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41 条记录 (耗时 0.017 秒)

    Light emitting diode package and fabrication method thereof
    21.
    发明授权
    Light emitting diode package and fabrication method thereof 有权
    发光二极管封装及其制造方法

    公开(公告)号：US08735931B2

    公开(公告)日：2014-05-27

    申请号：US12907348

    申请日：2010-10-19

    申请人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    发明人： Kyung Taeg Han ,  In Tae Yeo ,  Hun Joo Hahm ,  Chang Ho Song ,  Seong Yeon Han ,  Yoon Sung Na ,  Dae Yeon Kim ,  Ho Sik Ahn ,  Young Sam Park

    IPC分类号： H01L33/62

    CPC分类号： H01L33/62 ,  H01L33/486 ,  H01L33/642 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

    摘要： An LED package and a fabrication method therefor. The LED package includes first and second lead frames made of heat and electric conductors, each of the lead frames comprising a planar base and extensions extending in opposed directions and upward directions from the base. The package also includes a package body made of a resin and configured to surround the extensions of the first and second lead frames to fix the first and second lead frames while exposing underside surfaces of the first and second lead frames. The LED package further includes a light emitting diode chip disposed on an upper surface of the base of the first lead frame and electrically connected to the bases of the first and second lead frames, and a transparent encapsulant for encapsulating the light emitting diode chip.

    摘要翻译： 一种LED封装及其制造方法。 LED封装包括由热和电导体制成的第一引线框架和第二引线框架，每个引线框架包括平面基座和从基座向相反方向和向上方向延伸的延伸部分。 封装还包括由树脂制成的封装主体，并且被配置为围绕第一引线框架和第二引线框架的延伸部分以固定第一和第二引线框架同时暴露第一引线框架和第二引线框架的下侧表面。 LED封装还包括设置在第一引线框架的基座的上表面上并电连接到第一引线框架和第二引线框架的基座的发光二极管芯片，以及用于封装发光二极管芯片的透明密封剂。

    High power light emitting diode package
    22.
    再颁专利
    High power light emitting diode package 有权
    大功率发光二极管封装

    公开(公告)号：USRE43200E1

    公开(公告)日：2012-02-21

    申请号：US12029220

    申请日：2008-02-11

    申请人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Wook Kim ,  Kyung Taeg Han

    IPC分类号： H01L33/00 ,  H01L29/22 ,  H01L23/48

    CPC分类号： H01L33/62 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/12041 ,  H01L2924/00

    摘要： The invention relates to a high power LED package, in which a package body is integrally formed with resin to have a recess for receiving an LED chip. A first sheet metal member is electrically connected with the LED chip, supports the LED chip at its upper partial portion in the recess, is surrounded by the package body extending to the side face of the package body, and has a heat transfer section for transferring heat generated from the LED chip to the metal plate of the board and extending downward from the inside of the package body so that a lower end thereof is exposed at a bottom face of the package body thus to contact the board. A second sheet metal member is electrically connected with the LED chip spaced apart from the first sheet metal member for a predetermined gap, and extends through the inside of the package body to the side face of the package body in a direction opposite to the first sheet metal member. A transparent sealant is sealingly filled up into the recess. The LED package raises thermal radiation efficiency with a simplified structure in order to reduce the size and thickness thereof.

    摘要翻译： 本发明涉及一种大功率LED封装，其中封装体与树脂一体地形成以具有用于接收LED芯片的凹部。 第一钣金构件与LED芯片电连接，在其凹部的上部局部部分处支撑LED芯片，被封装体包围，该封装主体延伸到封装主体的侧面，并具有用于传送的传热部分 从LED芯片产生的热量到板的金属板并且从封装体的内部向下延伸，使得其下端暴露在封装体的底面，从而与板接触。 第二金属板与LED芯片电连接，与第一金属板件隔开预定的间隙，并沿与第一片材相反的方向延伸穿过封装主体的内侧 金属构件。 透明密封剂密封地填充到凹槽中。 LED封装以简化的结构提高热辐射效率，以减小其尺寸和厚度。

    Chip coated light emitting diode package and manufacturing method thereof
    23.
    发明授权
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US08013352B2

    公开(公告)日：2011-09-06

    申请号：US12684614

    申请日：2010-01-08

    申请人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    发明人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    Direct-type backlight unit having surface light source
    24.
    发明授权
    Direct-type backlight unit having surface light source 失效
    具有表面光源的直接型背光单元

