公开(公告)号：US20110118462A1

公开(公告)日：2011-05-19

申请号：US12621237

申请日：2009-11-18

Applicant: Mao CHEN ,  Shaoxuan Zhu ,  Xuebin Liu ,  Lizhen Zheng ,  Liwei Lin ,  Shuwen Xu ,  Yuping Wang ,  Wei Yang ,  Yunfeng Li ,  Fang Ye ,  Xiaona Zhang

Inventor： Mao CHEN ,  Shaoxuan Zhu ,  Xuebin Liu ,  Lizhen Zheng ,  Liwei Lin ,  Shuwen Xu ,  Yuping Wang ,  Wei Yang ,  Yunfeng Li ,  Fang Ye ,  Xiaona Zhang

IPC: C07D501/16

CPC classification number: C07D501/36

Abstract: The invention relates to N-heterocyclic substituent-containing antibiotics, their preparation, and their use. Disclosed are sodium and potassium salts of 7-(α-((N,N′-diisopropylamidino)thio)acetylamino)-3-(((1,2,5,6-tetrahydro-2-methyl-5,6-dioxo-1,2,4-triazin-3-yl)thio)methyl) cephalosporanic acid as presented by the general structure (I), their preparation, and their use. The antibiotics of the invention can be used to treat diseases caused by Gram-positive or Gram-negative bacteria such as septicaemia, gastrointestinal tract infection, and urinary tract infection. They have increased half-life in blood and lowered toxicity. They can reduce the frequency of drug use and lower medical treatment costs. They have improved stability and can be stored at ambient temperatures. The method of the invention is simple, and it produces high purity products which can meet the requirements of clinical use.

Abstract translation: 本发明涉及含有N-杂环取代基的抗生素，其制备及其应用。 公开了7-（α - （（N，N'-二异丙基脒基）硫基）乙酰氨基）-3 - （（（1,2,5,6-四氢-2-甲基-5,6-二氧代 -1,2,4-三嗪-3-基）硫基）甲基）头孢烷酸，其总体结构（I），它们的制备及其用途。 本发明的抗生素可用于治疗由革兰氏阳性或革兰氏阴性菌引起的疾病，例如败血症，胃肠道感染和尿路感染。 它们增加了血液中的半衰期，降低了毒性。 它们可以减少使用药物的频率，降低医疗费用。 它们具有改善的稳定性并且可以在环境温度下储存。 本发明的方法简单，产生可满足临床用途要求的高纯度产品。

公开(公告)号：US07785415B2

公开(公告)日：2010-08-31

申请号：US11939986

申请日：2007-11-14

Applicant: Liwei Lin ,  Ongi Englander ,  Dane Christensen

Inventor： Liwei Lin ,  Ongi Englander ,  Dane Christensen

IPC: C30B23/04

CPC classification number: H01L21/02532 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B33/02 ,  C01B2202/34 ,  C01B2202/36 ,  C23C16/0281 ,  C23C16/24 ,  C23C16/26 ,  H01L21/02381 ,  H01L21/02603 ,  H01L21/02606 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/02645 ,  H01L21/02653 ,  H01L51/0002 ,  H01L51/0048 ,  H01L51/0052

Abstract: Systems and methods for local synthesis of silicon nanowires and carbon nanotubes, as well as electric field assisted self-assembly of silicon nanowires and carbon nanotubes, are described. By employing localized heating in the growth of the nanowires or nanotubes, the structures can be synthesized on a device in a room temperature chamber without the device being subjected to overall heating. The method is localized and selective, and provides for a suspended microstructure to achieve the thermal requirement for vapor deposition synthesis, while the remainder of the chip or substrate remains at room temperature. Furthermore, by employing electric field assisted self-assembly techniques according to the present invention, it is not necessary to grow the nanotubes and nanowires and separately connect them to a device. Instead, the present invention provides for self-assembly of the nanotubes and nanowires on the devices themselves, thus providing for nano- to micro-integration.

