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公开(公告)号：US07615162B2
公开(公告)日：2009-11-10
申请号：US11522960
申请日：2006-09-19
Applicant: Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
Inventor： Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
IPC: H01B13/00
CPC classification number: H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
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22.发明申请公开(公告)号：US20080317402A1
公开(公告)日：2008-12-25
申请号：US12118344
申请日：2008-05-09
Applicant: Hiroaki KODAMA , Kazuhito Yamada
Inventor： Hiroaki KODAMA , Kazuhito Yamada
CPC classification number: G02B6/12002 , G02B6/43 , H05K1/0274 , H05K3/005 , H05K3/107 , H05K3/4602 , H05K2201/09536 , H05K2203/0108
Abstract: The optical/electrical composite wiring board comprises a lower insulating layer that also serves as a lower clad; a upper insulating layer that also serves as an upper clad; a core that is placed between the lower insulating layer and the upper insulating layer and has a predetermined optical wiring pattern; and a conductor layer that is placed along with the core between the lower insulating layer and the upper insulating layer and has a predetermined electrical wiring pattern. Herein, the core and the conductor layer are formed via a short manufacturing method, whereby the concave portion for optical wiring and the concave portion for electrical wiring are formed on the lower insulating layer by press process, and a core material and conductor material are filled into each of the concave portions, and afterward, the core material and conductor material are ground until they are flush with the upper surface of the lower insulating layer.
Abstract translation: 光电复合布线板包括也用作下包层的下绝缘层; 也用作上部包层的上部绝缘层; 放置在下绝缘层和上绝缘层之间并具有预定光布线图案的芯; 以及导体层，其与所述芯在所述下绝缘层和所述上绝缘层之间放置并且具有预定的电布线图案。 这里，通过短的制造方法形成芯和导体层，由此通过冲压加工在下绝缘层上形成用于光布线的凹部和电布线用凹部，并且填充芯材和导体材料 在每个凹部中分离，然后将芯材和导体材料研磨成与下绝缘层的上表面齐平。
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公开(公告)号：US20080247704A1
公开(公告)日：2008-10-09
申请号：US11696436
申请日：2007-04-04
Applicant: Hiroaki Kodama , Kazuhito Yamada
Inventor： Hiroaki Kodama , Kazuhito Yamada
IPC: G02B6/12
CPC classification number: G02B6/4204 , G02B6/4212 , G02B6/4214 , G02B6/43 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K1/0274 , H05K3/28 , H05K3/305 , H05K3/4602 , H05K2201/10734 , H05K2201/10977 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A package substrate according to an embodiment of the present invention comprises: at least a conductor circuit and an insulating layer formed and laminated to form a laminated body; at least one solder resist layer further formed and laminated on both sides of the laminated body; an optical element; and an optical path for transmitting an optical signal, wherein at least one outermost layer of the solder resist layers formed and laminated on the laminated body has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 μm.
Abstract translation: 根据本发明实施例的封装基板包括至少形成并层叠以形成层叠体的导体电路和绝缘层; 进一步形成并层叠在所述层叠体的两侧的至少一个阻焊层; 光学元件; 以及用于透射光信号的光路，其中形成并层叠在层叠体上的阻焊层的至少一个最外层对于厚度为30μm的通信波长为约60％以上的光具有透射率 。
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公开(公告)号：US20070062728A1
公开(公告)日：2007-03-22
申请号：US11522940
申请日：2006-09-19
Applicant: Yoshinori Wakihara , Kazuhito Yamada
Inventor： Yoshinori Wakihara , Kazuhito Yamada
CPC classification number: H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
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公开(公告)号：US20070051694A1
公开(公告)日：2007-03-08
申请号：US11522960
申请日：2006-09-19
Applicant: Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
Inventor： Motoo Asai , Yasuji Hiramatsu , Yoshinori Wakihara , Kazuhito Yamada
IPC: H01B13/00
CPC classification number: H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
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Patent Agency Ranking
公开(公告)号：US06930255B2
公开(公告)日：2005-08-16
申请号：US10351501
申请日：2003-01-27
Applicant: Yoshinori Wakihara , Kazuhito Yamada
Inventor： Yoshinori Wakihara , Kazuhito Yamada
CPC classification number: H05K3/108 , H05K1/0269 , H05K3/067 , H05K3/244 , H05K3/3452 , H05K3/382 , H05K3/384 , H05K3/4661 , H05K2201/0989 , H05K2201/09918 , H05K2203/0307 , H05K2203/072 , Y10S428/901 , Y10T29/49002 , Y10T29/49156 , Y10T29/49167 , Y10T156/1056 , Y10T428/24917
Abstract: A printed circuit board is by formed by laminating an interlaminar insulating layer on a conductor circuit of a substrate, in which the conductor circuit is comprised of an electroless plated film and an electrolytic plated film and a roughened layer is formed on at least a part of the surface of the conductor circuit.
