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公开(公告)号：US20130062761A1
公开(公告)日：2013-03-14
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/498 , H01L21/56
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
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公开(公告)号：US08884431B2
公开(公告)日：2014-11-11
申请号：US13228768
申请日：2011-09-09
申请人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
发明人： Chih-Wei Lin , Ming-Da Cheng , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Chung-Shi Liu , Mirng-Ji Lii , Chen-Hua Yu , Meng-Tse Chen , Chun-Cheng Lin , Yu-Peng Tsai , Kuei-Wei Huang , Wei-Hung Lin
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L21/683 , H01L23/498 , H01L21/56 , H01L25/065 , H01L23/538 , H01L25/00 , H01L23/00 , H01L23/31 , H01L25/10 , H01L25/03 , H01L21/768
CPC分类号： H01L25/0657 , H01L21/52 , H01L21/565 , H01L21/568 , H01L21/6835 , H01L21/76898 , H01L23/3128 , H01L23/3135 , H01L23/49816 , H01L23/49822 , H01L23/49827 , H01L23/5389 , H01L24/03 , H01L24/05 , H01L24/09 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/81 , H01L24/92 , H01L24/97 , H01L25/03 , H01L25/0652 , H01L25/0655 , H01L25/105 , H01L25/50 , H01L2221/68331 , H01L2221/68345 , H01L2221/68377 , H01L2224/0231 , H01L2224/0401 , H01L2224/04105 , H01L2224/06515 , H01L2224/09181 , H01L2224/13082 , H01L2224/131 , H01L2224/13147 , H01L2224/16225 , H01L2224/16238 , H01L2224/73259 , H01L2224/81005 , H01L2224/81191 , H01L2224/81815 , H01L2224/9202 , H01L2224/97 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06541 , H01L2225/06548 , H01L2924/14 , H01L2924/1461 , H01L2924/15192 , H01L2924/15311 , H01L2924/15321 , H01L2924/15322 , H01L2924/181 , H01L2924/19107 , H01L2924/00014 , H01L2224/81 , H01L2224/03 , H01L2924/014 , H01L2924/00
摘要： Packaging methods and structures for semiconductor devices are disclosed. In one embodiment, a packaged semiconductor device includes a redistribution layer (RDL) having a first surface and a second surface opposite the first surface. At least one integrated circuit is coupled to the first surface of the RDL, and a plurality of metal bumps is coupled to the second surface of the RDL. A molding compound is disposed over the at least one integrated circuit and the first surface of the RDL.
摘要翻译： 公开了用于半导体器件的封装方法和结构。 在一个实施例中，封装的半导体器件包括具有第一表面和与第一表面相对的第二表面的再分配层（RDL）。 至少一个集成电路耦合到RDL的第一表面，并且多个金属凸块耦合到RDL的第二表面。 模制化合物设置在RDL的至少一个集成电路和第一表面上。
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公开(公告)号：US20120299181A1
公开(公告)日：2012-11-29
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/488 , H01L21/56
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US20130095611A1
公开(公告)日：2013-04-18
申请号：US13276143
申请日：2011-10-18
申请人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu
发明人： Kuei-Wei Huang , Wei-Hung Lin , Chih-Wei Lin , Chun-Cheng Lin , Meng-Tse Chen , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/56
摘要： Packaging methods for semiconductor devices are disclosed. In one embodiment, a method of packaging a semiconductor device includes providing a workpiece including a plurality of packaging substrates. A portion of the workpiece is removed between the plurality of packaging substrates. A die is attached to each of the plurality of packaging substrates.
摘要翻译： 公开了半导体器件的封装方法。 在一个实施例中，封装半导体器件的方法包括提供包括多个封装衬底的工件。 在多个包装基板之间移除一部分工件。 模具附接到多个封装基板中的每一个。
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公开(公告)号：US08927391B2
公开(公告)日：2015-01-06
申请号：US13118108
申请日：2011-05-27
申请人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Sheng-Yu Wu , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Chih-Wei Lin , Wen-Hsiung Lu , Hsiu-Jen Lin , Bor-Ping Jang , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L24/17 , H01L21/565 , H01L21/566 , H01L23/3114 , H01L23/3128 , H01L23/49827 , H01L24/16 , H01L24/81 , H01L25/105 , H01L25/50 , H01L2224/131 , H01L2224/16055 , H01L2224/16113 , H01L2224/16146 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/01029 , H01L2924/014 , H01L2924/12042 , H01L2924/1304 , H01L2924/14 , H01L2924/1432 , H01L2924/1434 , H01L2924/15174 , H01L2924/15311 , H01L2924/15321 , H01L2924/181 , H01L2924/00
摘要： A method of packaging includes placing a package component over a release film, wherein solder balls on a surface of the package component are in physical contact with the release film. Next, A molding compound filled between the release film and the package component is cured, wherein during the step of curing, the solder balls remain in physical contact with the release film.