Abstract translation: 描述了用于硅纳米线和碳纳米管的局部合成的系统和方法，以及硅纳米线和碳纳米管的电场辅助自组装。 通过在纳米线或纳米管的生长中采用局部加热，可以在室温室中的器件上合成结构，而不对器件进行整体加热。 该方法是局部和选择性的，并且提供悬浮的微结构以实现气相沉积合成的热需求，而芯片或衬底的其余部分保持在室温。 此外，通过采用根据本发明的电场辅助自组装技术，不需要使纳米管和纳米线生长并且将它们单独地连接到器件。 相反，本发明提供纳米管和纳米线在装置本身上的自组装，从而提供纳米到微集成。

公开(公告)号：US20100181648A1

公开(公告)日：2010-07-22

申请号：US11939986

申请日：2007-11-14

Applicant: Liwei Lin ,  Ongi Englander ,  Dane Christensen

Inventor： Liwei Lin ,  Ongi Englander ,  Dane Christensen

IPC: H01L27/00 ,  C23C16/00 ,  C30B25/10

CPC classification number: H01L21/02532 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B33/02 ,  C01B2202/34 ,  C01B2202/36 ,  C23C16/0281 ,  C23C16/24 ,  C23C16/26 ,  H01L21/02381 ,  H01L21/02603 ,  H01L21/02606 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/02645 ,  H01L21/02653 ,  H01L51/0002 ,  H01L51/0048 ,  H01L51/0052

Abstract: Systems and methods for local synthesis of silicon nanowires and carbon nanotubes, as well as electric field assisted self-assembly of silicon nanowires and carbon nanotubes, are described. By employing localized heating in the growth of the nanowires or nanotubes, the structures can be synthesized on a device in a room temperature chamber without the device being subjected to overall heating. The method is localized and selective, and provides for a suspended microstructure to achieve the thermal requirement for vapor deposition synthesis, while the remainder of the chip or substrate remains at room temperature. Furthermore, by employing electric field assisted self-assembly techniques according to the present invention, it is not necessary to grow the nanotubes and nanowires and separately connect them to a device. Instead, the present invention provides for self-assembly of the nanotubes and nanowires on the devices themselves, thus providing for nano- to micro-integration.

Abstract translation: 描述了硅纳米线和碳纳米管的局部合成的系统和方法，以及硅纳米线和碳纳米管的电场辅助自组装。 通过在纳米线或纳米管的生长中采用局部加热，可以在室温室中的器件上合成结构，而不对器件进行整体加热。 该方法是局部和选择性的，并且提供悬浮的微结构以实现气相沉积合成的热需求，而芯片或衬底的其余部分保持在室温。 此外，通过采用根据本发明的电场辅助自组装技术，不需要使纳米管和纳米线生长并且将它们单独地连接到器件。 相反，本发明提供纳米管和纳米线在装置本身上的自组装，从而提供纳米到微集成。