Abstract translation: 印刷电路板是通过在基板的导体电路上层叠层间绝缘层而形成的，其中导体电路由无电解电镀膜和电解电镀膜构成，并且在至少一部分上形成有粗糙层 导体电路的表面。
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27.发明申请公开(公告)号：US20050089545A1
公开(公告)日：2005-04-28
申请号：US10505393
申请日：2003-02-21
Applicant: Mitsuaki Kuwano , Kazuhito Yamada
Inventor： Mitsuaki Kuwano , Kazuhito Yamada
IPC: A61K9/00 , A61K9/16 , A61K31/573 , A61P27/02 , A61P29/00 , A61P31/04 , A61P31/10 , A61P31/12 , A61P35/00 , A61P37/06 , A61K9/14
CPC classification number: A61K31/573 , A61K9/0051 , A61K9/1641
Abstract: The present invention provides an excellent drug delivery system to posterior segments. An injection according to the present invention is a periocular injection which comprises fine particles containing a drug and enables the drug to deliver to the posterior segments. The drug can be efficiently delivered to the posterior segments (such as a retina, a choroid and an optic nerve) while scarcely injuring ophthalmic tissues by administering the fine particles containing the drug periocularlly. Preferred fine particles are made of a synthetic biodegradable polymer, their average particle diameter is 50 nm to 150 μm, and the drug is dispersed in the fine particles uniformly. Preferred drugs are anti-inflammatories, immunosuppressors, antivirals, anticancer drugs, angiogenesis inhibitors, optic neural protectants, antimicrovials and antifungal agents.
Abstract translation: 本发明为后段提供了优异的药物递送系统。 根据本发明的注射液是一种眼周注射剂，其包含含有药物的细颗粒，并使药物能够递送至后段。 该药物可以有效地递送到后段（如视网膜，脉络膜和视神经），同时几乎不损伤眼组织，通过给予包含药物的细颗粒。 优选的微粒由合成的可生物降解的聚合物制成，平均粒径为50nm〜150μm，药物分散在细颗粒中。 优选的药物是抗炎剂，免疫抑制剂，抗病毒剂，抗癌药物，血管发生抑制剂，视神经保护剂，抗微生物剂和抗真菌剂。
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公开(公告)号：US07919849B2
公开(公告)日：2011-04-05
申请号：US11696436
申请日：2007-04-04
Applicant: Hiroaki Kodama , Kazuhito Yamada
Inventor： Hiroaki Kodama , Kazuhito Yamada
CPC classification number: G02B6/4204 , G02B6/4212 , G02B6/4214 , G02B6/43 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16 , H01L2924/00014 , H01L2924/01019 , H01L2924/0102 , H01L2924/01025 , H01L2924/01046 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15311 , H05K1/0274 , H05K3/28 , H05K3/305 , H05K3/4602 , H05K2201/10734 , H05K2201/10977 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
Abstract: A package substrate includes a laminated body having a conductor circuit and an insulating layer formed and laminated, solder resist layers formed and laminated on both sides of the laminated body, respectively, an optical element, and an optical path for transmitting an optical signal. One or more of the solder resist layers formed and laminated on the laminated body is an outermost layer which has a transmittance for light having a wavelength for communication of about 60% or more at a thickness of 30 μm.
Abstract translation: 封装基板包括具有导体电路和形成并层叠的绝缘层的层叠体，分别在层叠体两侧形成并层压的阻焊层，光学元件和用于透射光信号的光路。 形成层叠在层叠体上的一个或多个阻焊层是对于厚度为30μm具有约60％以上的通信波长的光的透射率的最外层。
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29.发明授权公开(公告)号：US07783141B2
公开(公告)日：2010-08-24
申请号：US11696434
申请日：2007-04-04
Applicant: Hiroaki Kodama , Toyoaki Tanaka , Kazuhito Yamada
Inventor： Hiroaki Kodama , Toyoaki Tanaka , Kazuhito Yamada
IPC: G02B6/42
CPC classification number: G02B6/4204 , G02B6/4212 , G02B6/4214 , G02B6/4246 , G02B6/43 , H05K1/0274 , H05K3/4602
Abstract: The substrate for mounting an IC chip according to the present invention is a substrate for mounting an IC chip, where conductor circuits and insulating layers are formed and layered, an optical element is mounted, an optical path for transmitting an optical signal is formed, wherein an optical element sealing layer is formed so as to make contact with the periphery of the above described optical element.
Abstract translation: 根据本发明的用于安装IC芯片的基板是用于安装IC芯片的基板，其中形成导体电路和绝缘层并分层，安装光学元件，形成用于传输光信号的光路，其中 光学元件密封层形成为与上述光学元件的周边接触。
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公开(公告)号：US20100195954A1
公开(公告)日：2010-08-05
申请号：US12757418
申请日：2010-04-09
Applicant: Motoo ASAI , Hiroaki Kodama , Kazuhito Yamada
Inventor： Motoo ASAI , Hiroaki Kodama , Kazuhito Yamada
CPC classification number: G02B6/43 , G02B6/4214 , H05K1/0274 , H05K3/4602 , H05K3/4623 , H05K2201/09536
Abstract: A multilayer printed circuit board including insulating layers, conductor circuits formed between the insulating layers, and optical circuits formed between the insulating layers and including a first optical circuit. The first optical circuit is positioned on a first outermost insulating layer of the insulating layers, and the insulating layers, conductor circuits and optical circuits are layered to form a multilayer structure having a first surface and a second surface on an opposite side of the first surface such that the multilayer structure is structured to mount optical elements on the first surface and second surface of the multilayer structure, respectively.
Abstract translation: 一种多层印刷电路板，包括绝缘层，形成在绝缘层之间的导体电路以及形成在绝缘层之间并包括第一光学电路的光电路。 第一光电路位于绝缘层的第一绝缘绝缘层上，绝缘层，导体电路和光电路被层叠形成具有第一表面和第二表面的第一表面的第二表面的多层结构 使得多层结构被分别安装在多层结构的第一表面和第二表面上的光学元件。
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