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公开(公告)号：US20100285275A1
公开(公告)日：2010-11-11
申请号：US12763649
申请日：2010-04-20
Applicant: Adra Smith Baca , Karl William Koch, III , Shari Elizabeth Koval , Prantik Mazumder , Mark Alejandro Quesada , Wageesha Senaratne , Todd Parrish St. Clair
Inventor： Adra Smith Baca , Karl William Koch, III , Shari Elizabeth Koval , Prantik Mazumder , Mark Alejandro Quesada , Wageesha Senaratne , Todd Parrish St. Clair
CPC classification number: C03C17/42 , C03C3/083 , C03C3/091 , C03C15/00 , C03C17/23 , C03C19/00 , C03C21/002 , C03C2217/75 , C03C2217/76 , C03C2217/77 , C03C2218/34 , Y10T428/24355 , Y10T428/315
Abstract: A glass substrate having at least one surface with engineered properties that include hydrophobicity, oleophobicity, anti-stick or adherence of particulate or liquid matter, resistance to fingerprinting, durability, and transparency (i.e., haze
Abstract translation: 具有至少一个具有工程特性的表面的玻璃基底，其包括颗粒或液体物质的疏水性，疏油性，抗粘附性或粘附性，耐指纹性，耐久性和透明度（即雾度<10％）。 该表面包括至少一组拓扑特征，它们一起具有防止几何形状，其防止包含水和皮脂油中的至少一种的液滴的接触角和钉扎。
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22.发明授权公开(公告)号：US07829147B2
公开(公告)日：2010-11-09
申请号：US12072784
申请日：2008-02-28
Applicant: Bruce Gardiner Aitken , Shari Elizabeth Koval , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Shari Elizabeth Koval , Mark Alejandro Quesada
CPC classification number: C23C14/086 , C03C3/12 , C03C3/247 , C03C8/24 , C03C17/3615 , C03C17/3621 , C03C17/3649 , C03C17/3663 , H01L51/5253 , Y10T428/239
Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.
Abstract translation: 这里描述了不进行热处理步骤而密封装置的方法和所得的密封装置。 该方法包括以下步骤：（1）将未封装的装置相对于沉积装置定位在所需位置; 和（2）使用沉积装置将密封材料沉积在未封装装置的至少一部分上以形成密封装置，而不必进行后沉积热处理步骤。 例如，密封材料可以是含Sn2 +的无机氧化物材料或低液相线温度的无机材料。
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23.发明授权Sealing technique for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device 有权密封技术用于减少气密密封装置所需的时间和由此产生的密封装置公开(公告)号：US07722929B2
公开(公告)日：2010-05-25
申请号：US11820855
申请日：2007-06-21
Applicant: Bruce Gardiner Aitken , Chong Pyung An , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Chong Pyung An , Mark Alejandro Quesada
CPC classification number: C23C14/06 , C03C3/247 , C03C8/24 , C03C17/3615 , C03C17/3649 , C03C17/3671 , C03C17/3678 , H01L51/5253
Abstract: A sealing method for decreasing the time it takes to hermetically seal a device and the resulting hermetically sealed device (e.g., a hermetically sealed OLED device) are described herein. The sealing method includes the steps of: (1) cooling an un-encapsulated device; (2) depositing a sealing material over at least a portion of the cooled device to form an encapsulated device; and (3) heat treating the encapsulated device to form a hermetically sealed device. In one embodiment, the sealing material is a low liquidus temperature inorganic (LLT) material such as, for example, tin-fluorophosphate glass, tungsten-doped tin fluorophosphate glass, chalcogenide glass, tellurite glass, borate glass and phosphate glass. In another embodiment, the sealing material is a Sn2+-containing inorganic oxide material such as, for example, SnO, SnO+P2O5 and SnO+BPO4.