公开(公告)号：US07452800B2

公开(公告)日：2008-11-18

申请号：US11598244

申请日：2006-11-09

Applicant: Brian D. Sosnowchik ,  Liwei Lin ,  Albert P. Pisano

Inventor： Brian D. Sosnowchik ,  Liwei Lin ,  Albert P. Pisano

IPC: H01L21/44

CPC classification number: B81C3/001 ,  B23K1/0016 ,  B23K1/002 ,  B23K1/203 ,  B23K2101/40 ,  B23K2103/08 ,  B23K2103/10 ,  B23K2103/12 ,  B23K2103/18 ,  B23K2103/26 ,  B23K2103/52 ,  B23K2103/54 ,  B23K2103/56 ,  G01L1/2293 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29111 ,  H01L2224/2919 ,  H01L2224/83222 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01077 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/01327 ,  H01L2924/0133 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/09701 ,  H01L2924/10253 ,  H01L2924/30105 ,  H05B3/845 ,  H01L2924/00 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: A bonding technique suitable for bonding a non-metal body, such as a silicon MEMS sensor, to a metal surface, such a steel mechanical component is rapid enough to be compatible with typical manufacturing processes, and avoids any detrimental change in material properties of the metal surface arising from the bonding process. The bonding technique has many possible applications, including bonding of MEMS strain sensors to metal mechanical components. The inventive bonding technique uses inductive heating of a heat-activated bonding agent disposed between metal and non-metal objects to quickly and effectively bond the two without changing their material properties. Representative tests of silicon to steel bonding using this technique have demonstrated excellent bond strength without changing the steel's material properties. Thus, with this induction bonding approach, silicon MEMS devices can be manufacturably bonded to mechanical steel components for real time monitoring of the conditions/environment of a steel component.

Abstract translation: 适用于将诸如硅MEMS传感器的非金属体接合到诸如钢机械部件的金属表面的接合技术足够快以与典型的制造工艺相容，并且避免了材料特性的任何有害变化 金属表面产生的粘结过程。 粘合技术具有许多可能的应用，包括将MEMS应变传感器结合到金属机械部件。 本发明的粘合技术使用设置在金属和非金属物体之间的热激活粘合剂的感应加热来快速有效地粘合两者而不改变它们的材料性质。 使用这种技术的硅到钢接合的代表性测试已经证明了优异的粘结强度，而不改变钢的材料性质。 因此，通过这种感应焊接方法，硅MEMS器件可以可制造地结合到机械钢部件上，以实时监测钢部件的状况/环境。

公开(公告)号：US07342346B2

公开(公告)日：2008-03-11

申请号：US11381035

申请日：2006-05-01

Applicant: Jongbaeg Kim ,  Liwei Lin

Inventor： Jongbaeg Kim ,  Liwei Lin

IPC: H02N1/00 ,  G02B26/08

CPC classification number: H02N1/008 ,  G02B26/0841 ,  Y10T29/49609 ,  Y10T29/49861 ,  Y10T29/49865

Abstract: A microfabricated actuator of the vertical comb-drive (AVC) type or staggered vertical comb-drive type for torsional or linear applications includes torsion springs which permit self-aligned deformation of the device (micromirror) structure of the actuator through the heating of the torsional springs to plasticity. The torsional springs can include perpendicular-beam springs or double folded beams which allow axial movement of the spring when heated. Heating of the springs can be by bulk heating of the actuator structure or by Joule heating to the torsional springs by passing an electrical current therethrough.

Abstract translation: 用于扭转或线性应用的垂直梳驱动（AVC）型或交错垂直梳驱动型的微加速致动器包括扭簧，其允许致动器的装置（微镜）结构通过加热扭转而自对准变形 弹性到可塑性。 扭转弹簧可以包括垂直梁弹簧或双折叠梁，其允许当加热时弹簧的轴向移动。 弹簧的加热可以通过致动器结构的体积加热或者通过使电流通过其而通过焦耳加热到扭转弹簧。

公开(公告)号：US20070287634A1

公开(公告)日：2007-12-13

申请号：US11452114

申请日：2006-06-12

Applicant: Liwei Lin ,  Firas Sammoura

Inventor： Liwei Lin ,  Firas Sammoura

IPC: C04B35/45

CPC classification number: H01P1/208 ,  H01P1/182

Abstract: An actively tunable waveguide-based iris filter having a first part including a first portion of a deformable iris filter cavity having an inlet and an outlet; a second part operatively coupled with the first part and including a second portion of the deformable iris filter cavity having a deformable membrane operatively coupled with the first portion of a deformable iris filter cavity; the first portion and the second portion together forming the deformable iris filter cavity of the tunable waveguide-based iris filter; and means for moving the deformable membrane, whereby movement of the deformable membrane changes the geometry of the deformable iris filter cavity for causing a change in the frequency of a signal being filtered by the filter. The tunable filter is fabricated using a MEMS-based process including a plastic micro embossing process and a gold electroplating process. Prototype filters were fabricated and measured with bandwidth of 4.05 GHz centered at 94.79 GHz with a minimum insertion loss of 2.37 dB and return loss better than 15 dB. A total of 2.59 GHz center frequency shift was achieved when membranes deflected from −50 μm to +150 μm.

