摘要:
An output circuit of a semiconductor device includes a signal selector configured to receive first and second input data signals and sequentially outputting the first and second input data signals in response to a phase signal; and an output level controller configured to control a voltage level of an output signal of the signal selector based on the first and second input data signals.
摘要:
A delay locked loop circuit for compensating for a phase skew of a memory device includes a first delay locking unit configured to delay an external clock of the memory device by a first amount of delay to output a first internal clock, a second locking unit configured to delay the external clock by a second amount of delay to output a second internal clock, the second amount of delay being greater than the first amount of delay, and a selecting unit configured to select one of the first internal clock and the second internal clock as an internal clock of the memory device.
摘要:
Semiconductor memory device with duty correction circuit includes a clock edge detector configured to generate first and second detection pulses in response to a transition timing of a common clock signal in an initial measurement operation; a duty detector configured to compare the first and second detection pulses to output comparison result signals; and a code counter configured to control the duty detector based on the comparison signals outputted from the duty detector in the initial measurement operation.
摘要:
A semiconductor memory device includes a thermosensor that senses present temperatures of the device and confirms whether the temperature values are valid. The thermosensor includes a temperature sensing unit, a storage unit and an initializing unit. The temperature sensing unit senses temperatures in response to a driving signal. The storage unit stores output signals of the temperature sensing unit and outputs temperature values. The initializing unit initializes the storage unit after a predetermined time from an activation of the driving signal. A driving method includes driving the thermosensor in response to the driving signal, requesting a re-driving after a predetermined time from the activation of the driving signal, and re-driving the thermosensor in response to the driving signal input again.
摘要:
A circuit for controlling a driver of a semiconductor memory apparatus includes a driving unit having an impedance that is set according to a code value; a driving reinforcing control unit configured to output an adjustment code for a predetermined time; and a driving reinforcing unit configured to output a reinforcing code obtained by adjusting the code value using the adjustment code, wherein the reinforcing code reinforce a driving capability of the driving unit.
摘要:
A semiconductor memory device includes a reference signal generating unit for generating a reference signal; a comparing unit for comparing the reference signal with a test signal applied to a test pad to output an adjusted value after adjusting the adjusted value until the test signal is equal to the reference signal; an impedance measuring unit for measuring an impedance of the test pad based on the adjusted value to output the test signal; an impedance adjusting unit for adjusting an impedance of a data I/O pad to have an impedance value corresponding to the adjusted value outputted when the test signal is equal to the reference signal; an impedance control unit for controlling the comparing unit so that the adjusted value is outputted when the test signal is equal to the reference signal; and a reference signal control unit for adjusting a voltage level of the reference signal.
摘要:
A bandgap reference generating circuit includes an operational amplifier configured to generate a bandgap reference voltage; and a gain controller configured to control a gain of the operational amplifier with different values in a normal mode and a low power mode.
摘要:
Circuit and method for recovering clock data in highly integrated semiconductor memory apparatus includes a plurality of signal receiving units configured to receive signals through a plurality of input/output pads and transfer the signals according to a receiving reference clock, the signal receiving units being divided into groups, a plurality of phase detection units configured to detect phases of signals output from the groups of the signal receiving units, a plurality of phase detection control units configured to control the phase detection units so that the phase detection units sequentially detect the phases of the signals output from each of the groups of the signal receiving units and a notification unit configured to output signals output from the phase detection units.
摘要:
A termination impedance control circuit is capable of controlling a dynamic ODT operation in a DDR3-level semiconductor memory device. The termination impedance control circuit includes a counter unit configured to count an external clock and an internal clock to output a first code and a second code, respectively, and a dynamic controller configured to enable a dynamic termination operation by comparing the first code with the second code in response to a write command and disable the dynamic termination operation after a predetermined time, determined according to a burst length, has lapsed after the dynamic termination operation is enabled.
摘要:
A current mode logic (CML)-complementary metal oxide semiconductor (CMOS) converter prevents change of a duty ratio to stably operate during an operation for converting a CML level signal into a CMOS level signal. The CML-CMOS converter includes a reference level shifting unit configured to receive a CML signal swinging about a first reference level to shift a swing reference level to a second reference level; and an amplifying unit configured to amplify an output signal of the reference level shifting unit to output the amplified signal as a CMOS signal.