公开(公告)号：US07428062B2

公开(公告)日：2008-09-23

申请号：US12006530

申请日：2008-01-03

申请人： Keiji Nomaru

发明人： Keiji Nomaru

IPC分类号： G01B11/24 ,  G03B21/14 ,  G02B21/00

CPC分类号： G01B11/14 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/048 ,  B23K26/0853 ,  G01B11/0608 ,  G01B2210/50 ,  H01L21/67253

摘要： An apparatus for measuring the height of a work held by a chuck table provided in a machining apparatus, including: a white light source for emitting a white beam of light; a chromatic aberration lens for condensing the white beam emitted from the white light source; a beam splitter which is disposed between the white light source and the chromatic aberration lens and by which a reflected beam of the white beam irradiating the work therewith is split; a first condenser lens for condensing the reflected beam split by the beam splitter; a diffraction grating by which the reflected beam condensed by the first condenser lens is converted into a diffracted beam; a second condenser lens for condensing the diffracted beam diffracted by the diffraction grating; and a wavelength detecting unit for detecting the wavelength of the diffracted beam condensed by the second condenser lens.

公开(公告)号：US20080217301A1

公开(公告)日：2008-09-11

申请号：US12073271

申请日：2008-03-03

申请人： Keiji Nomaru ,  Yutaka Kobayashi ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Yutaka Kobayashi ,  Hiroshi Morikazu

IPC分类号： B23K26/02

CPC分类号： B23K26/355 ,  B23K26/032 ,  B23K26/034 ,  B23K26/04 ,  B23K26/06 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/40 ,  B23K2101/40 ,  B23K2103/50

摘要： A laser beam processing machine comprising a laser beam application means for applying a pulse laser beam to a workpiece held on a chuck table and a controller, wherein the laser beam application means comprises a laser beam oscillation means for oscillating a pulse laser beam, an optical axis changing means for deflecting the optical axis of a pulse laser beam oscillated from the laser beam oscillation means in the processing-feed direction, and a condenser for converging a pulse laser beam whose optical axis has been deflected by the optical axis changing means; and the controller comprises a memory for storing a plurality of processing position coordinates set in the workpiece, controls the optical axis changing means according to the frequency of a pulse laser beam oscillated from the laser beam oscillation means and determines a plurality of predetermined processing position coordinates to be processed to ensure that the time interval between pulses of the pulse laser beam to be applied to the same processing position coordinates becomes a predetermined time or more when one pulse of the pulse laser beam is applied each time to a plurality of predetermined processing position coordinates to be processed sequentially and the pulse laser beam is applied to a plurality of predetermined processing position coordinates to be processed a predetermined number of times sequentially repeatedly.

摘要翻译： 一种激光束处理机，包括：激光束施加装置，用于将脉冲激光束施加到夹持在卡盘台上的工件;以及控制器，其中激光束施加装置包括用于振荡脉冲激光束的激光束振荡装置， 用于使从激光束振荡装置在处理供给方向上振荡的脉冲激光束的光轴偏转的光轴改变装置和用于会聚由光轴改变装置偏转的光轴的脉冲激光束的聚光器; 并且所述控制器包括用于存储设置在所述工件中的多个处理位置坐标的存储器，根据从所述激光束振荡装置振荡的脉冲激光束的频率来控制所述光轴改变装置，并且确定多个预定处理位置坐标 进行处理以确保当脉冲激光束的每个脉冲每次施加到多个预定处理位置时，要施加到相同处理位置坐标的脉冲激光束的脉冲之间的时间间隔变为预定时间或更长时间 要顺序处理的坐标，并且将脉冲激光束施加到多个预定处理位置坐标，以重复顺序处理预定次数。

公开(公告)号：US20080204748A1

公开(公告)日：2008-08-28

申请号：US12028470

申请日：2008-02-08

申请人： Keiji Nomaru ,  Taiki Sawabe

发明人： Keiji Nomaru ,  Taiki Sawabe

IPC分类号： G01J3/12

CPC分类号： G01B11/0608 ,  B23K26/04 ,  B23K26/046 ,  B23K26/0853 ,  G01B2210/50

摘要： A measuring device for measuring the height of a workpiece held on a chuck table provided in a processing machine. The measuring device includes a white light source for emitting white light, an acousto-optic deflecting unit for separating the white light emitted from the white light source to produce a flux of diffracted light and for swinging the flux of the diffracted light over a predetermined angular range by applying a voltage, a pinhole mask for passing light having a part of the wavelengths of the diffracted light produced by the acousto-optic deflecting unit, and a chromatic aberration lens for focusing the light passed through the pinhole mask and for applying the focused light to the workpiece held on the chuck table.

