is disclosed. The handwriting input pen includes a housing, a light source module received in the housing, an optical lens, a pen tip. The light source module is configured for emitting light. The optical lens is configured for converging light emitted from the light source module, the optical lens comprising an optical portion and a supporting portion around the optical portion. The pen tip is positioned at an end of the housing and is configured for guiding light out of the housing to project. The shielding member is around the optical portion attached to the optical lens and covering the supporting portion of the optical lens, and is configured for stopping the light passing through the supporting portion from entering into the pen tips.

Abstract translation: 公开了一种光笔。 手写输入笔包括壳体，容纳在壳体中的光源模块，光学透镜，笔尖。 光源模块被配置为发光。 光学透镜被配置为会聚从光源模块发射的光，光学透镜包括光学部分和围绕光学部分的支撑部分。 笔尖定位在壳体的端部并且被配置为将光引导出壳体以投射。 屏蔽部件位于光学透镜附近的光学部件周围，覆盖光学透镜的支撑部分，并且被配置为阻止通过支撑部分的光进入笔尖。

公开(公告)号：US20120267423A1

公开(公告)日：2012-10-25

申请号：US13089977

申请日：2011-04-19

Applicant: Kuei-Wei Huang ,  Wei-Hung Lin ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Bor-Ping Jang ,  Chung-Shi Liu

Inventor： Kuei-Wei Huang ,  Wei-Hung Lin ,  Meng-Tse Chen ,  Chun-Cheng Lin ,  Yu-Peng Tsai ,  Bor-Ping Jang ,  Chung-Shi Liu

IPC: B23K1/20 ,  B25J15/06

CPC classification number: H01L21/6838 ,  H01L24/75

Abstract: A vacuum tip and methods for processing thin integrated circuit dies. A vacuum tip for attaching to an integrated circuit die is disclosed comprising a vacuum port configured to connect to a vacuum supply on an upper surface and having a bottom surface; and at least one vacuum hole extending through the vacuum tip and exposed at the bottom surface of the vacuum tip; wherein the vacuum tip is configured to physically contact a surface of an integrated circuit die. Methods for processing integrated circuit dies are disclosed.

Abstract translation: 真空尖端和薄集成电路管芯的处理方法。 公开了一种用于连接到集成电路管芯的真空端头，其包括被构造成连接到上表面上的具有底表面的真空源的真空端口; 以及至少一个真空孔，其延伸穿过真空尖端并暴露在真空尖端的底表面处; 其中所述真空尖端被配置为物理地接触集成电路管芯的表面。 公开了集成电路管芯的处理方法。