摘要翻译： 包装方法包括将包装部件放置在脱模膜上，其中包装部件表面上的焊球与剥离膜物理接触。 接下来，填充在剥离膜和包装部件之间的模塑料固化，其中在固化步骤期间，焊球与剥离膜保持物理接触。
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公开(公告)号：US20130113116A1
公开(公告)日：2013-05-09
申请号：US13291882
申请日：2011-11-08
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L23/48 , H01L21/4853 , H01L21/561 , H01L23/3121 , H01L23/49816 , H01L24/16 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/15321 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647
摘要： A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.
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公开(公告)号：US08609462B2
公开(公告)日：2013-12-17
申请号：US13272032
申请日：2011-10-12
申请人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Chun-Cheng Lin , Kuei-Wei Huang , Yu-Peng Tsai , Wei-Hung Lin , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L21/44
CPC分类号： B23Q3/18 , H01L21/50 , H01L21/561 , H01L21/563 , H01L23/49827 , H01L23/5389 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/75733 , H01L2224/75744 , H01L2224/75754 , H01L2224/7598 , H01L2224/75983 , H01L2224/81191 , H01L2224/81815 , H01L2224/83104 , H01L2224/83862 , H01L2224/83868 , H01L2224/83874 , H01L2224/97 , H01L2924/3511 , Y10T29/41 , H01L2924/00 , H01L2924/00014 , H01L2224/81 , H01L2924/00012 , H01L2924/014
摘要： A method includes dispensing an underfill between a first package component and a second package component, wherein the first package component is placed on a lower jig, and the second package component is over and bonded to the first package component. A through-opening is in the lower jig and under the first package component. The underfill is cured, wherein during the step of curing the underfill, a force is applied to flatten the first package component. The force is applied by performing an action selected from the group consisting of vacuuming and air blowing through the through-opening.
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公开(公告)号：US10192804B2
公开(公告)日：2019-01-29
申请号：US13544783
申请日：2012-07-09
申请人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L29/49 , H01L23/31 , H01L23/00 , H01L23/498
摘要： A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.
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公开(公告)号：US08586408B2
公开(公告)日：2013-11-19
申请号：US13291882
申请日：2011-11-08
申请人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Kuei-Wei Huang , Chih-Wei Lin , Chih Chun Chiu , Ming-Da Cheng , Chung-Shi Liu
CPC分类号： H01L23/48 , H01L21/4853 , H01L21/561 , H01L23/3121 , H01L23/49816 , H01L24/16 , H01L25/105 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/16227 , H01L2225/1023 , H01L2225/1058 , H01L2924/15321 , H01L2224/05624 , H01L2924/00014 , H01L2224/05647
摘要： A system and method for forming contacts is provided. An embodiment comprises forming the contacts on a substrate and then coining the contacts by physically shaping them using, e.g., a molding chamber. The physical shaping of the contacts may be performed using a patterned portion of the molding chamber or else by placing a patterned stencil around the contacts prior before a force is applied to physically reshape the contacts. The contacts may be reshaped into a cylindrical, oval, cuboid, or rectangular shape, for example.
摘要翻译： 提供一种用于形成触点的系统和方法。 一个实施例包括在基底上形成触点，然后通过使用例如模制室对它们进行物理成形来压接触点。 触点的物理成形可以使用模制室的图案化部分进行，或者在施加力以物理地重塑接触之前通过在接触件周围放置图案化模板。 触点可以重新成形为例如圆柱形，椭圆形，长方体形或矩形形状。
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公开(公告)号：US20140008786A1
公开(公告)日：2014-01-09
申请号：US13544783
申请日：2012-07-09
申请人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
发明人： Meng-Tse Chen , Wei-Hung Lin , Chih-Wei Lin , Kuei-Wei Huang , Hui-Min Huang , Ming-Da Cheng , Chung-Shi Liu
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/3157 , H01L23/49816 , H01L24/13 , H01L24/16 , H01L24/81 , H01L2224/10175 , H01L2224/1146 , H01L2224/11849 , H01L2224/13082 , H01L2224/13111 , H01L2224/13147 , H01L2224/16238 , H01L2224/73204 , H01L2224/81191 , H01L2224/81385 , H01L2224/81815 , H01L2924/12042 , H01L2924/15311 , H01L2924/00014 , H01L2924/01047 , H01L2924/01029 , H01L2924/00
摘要： A device comprises a first package component, and a first metal trace and a second metal trace on a top surface of the first package component. The device further includes a dielectric mask layer covering the top surface of the first package component, the first metal trace and the second metal trace, wherein the dielectric mask layer has an opening therein exposing the first metal trace. The device also includes a second package component and an interconnect formed on the second package component, the interconnect having a metal bump and a solder bump formed on the metal bump, wherein the solder bump contacts the first metal trace in the opening of the dielectric mask layer.
摘要翻译： 一种装置包括第一包装部件和第一包装部件的顶表面上的第一金属痕迹和第二金属迹线。 该装置还包括覆盖第一封装部件的顶表面，第一金属迹线和第二金属迹线的介电掩模层，其中介电掩模层具有其中的开口露出第一金属迹线。 该器件还包括形成在第二封装元件上的第二封装元件和互连，所述互连件具有形成在所述金属突起上的金属突起和焊料凸块，其中所述焊料凸点接触所述介电掩模的开口中的所述第一金属迹线 层。
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