摘要翻译： 一种用于测量保持在设置在加工机器中的卡盘台上的工件的高度的测量装置。 测量装置包括用于发射白光的白光源，声光偏转单元，用于分离从白光源发射的白光，以产生衍射光束，并将衍射光的光束摆动在预定角度 通过施加电压的范围，用于通过具有由声光偏转单元产生的衍射光的一部分波长的光的针孔掩模和用于聚焦通过针孔掩模的光并用于施加聚焦的色差透镜 光照到卡盘上的工件。

公开(公告)号：US20080180697A1

公开(公告)日：2008-07-31

申请号：US12002038

申请日：2007-12-14

申请人： Taiki Sawabe ,  Keiji Nomaru

发明人： Taiki Sawabe ,  Keiji Nomaru

IPC分类号： G01B11/06

CPC分类号： G01B11/0625 ,  B23K26/048 ,  B23K26/0861 ,  B23K2101/40

摘要： A measuring instrument for a wafer for measuring the thickness of a wafer held on a chuck table using a laser beam includes a condenser for condensing and irradiating the laser beam on the wafer held on the chuck table, a light reception unit for receiving reflected light of the laser beam irradiated upon the wafer, a convergence light point changing unit for changing the convergence light point of the laser beam, and a control unit for measuring the thickness of the wafer based on a change signal from the convergence light point changing unit and a light reception signal from the light reception unit. The control unit stores a thickness control map. The control unit controls an angle adjustment actuator, provided for adjusting the installation angle of a pair of mirrors, to change the installation angle and detects two peaks of the light amount based on the reception signal from the light reception unit.

摘要翻译： 用于测量使用激光束保持在卡盘台上的晶片的厚度的晶片测量仪器包括用于在保持在卡盘台上的晶片上聚集和照射激光束的聚光器，用于接收反射光的反射光的光接收单元 照射在晶片上的激光束，用于改变激光束的会聚光点的会聚光点改变单元和用于根据来自会聚光点改变单元的变化信号测量晶片的厚度的控制单元，以及 来自光接收单元的光接收信号。 控制单元存储厚度控制图。 控制单元控制角度调节致动器，用于调节一对反射镜的安装角度，以改变安装角度，并根据来自光接收单元的接收信号检测光量的两个峰值。

公开(公告)号：US20080067427A1

公开(公告)日：2008-03-20

申请号：US11900844

申请日：2007-09-13

申请人： Keiji Nomaru ,  Hiroshi Morikazu

发明人： Keiji Nomaru ,  Hiroshi Morikazu

IPC分类号： G21G5/00

CPC分类号： H01L21/76898 ,  B23K26/0622 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50 ,  H01L2924/0002 ,  H01L2924/00

摘要： In a via-hole formation method of forming a via-hole reaching a bonding pad, in a substrate of a wafer in which a plurality of devices are formed on a surface of the substrate and the bonding pad is formed on each of the devices, a pulse laser beam whose energy distribution is shaped into a top-hat shape is emitted to form a via-hole reaching a via-hole.

摘要翻译： 在形成到达焊盘的通孔的通孔形成方法中，在基板的表面上形成有多个器件的晶片的基板和在每个器件上形成接合焊盘的通孔形成方法中， 发射其能量分布形成顶帽形状的脉冲激光束，以形成到达通孔的通孔。