Abstract translation: 一种可主动调谐的基于波导的虹膜滤光器，其具有第一部分，该第一部分包括具有入口和出口的可变形虹膜滤光腔的第一部分; 第二部分与第一部分可操作地联接并且包括可变形虹膜过滤器空腔的第二部分，其具有可操作地与可变形虹膜过滤器腔的第一部分耦合的可变形膜; 所述第一部分和所述第二部分一起形成所述可调谐波导基虹膜滤光器的可变形虹膜滤光腔; 以及用于移动可变形膜的装置，由此可变形膜的运动改变了可变形虹膜过滤腔的几何形状，以引起被过滤器过滤的信号频率的变化。 可调滤波器使用基于MEMS的工艺制造，包括塑料微压花工艺和金电镀工艺。 原型滤波器的制作和测量带宽为4.05 GHz，中心为94.79 GHz，插入损耗最小为2.37 dB，回波损耗优于15 dB。 当膜从-50 mum偏转到+150 mum时，总共达到2.59 GHz的中心频移。

公开(公告)号：US07089666B2

公开(公告)日：2006-08-15

申请号：US10851543

申请日：2004-05-20

Applicant: Jongbaeg Kim ,  Liwei Lin

Inventor： Jongbaeg Kim ,  Liwei Lin

IPC: G02B26/00 ,  H02N1/00

CPC classification number: H02N1/008 ,  G02B26/0841 ,  Y10T29/49609 ,  Y10T29/49861 ,  Y10T29/49865

Abstract: A microfabricated actuator of the vertical comb-drive (AVC) type or staggered vertical comb-drive type for torsional or linear applications includes torsion springs which permit self-aligned deformation of the device (micromirror) structure of the actuator through the heating of the torsional springs to plasticity. The torsional springs can include perpendicular-beam springs or double folded beams which allow axial movement of the spring when heated. Heating of the springs can be by bulk heating of the actuator structure or by Joule heating to the torsional springs by passing an electrical current therethrough.

Abstract translation: 用于扭转或线性应用的垂直梳驱动（AVC）型或交错垂直梳驱动型的微加速致动器包括扭簧，其允许致动器的装置（微镜）结构通过加热扭转而自对准变形 弹性到可塑性。 扭转弹簧可以包括垂直梁弹簧或双折叠梁，其允许当加热时弹簧的轴向移动。 弹簧的加热可以通过致动器结构的体积加热或者通过使电流通过其而通过焦耳加热到扭转弹簧。

公开(公告)号：US20050253220A1

公开(公告)日：2005-11-17

申请号：US11027749

申请日：2004-12-29

Applicant: Liwei Lin ,  Ongi Englander ,  Dane Christensen

Inventor： Liwei Lin ,  Ongi Englander ,  Dane Christensen

IPC: C01B31/02 ,  C01B33/02 ,  C23C16/02 ,  C23C16/24 ,  C23C16/26 ,  C23C16/44 ,  H01L21/20 ,  H01L29/00 ,  H01L51/00

CPC classification number: H01L21/02532 ,  B82Y10/00 ,  B82Y30/00 ,  B82Y40/00 ,  C01B32/162 ,  C01B33/02 ,  C01B2202/34 ,  C01B2202/36 ,  C23C16/0281 ,  C23C16/24 ,  C23C16/26 ,  H01L21/02381 ,  H01L21/02603 ,  H01L21/02606 ,  H01L21/0262 ,  H01L21/02636 ,  H01L21/02645 ,  H01L21/02653 ,  H01L51/0002 ,  H01L51/0048 ,  H01L51/0052