Abstract translation: 这里描述了用于减少密封装置所需的时间和所得的密封装置（例如，气密密封的OLED装置）的密封方法。 密封方法包括以下步骤：（1）冷却未封装的装置; （2）在冷却装置的至少一部分上沉积密封材料以形成封装装置; 和（3）对封装的装置进行热处理以形成密封装置。 在一个实施方案中，密封材料是低液相线温度无机（LLT）材料，例如锡 - 氟磷酸盐玻璃，掺杂钨的锡氟磷酸盐玻璃，硫族化物玻璃，碲酸盐玻璃，硼酸盐玻璃和磷酸盐玻璃。 在另一个实施例中，密封材料是含Sn2 +的无机氧化物材料，例如SnO，SnO + P2O5和SnO + BPO4。
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公开(公告)号：US20090121333A1
公开(公告)日：2009-05-14
申请号：US11980264
申请日：2007-10-30
Applicant: Bruce Gardiner Aitken , Dana Craig Bookbinder , Sean Matthew Garner , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Dana Craig Bookbinder , Sean Matthew Garner , Mark Alejandro Quesada
IPC: H01L23/02 , B05D3/02 , B05D5/00 , C23C16/52 , C23C16/56 , C23C14/58 , C23C14/54 , B32B3/10 , B32B33/00 , C23C14/00 , C23C16/22
CPC classification number: C23C14/5806 , C03C3/122 , C03C3/14 , C03C3/247 , C23C14/10 , H01L51/5253 , H01L2251/5338 , H01L2251/566 , Y10T428/13 , Y10T428/239 , Y10T428/24777 , Y10T428/24802 , Y10T428/263 , Y10T428/264 , Y10T428/265
Abstract: Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
Abstract translation: 方法和装置提供：将无机阻挡层施加到柔性基底的至少一部分上，阻挡层由低液相线温度（LLT）材料形成; 并且在将柔性基板保持在临界温度以下的同时烧结无机阻挡层。
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25.发明申请LLT barrier layer for top emission display device, method and apparatus 审中-公开用于顶部发射显示装置的LLT阻挡层，方法和装置公开(公告)号：US20080290798A1
公开(公告)日：2008-11-27
申请号：US12080711
申请日：2008-04-04
Applicant: Mark Alejandro Quesada
Inventor： Mark Alejandro Quesada
CPC classification number: H05B33/04 , H01L51/524 , H01L51/5253 , H01L2251/5315
Abstract: A method is disclosed for inhibiting oxygen and moisture penetration of a top emission device comprising the steps of depositing a low liquidus temperature (LLT) inorganic material on at least a portion of the top emission device to create a deposited LLT material, and optionally heat treating the deposited LLT material in a substantially oxygen and moisture free environment to form a LLT barrier layer, and optionally placing a cover glass over the LLT barrier layer. A top emission display device is also disclosed comprising a substrate, at least one electronic or optoelectronic layer, and a LLT barrier layer, wherein the electronic or optoelectronic layer is hermetically sealed between the LLT barrier layer and the substrate and an optional cover glass over the LLT barrier layer.
Abstract translation: 公开了一种用于抑制顶部发射装置的氧气和水分渗透的方法，包括以下步骤：在顶部发射装置的至少一部分上沉积低液相线温度（LLT）无机材料以产生沉积的LLT材料，以及任选地热处理 沉积的LLT材料在基本上无氧和无湿度的环境中以形成LLT阻挡层，并且可选地将覆盖玻璃放置在LLT阻挡层上。 还公开了一种顶部发射显示装置，其包括衬底，至少一个电子或光电子层和LLT势垒层，其中电子或光电子层气密地密封在LLT阻挡层和衬底之间，以及可选的覆盖玻璃 LLT阻挡层。
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Patent Agency Ranking
公开(公告)号：US09799914B2
公开(公告)日：2017-10-24
申请号：US12362063
申请日：2009-01-29
Applicant: Bruce Gardiner Aitken , Todd Parrish St. Clair , James R Lim , Prantik Mazumder , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Todd Parrish St. Clair , James R Lim , Prantik Mazumder , Mark Alejandro Quesada
IPC: H01M4/13 , H01M10/052 , H01M2/10 , H01M6/40 , H01M10/0585 , H01M10/0525 , H01M10/0565
CPC classification number: H01M10/052 , H01M2/1061 , H01M6/40 , H01M10/0525 , H01M10/0565 , H01M10/0585 , Y10T29/49108
Abstract: A thin film battery comprises a substrate, anode and cathode current collector layers formed over the substrate, anode and cathode layers formed over and in electrical contact with respective ones of the current collector layers, and an electrolyte layer formed between the anode and cathode layers. The thin film battery further comprises a barrier layer formed from a material such as tin oxide, tin phosphate, tin fluorophosphate, chalcogenide glass, tellurite glass or borate glass. The barrier layer is configured to encapsulate the thin film battery layers and substantially inhibit or prevent exposure of the thin film battery layers to air or moisture.
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公开(公告)号：US20130223922A1
公开(公告)日：2013-08-29
申请号：US13777584
申请日：2013-02-26
Applicant: Shari Elizabeth Koval , Xinghua Li , Stephan Lvovich Logunov , Mark Alejandro Quesada , William Richard Trutna
Inventor： Shari Elizabeth Koval , Xinghua Li , Stephan Lvovich Logunov , Mark Alejandro Quesada , William Richard Trutna
IPC: F16J15/02
CPC classification number: B32B17/06 , C03B23/245 , C03C3/247 , C03C17/02 , C03C23/0025 , C03C27/10 , C03C2218/151 , C03C2218/365 , E06B3/66333 , E06B3/66357 , E06B3/67334 , E06B2003/6638 , F16J15/02 , H01L51/5246 , Y02P40/57 , Y10T403/477
Abstract: A glass-coated gasket comprises a gasket main body defining an inner hole and having a first contact surface and a second contact surface opposite the first contact surface, and a glass layer formed over at least a portion of one of the first contact surface and the second contact surface. The glass layer comprises a low melting temperature glass. A hermetic package comprises a substrate/glass-coated gasket/substrate structure that can be sealed using a thermo-compressive sealing step.