公开(公告)号：US20080061042A1

公开(公告)日：2008-03-13

申请号：US11899452

申请日：2007-09-06

申请人： Keiji Nomaru

发明人： Keiji Nomaru

IPC分类号： B23K26/38 ,  B23K26/073

CPC分类号： B23K26/073 ,  B23K26/0622 ,  B23K26/066 ,  B23K26/082 ,  B23K26/389

摘要： A laser beam machining system including a chuck table for holding a work, and a laser beam irradiation unit for irradiating the work held on the chuck table with a laser beam, wherein the laser beam irradiation unit includes: a pulsed laser beam oscillator for oscillating a pulsed laser beam; a condenser for condensing the pulsed laser beam oscillated from the pulsed laser beam oscillator; a laser beam scanning unit disposed between the pulsed laser beam oscillator and the condenser and operative to deflect the pulsed laser beam to be inputted to the condenser; and a laser beam reshaping unit which ids disposed between the pulsed laser beam oscillator and the laser beam scanning unit and by which the energy distribution of the pulsed laser beam oscillated from the pulsed laser beam oscillator is reshaped into a top hat shape.

摘要翻译： 一种激光束加工系统，包括：用于保持工件的卡盘台;激光束照射单元，用于用激光束照射夹持台上的作业，其中所述激光束照射单元包括：脉冲激光束振荡器， 脉冲激光束; 用于聚集从脉冲激光束振荡器振荡的脉冲激光束的聚光器; 激光束扫描单元，设置在所述脉冲激光束振荡器和所述冷凝器之间，并且可操作以使要输入到所述冷凝器的所述脉冲激光束偏转; 以及激光束整形单元，其设置在脉冲激光束振荡器和激光束扫描单元之间，并且脉冲激光束从脉冲激光束振荡器振荡的能量分布重新形成顶帽形状。

公开(公告)号：US20080055588A1

公开(公告)日：2008-03-06

申请号：US11896336

申请日：2007-08-31

申请人： Keiji Nomaru ,  Hiroshi Morikazu ,  Yasuomi Kaneuchi ,  Kouichi Nehashi ,  Yutaka Kobayashi

发明人： Keiji Nomaru ,  Hiroshi Morikazu ,  Yasuomi Kaneuchi ,  Kouichi Nehashi ,  Yutaka Kobayashi

IPC分类号： G01N21/00

CPC分类号： G01B11/22 ,  B23K26/03 ,  B23K26/034 ,  B23K26/0643 ,  B23K26/382 ,  B23K26/40 ,  B23K2103/50

摘要： A via hole depth detector for detecting the depth of a via hole formed in a workpiece held on a chuck table, comprising: a first surface position detection means which comprises a first detection laser beam oscillation means for oscillating a first detection laser beam having a predetermined wavelength and detects the height position of an illuminated portion of the workpiece based on the reflected light of the first detection laser beam; a second surface position detection means which comprises a second detection laser beam oscillation means for oscillating a second detection laser beam having a wavelength different from the wavelength of the first detection laser beam and detects the height position of an illuminated portion of the workpiece based on the reflected light of the second detection laser beam; and a control means for obtaining the depth of the via hole formed in the workpiece based on a detection value obtained by the first surface position detection means and a detection value obtained by the second surface position detection means.

公开(公告)号：US09289853B2

公开(公告)日：2016-03-22

申请号：US13536236

申请日：2012-06-28

申请人： Keiji Nomaru

发明人： Keiji Nomaru

IPC分类号： B23K26/364 ,  B23K26/073 ,  B23K26/08 ,  B23K26/40

CPC分类号： B23K26/073 ,  B23K26/0853 ,  B23K26/0869 ,  B23K26/364 ,  B23K26/40 ,  B23K2103/50

摘要： A laser beam applying apparatus includes a laser beam oscillating unit, a focusing lens, and a diffractive optic element provided between the laser beam oscillating unit and the focusing lens for defining the spot shape of the laser beam oscillated by the laser beam oscillating unit. A zeroth-order light removing unit removes zeroth-order light emerging from the diffractive optic element and leaves first-order light whose spot shape has been defined by the diffractive optic element and the focusing lens. A first prism has an incident surface and an emergent surface inclined with respect to the incident surface. A second prism has a zeroth-order light reflecting surface for reflecting the zeroth-order light and a first-order light emerging surface from which the first-order light emerges. A damper absorbs the zeroth-order light reflected on the zeroth-order light reflecting surface of the second prism.