    公开(公告)号：US07887225B2

    公开(公告)日：2011-02-15

    申请号：US11822331

    申请日：2007-07-05

    申请人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    发明人： Won Joon Lee ,  In Tae Yeo ,  Hun Joo Hahm ,  Young Sam Park ,  Kyung Taeg Han ,  Ho Sik Ahn ,  Chang Ho Song

    IPC分类号： F21V8/00

    CPC分类号： G02F1/133603 ,  H01L33/52 ,  H01L2224/16225 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2933/005 ,  H01L2224/0401

    摘要： In a direct-type backlight unit, a board has upper and lower surfaces defining a thickness therebetween. A plurality of unit light sources are disposed on the board. Here, in each of the unit light sources, a wiring pattern is formed on the board. A light emitting device is disposed on the wiring pattern to electrically connect thereto. A non-conductive side wall surrounds, without interruption, the light emitting device at a predetermined interval therefrom, the non-conductive side wall having a height lower than that of the light emitting device. Also, an encapsulant is formed in a dome shape inside the side wall. In this fashion, the light emitting devices are mounted on the board by a chip-on-board technique.

    摘要翻译： 在直接型背光单元中，板具有限定其间厚度的上表面和下表面。 多个单元光源设置在板上。 这里，在各单位光源中，在基板上形成配线图案。 发光器件设置在布线图案上以与其电连接。 非导电侧壁以不间断的方式围绕发光器件以预定的间隔包围，非导电侧壁的高度低于发光器件的高度。 此外，密封剂在侧壁内形成为圆顶形状。 以这种方式，发光器件通过板上芯片技术安装在板上。

    LED housing and fabrication method thereof
    25.
    发明授权
    LED housing and fabrication method thereof 有权
    LED外壳及其制造方法

    公开(公告)号：US07678592B2

    公开(公告)日：2010-03-16

    申请号：US11680847

    申请日：2007-03-01

    申请人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    发明人： Seon Goo Lee ,  Bum Joon Jin ,  Kyung Taeg Han ,  Chang Wook Kim

    IPC分类号： H01L21/00

    CPC分类号： H01L33/642 ,  H01L33/486 ,  H01L33/62 ,  H01L33/647 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01019 ,  H01L2924/12041 ,  H01L2924/00014

    摘要： In an LED housing, a heat conducting part has a chip mounting area, a heat connecting area opposed to the chip mounting area and a groove formed adjacent to the heat connecting area. An electrical connecting part has a wiring area placed adjacent to the chip mounting area and an external power connecting area led to the wiring area. A housing body is made of molding resin, and integrally holds the heat conducting part and the electrical connecting part while isolating the electrical connecting part from the heat conducting part. The housing body is provided with a recess extended from a portion of the groove of the heat conducting part to a side of the housing body.

    摘要翻译： 在LED壳体中，导热部具有芯片安装区域，与芯片安装区域相对的热连接区域和与热连接区域相邻形成的槽。 电气连接部件具有与芯片安装区域相邻放置的布线区域和引导到布线区域的外部电源连接区域。 壳体由成型树脂制成，并且一体地保持导热部和电连接部，同时将电连接部与导热部隔离。 壳体设置有从导热部分的槽的一部分延伸到壳体的一侧的凹部。

    Light emitting diode package with diffuser and method of manufacturing the same
    26.
    发明授权
    Light emitting diode package with diffuser and method of manufacturing the same 有权
    具有扩散器的发光二极管封装及其制造方法

    公开(公告)号：US07501656B2

    公开(公告)日：2009-03-10

    申请号：US11491947

    申请日：2006-07-25

    申请人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    发明人： Seong Yeon Han ,  Seon Goo Lee ,  Chang Ho Song ,  Jung Kyu Park ,  Young Sam Park ,  Kyung Taeg Han

    IPC分类号： H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC分类号： H01L33/58 ,  H01L33/505 ,  H01L2224/48091 ,  H01L2224/49107 ,  H01L2224/73265 ,  H01L2924/181 ,  H01L2933/0091 ,  H01L2924/00014 ,  H01L2924/00012

    摘要： The invention relates to an LED package for facilitating color mixing using a diffuser and a manufacturing method of the same. The LED package includes a substrate with an electrode formed thereon, and an LED chip mounted on the substrate. The LED package also includes an encapsulant applied around the light emitting diode chip, containing a diffuser. The LED package further includes a lens part disposed on the light emitting diode chip and the encapsulant to radiate light in a wide angle. The LED package allows light from the light emitting diode chip to be emitted out of the package without distortion. The invention allows light to exit through the encapsulant containing the diffuser and the lens part, achieving uniform diffusion and emission of light from the LED chip, thereby increasing a radiating angle and obtaining a uniform light source.