Abstract translation: 玻璃涂层垫圈包括限定内孔并具有与第一接触表面相对的第一接触表面和第二接触表面的垫片主体，以及形成在第一接触表面和第二接触表面之一的至少一部分上的玻璃层 第二接触面。 玻璃层包括低熔点玻璃。 密封包装包括可以使用热压缩密封步骤密封的基底/玻璃涂覆的垫片/基底结构。
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公开(公告)号：US20120281292A1
公开(公告)日：2012-11-08
申请号：US13440183
申请日：2012-04-05
Applicant: Adra Smith Baca , Daniel Aloysius Nolan , Odessa Natalie Petzold , Mark Alejandro Quesada , Wageesha Senaratne
Inventor： Adra Smith Baca , Daniel Aloysius Nolan , Odessa Natalie Petzold , Mark Alejandro Quesada , Wageesha Senaratne
CPC classification number: G02B1/118 , C03C17/007 , C03C2217/42 , C03C2217/44 , C03C2217/732 , G02B1/113
Abstract: Durable antireflective coatings and glass articles having such coatings are described herein. The antireflective coatings generally include a layer of nominally hexagonally packed nanoparticles that are partially embedded either in a surface of the glass article or in a binder that is on the surface of the glass article. Methods of making the antireflective coatings or layers and glass articles having such antireflective layers are also described.
Abstract translation: 本文描述了具有这种涂层的耐用的抗反射涂层和玻璃制品。 抗反射涂层通常包括名义上六角形填充的纳米颗粒层，其被部分地嵌入在玻璃制品的表面中或在玻璃制品的表面上的粘合剂中。 还描述了制造具有这种抗反射层的抗反射涂层或层的玻璃制品的方法。
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29.发明授权公开(公告)号：US08304990B2
公开(公告)日：2012-11-06
申请号：US12894474
申请日：2010-09-30
Applicant: Bruce Gardiner Aitken , Shari Elizabeth Koval , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Shari Elizabeth Koval , Mark Alejandro Quesada
IPC: H01J1/62
CPC classification number: C23C14/086 , C03C3/12 , C03C3/247 , C03C8/24 , C03C17/3615 , C03C17/3621 , C03C17/3649 , C03C17/3663 , H01L51/5253 , Y10T428/239
Abstract: A method for hermetically sealing a device without performing a heat treatment step and the resulting hermetically sealed device are described herein. The method includes the steps of: (1) positioning the un-encapsulated device in a desired location with respect to a deposition device; and (2) using the deposition device to deposit a sealing material over at least a portion of the un-encapsulated device to form a hermetically sealed device without having to perform a post-deposition heat treating step. For instance, the sealing material can be a Sn2+-containing inorganic oxide material or a low liquidus temperature inorganic material.
Abstract translation: 这里描述了不进行热处理步骤而密封装置的方法和所得的密封装置。 该方法包括以下步骤：（1）将未封装的装置相对于沉积装置定位在所需位置; 和（2）使用沉积装置将密封材料沉积在未封装装置的至少一部分上以形成密封装置，而不必进行后沉积热处理步骤。 例如，密封材料可以是含Sn2 +的无机氧化物材料或低液相线温度的无机材料。
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公开(公告)号：US20120045567A1
公开(公告)日：2012-02-23
申请号：US13287537
申请日：2011-11-02
Applicant: Bruce Gardiner Aitken , Dana Craig Bookbinder , Sean Matthew Garner , Mark Alejandro Quesada
Inventor： Bruce Gardiner Aitken , Dana Craig Bookbinder , Sean Matthew Garner , Mark Alejandro Quesada
IPC: B05D5/00 , B05D3/02 , B05D3/06 , C23C16/44 , C23C16/48 , C23C16/56 , B05D3/12 , B05D1/02 , B05D1/30 , B05D1/18 , B05D1/28 , B29C35/08 , C23C14/34 , C25D13/04 , B05D7/24
CPC classification number: C23C14/5806 , C03C3/122 , C03C3/14 , C03C3/247 , C23C14/10 , H01L51/5253 , H01L2251/5338 , H01L2251/566 , Y10T428/13 , Y10T428/239 , Y10T428/24777 , Y10T428/24802 , Y10T428/263 , Y10T428/264 , Y10T428/265
Abstract: Methods and apparatus provide for: applying an inorganic barrier layer to at least a portion of a flexible substrate, the barrier layer being formed from a low liquidus temperature (LLT) material; and sintering the inorganic barrier layer while maintaining the flexible substrate below a critical temperature.
Abstract translation: 方法和装置提供：将无机阻挡层施加到柔性基底的至少一部分上，阻挡层由低液相线温度（LLT）材料形成; 并且在将柔性基板保持在临界温度以下的同时烧结无机阻挡层。
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