摘要翻译： 激光束施加装置包括激光束振荡单元，聚焦透镜和设置在激光束振荡单元和聚焦透镜之间的衍射光学元件，用于限定由激光束振荡单元振荡的激光束的斑点形状。 零级光去除单元去除从衍射光学元件出射的零级光，并留下其点形状由衍射光学元件和聚焦透镜限定的一阶光。 第一棱镜具有入射表面和相对于入射表面倾斜的出射表面。 第二棱镜具有用于反射零级光的第零级光反射表面和一阶光出射的一级光出射表面。 阻尼器吸收在第二棱镜的零级光反射表面上反射的零级光。

公开(公告)号：US09193008B2

公开(公告)日：2015-11-24

申请号：US13473824

申请日：2012-05-17

申请人： Hiroshi Morikazu ,  Keiji Nomaru ,  Yoko Nishino

发明人： Hiroshi Morikazu ,  Keiji Nomaru ,  Yoko Nishino

IPC分类号： B23K26/00 ,  B23K26/06 ,  B23K26/02 ,  H01L21/00 ,  B23K26/08 ,  B23K26/36 ,  B23K26/40 ,  B23K26/30 ,  H01L33/00

CPC分类号： B23K26/3584 ,  B23K26/0613 ,  B23K26/0622 ,  B23K26/064 ,  B23K26/0648 ,  B23K26/0853 ,  B23K26/36 ,  B23K26/364 ,  B23K26/40 ,  B23K26/402 ,  B23K26/60 ,  B23K2101/40 ,  B23K2103/50 ,  H01L33/0095

摘要： A laser processing method of applying a pulsed laser beam to a workpiece formed from a transparent member, thereby performing laser processing to the workpiece. The laser processing method includes a first laser processing step of applying a first pulsed laser beam to a subject area of the workpiece to roughen the subject area and a second laser processing step of applying a second pulsed laser beam to the roughened subject area immediately after performing the first laser processing step, thereby forming a recess in the subject area. The first and second laser processing steps are repeated to thereby form a continuous groove in the subject area.

摘要翻译： 一种将脉冲激光束施加到由透明构件形成的工件上的激光加工方法，从而对工件进行激光加工。 激光加工方法包括：第一激光加工步骤，将第一脉冲激光束施加到工件的被摄体区域以粗糙化被摄体区域;以及第二激光加工步骤，在执行后立即将粗糙化的被摄体区域施加第二脉冲激光束 第一激光加工步骤，从而在主体区域中形成凹部。 重复第一和第二激光加工步骤，从而在主体区域中形成连续的凹槽。

公开(公告)号：US08766137B2

公开(公告)日：2014-07-01

申请号：US13281984

申请日：2011-10-26

申请人： Keiji Nomaru

发明人： Keiji Nomaru

IPC分类号： B23K26/02 ,  B23K26/06 ,  H01S3/00

CPC分类号： B23K26/02 ,  B23K26/06 ,  B23K26/0624 ,  B23K26/0853 ,  B23K26/0876 ,  B23K26/364 ,  B23K26/40 ,  B23K37/0211 ,  B23K2101/40 ,  B23K2103/50 ,  H01L21/268 ,  H01S3/00

摘要： An optical transmitting unit transmits a pulsed laser beam oscillated by a pulsed laser beam oscillator to a focusing unit in a laser processing apparatus. A wavelength band expanding unit expands the wavelength band of the pulsed laser beam, and a pulse width expanding unit increases the pulse width of the expanded pulsed laser beam. A focusing lens focuses the expanded pulsed laser beam. An optical fiber transmits the focused pulsed laser beam through a collimating lens and a pulse width compressing unit compresses the pulse width of the collimated pulsed laser beam to restore the original pulse width for transmission.

摘要翻译： 光发射单元将由脉冲激光束振荡器振荡的脉冲激光束发射到激光加工设备中的聚焦单元。 波长带扩展单元扩大脉冲激光束的波长带，并且脉冲宽度扩展单元增加扩展脉冲激光束的脉冲宽度。 聚焦透镜聚焦扩展的脉冲激光束。 光纤通过准直透镜传输聚焦的脉冲激光束，并且脉冲宽度压缩单元压缩准直脉冲激光束的脉冲宽度以恢复原始脉冲宽度以进行传输。