    摘要翻译： 本发明涉及一种便于使用扩散器进行混色的LED封装及其制造方法。 LED封装包括其上形成有电极的基板和安装在基板上的LED芯片。 LED封装还包括施加在发光二极管芯片周围的密封剂，其包含扩散器。 LED封装还包括设置在发光二极管芯片上的透镜部分和密封剂以广角度辐射光。 LED封装允许来自发光二极管芯片的光从封装外部发射而不变形。 本发明允许光通过包含扩散器和透镜部分的密封剂而离开，实现来自LED芯片的均匀的扩散和发射，从而增加辐射角度并获得均匀的光源。

    Chip coated light emitting diode package and manufacturing method thereof
    29.
    发明授权
    Chip coated light emitting diode package and manufacturing method thereof 有权
    芯片涂层发光二极管封装及其制造方法

    公开(公告)号：US08324646B2

    公开(公告)日：2012-12-04

    申请号：US12842493

    申请日：2010-07-23

    申请人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    发明人： Seon Goo Lee ,  Kyung Taeg Han ,  Seong Yeon Han

    IPC分类号： H01L33/00

    CPC分类号： H01L33/62 ,  H01L33/508 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/48465 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/00014 ,  H01L2924/00

    摘要： A chip coated LED package and a manufacturing method thereof. The chip coated LED package includes a light emitting chip composed of a chip die-attached on a submount and a resin layer uniformly covering an outer surface of the chip die. The chip coated LED package also includes an electrode part electrically connected by metal wires with at least one bump ball exposed through an upper surface of the resin layer. The chip coated LED package further includes a package body having the electrode part and the light emitting chip mounted thereon. The invention improves light efficiency by preventing difference in color temperature according to irradiation angles, increases a yield, miniaturizes the package, and accommodates mass production.

    摘要翻译： 一种芯片涂覆的LED封装及其制造方法。 芯片涂覆的LED封装包括由安装在基座上的芯片芯片和均匀覆盖芯片裸片外表面的树脂层组成的发光芯片。 芯片涂覆的LED封装还包括通过金属线电连接的电极部分，其中至少一个凸块球通过树脂层的上表面暴露。 芯片涂覆的LED封装还包括具有安装在其上的电极部分和发光芯片的封装体。 本发明通过根据照射角度防止色温差异提高光效，提高成品率，使封装体小型化，适应批量生产。

    LED package having recess in heat conducting part
    30.
    发明授权
    LED package having recess in heat conducting part 有权
    LED封装在导热部分具有凹槽

    公开(公告)号：US08169128B2

    公开(公告)日：2012-05-01

    申请号：US11500361

    申请日：2006-08-08

    申请人： Seon Goo Lee ,  Chang Ho Song ,  Kyung Taeg Han

    发明人： Seon Goo Lee ,  Chang Ho Song ,  Kyung Taeg Han

    IPC分类号： H01J1/02

    CPC分类号： H01L33/647 ,  H01L24/97 ,  H01L33/486 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/12041 ,  H01L2924/181 ,  Y10S362/80 ,  H01L2924/00014 ,  H01L2924/00

    摘要： The invention provides an LED package including an LED chip. In the LED package, a heat conducting part of folded sheet metals has a recess formed thereon to seat the LED chip therein. A package body houses the heat conducting part and directs light generated from the LED chip upward. Also, a transparent encapsulant is provided to at least the recess of the heat conducting part. Leads are partially housed by the package body to supply power to the LED chip. According to the invention, the sheet metals are folded to form the heat conducting part, and the recess is formed on the heat conducting part to seat the LED chip therein. This improves reflection efficiency and simplifies an overall process.

    摘要翻译： 本发明提供了一种包括LED芯片的LED封装。 在LED封装中，折叠的金属片的导热部分具有形成在其上的凹部，以将LED芯片置于其中。 包装体容纳导热部分，并将LED芯片产生的光向上引导。 此外，透明密封剂至少设置在导热部分的凹部上。 引线部分地由封装体容纳以向LED芯片供电。 根据本发明，折叠金属板以形成导热部分，并且在导热部分上形成凹部以将LED芯片置于其中。 这提高了反射效率并简化了整个过程。