Abstract: Systems and methods for local synthesis of silicon nanowires and carbon nanotubes, as well as electric field assisted self-assembly of silicon nanowires and carbon nanotubes, are described. By employing localized heating in the growth of the nanowires or nanotubes, the structures can be synthesized on a device in a room temperature chamber without the device being subjected to overall heating. The method is localized and selective, and provides for a suspended microstructure to achieve the thermal requirement for vapor deposition synthesis, while the remainder of the chip or substrate remains at room temperature. Furthermore, by employing electric field assisted self-assembly techniques according to the present invention, it is not necessary to grow the nanotubes and nanowires and separately connect them to a device. Instead, the present invention provides for self-assembly of the nanotubes and nanowires on the devices themselves, thus providing for nano- to micro-integration.

Abstract translation: 描述了用于硅纳米线和碳纳米管的局部合成的系统和方法，以及硅纳米线和碳纳米管的电场辅助自组装。 通过在纳米线或纳米管的生长中采用局部加热，可以在室温室中的器件上合成结构，而不对器件进行整体加热。 该方法是局部和选择性的，并且提供悬浮的微结构以实现气相沉积合成的热需求，而芯片或衬底的其余部分保持在室温。 此外，通过采用根据本发明的电场辅助自组装技术，不需要使纳米管和纳米线生长并且将它们单独地连接到器件。 相反，本发明提供纳米管和纳米线在装置本身上的自组装，从而提供纳米到微集成。

公开(公告)号：US06232150B1

公开(公告)日：2001-05-15

申请号：US09204473

申请日：1998-12-03

Applicant: Liwei Lin ,  Yu-Ting Cheng ,  Khalil Najafi ,  Kensall D. Wise

Inventor： Liwei Lin ,  Yu-Ting Cheng ,  Khalil Najafi ,  Kensall D. Wise

IPC: H01L2144

CPC classification number: H03H9/1057 ,  B81C1/00269 ,  B81C2203/0181 ,  G01P2015/0828 ,  H01L2924/16235 ,  H03H3/0072

Abstract: A method for making a microstructure assembly, the method including the steps of providing a first substrate and a second substrate; depositing an electrically conductive material on the second substrate; contacting the second substrate carrying the electrically conductive material with the first substrate; and then supplying current to the electrically conductive material to locally elevate the temperature of said electrically conductive material and cause formation of a bond between the first substrate and the second substrate.

Abstract translation: 一种制造微结构组件的方法，所述方法包括提供第一基板和第二基板的步骤; 在第二基板上沉积导电材料; 使承载导电材料的第二基板与第一基板接触; 然后向导电材料提供电流以局部地升高所述导电材料的温度，并引起在第一衬底和第二衬底之间形成结合。

公开(公告)号：US5591139A

公开(公告)日：1997-01-07

申请号：US254328

申请日：1994-06-06

Applicant: Liwei Lin ,  Albert P. Pisano

Inventor： Liwei Lin ,  Albert P. Pisano

IPC: A61B17/20 ,  A61M37/00 ,  G01N33/487 ,  G01N35/00 ,  A61M5/32

CPC classification number: A61M37/0015 ,  A61B17/205 ,  A61M37/00 ,  G01N2035/00237 ,  G01N33/4833

Abstract: An IC-processed microneedle including an interface region and shaft. A shell defines an enclosed channel to form the shaft. The shaft has ports to permit fluid movement therethrough. Microheaters, microdetectors and additional devices may also be fabricated on the microneedle.

Abstract translation: IC处理的微针包括界面区域和轴。 外壳限定一个封闭的通道以形成轴。 轴具有允许流体从其中移动的端口。 微型加热器，微型检测器和附加装置也可以在微针上制造。