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公开(公告)号：US20230382076A1
公开(公告)日：2023-11-30
申请号：US18319657
申请日：2023-05-18
发明人： Takamasa NAGASAWA
摘要： A substrate includes a heat conduction member including a plurality of carbon nanotubes, a first resin layer provided on first ends of the plurality of carbon nanotubes, and a second resin layer provided on second ends of the plurality of carbon nanotubes, the second ends being opposite the first ends, a first metal layer laminated on the first resin layer, and a second metal layer laminated on the second resin layer, wherein neither the first resin layer nor the second resin layer contains a filler, and wherein spaces between the first ends of the plurality of carbon nanotubes are filled with a resin constituting the first resin layer, and spaces between the second ends of the plurality of carbon nanotubes are filled with a resin constituting the second resin layer.
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公开(公告)号：US20230366633A1
公开(公告)日：2023-11-16
申请号：US18307330
申请日：2023-04-26
发明人： Yoshihiro Machida
IPC分类号： F28D15/02
CPC分类号： F28D15/0283 , F28D15/0233 , F28D15/0266 , H05K7/20336
摘要： The heat pipe includes an injection port into which a working fluid is injected. The injection port has a first outer metal layer, a second outer metal layer, at least one inner metal layer provided between the first outer metal layer and the second outer metal layer, and an injection passage in which the injected working fluid moves, the injection passage demarcated by the first outer metal layer, the second outer metal layer, and the inner metal layer. The first outer metal layer has a first inner surface facing the second outer metal layer and constituting a first inner surface of the injection passage. The first inner surface of the first outer metal layer has at least one first groove portion.
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公开(公告)号：US11817381B2
公开(公告)日：2023-11-14
申请号：US17376478
申请日：2021-07-15
发明人： Kei Murayama , Mitsuhiro Aizawa , Amane Kaneko , Kiyoshi Oi
IPC分类号： H01L23/498 , H01L23/31
CPC分类号： H01L23/49833 , H01L23/3121 , H01L23/49811 , H01L23/49822
摘要： A semiconductor device includes a lower substrate, a semiconductor element mounted on an upper surface of the lower substrate, an upper substrate disposed on an upper surface of the semiconductor element, an encapsulation resin disposed between the lower substrate and the upper substrate and encapsulating the semiconductor element, a wiring layer disposed on an upper surface of the upper substrate, and a covering resin formed from a material having a coefficient of thermal expansion similar to a coefficient of thermal expansion of the encapsulation resin. The covering resin is disposed on the upper surface of the upper substrate and covers a side surface of the wiring layer.
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公开(公告)号：US20230269912A1
公开(公告)日：2023-08-24
申请号：US18169381
申请日：2023-02-15
发明人： Yoshihiro Machida
IPC分类号： H05K7/20
CPC分类号： H05K7/2039 , H05K7/20336 , H05K7/20309 , H05K7/20318
摘要： A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a heat dissipation plate thermally connected to the loop-type heat pipe main body, a magnetic member provided on a surface of at least one of the loop-type heat pipe main body and the heat dissipation plate, and a magnet provided for the other of the loop-type heat pipe main body and the heat dissipation plate and provided facing the magnetic member.
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公开(公告)号：US11729914B2
公开(公告)日：2023-08-15
申请号：US17660701
申请日：2022-04-26
CPC分类号： H05K1/186 , H05K1/113 , H01G4/33 , H05K2201/10015
摘要： A wiring board includes an insulating layer, a thin film capacitor laminated on the insulating layer, an interconnect layer electrically connected to the thin film capacitor, and an encapsulating resin layer laminated on the thin film capacitor. The interconnect layer includes a pad protruding from the thin film capacitor. The encapsulating resin layer is a mold resin having a non-photosensitive thermosetting resin as a main component thereof. The encapsulating resin layer exposes a top surface of the pad, and covers at least a portion of a side surface of the pad.
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公开(公告)号：US20230228499A1
公开(公告)日：2023-07-20
申请号：US18155145
申请日：2023-01-17
发明人： Yoshihiro Machida
IPC分类号： F28D15/02
CPC分类号： F28D15/0275 , F28D15/0266 , F28F2275/22
摘要： A loop-type heat pipe includes a loop-type heat pipe main body including a loop-shaped flow path in which a working fluid is enclosed, a first magnet provided to the loop-type heat pipe main body, a heat dissipation plate thermally connected to the loop-type heat pipe main body, and a second magnet provided to the heat dissipation plate and provided to face the first magnet. The first magnet and the second magnet are provided so that different magnetic poles face to each other.
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公开(公告)号：US11705400B2
公开(公告)日：2023-07-18
申请号：US16699265
申请日：2019-11-29
发明人： Seiji Sato
IPC分类号： H01L23/538 , H01L23/29 , H01L23/31
CPC分类号： H01L23/5383 , H01L23/293 , H01L23/3114 , H01L23/3121 , H01L23/3142
摘要： A semiconductor package includes: a first substrate; a semiconductor chip mounted on the first substrate such that a circuit formation surface is oriented toward the first substrate; a second substrate arranged above the first substrate, the semiconductor chip being sandwiched between the first substrate and the second substrate; and a resin that seals the semiconductor chip and that is filled between the first substrate and the second substrate, wherein the second substrate includes a solder resist layer having a first surface facing a back surface that is an opposite surface of the circuit formation surface of the semiconductor chip, and wherein on an area of the first surface of the solder resist layer facing the back surface of the semiconductor chip, at least one protruding portion that protrudes towards the back surface of the semiconductor chip is provided.
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28.发明授权公开(公告)号：US11699612B2
公开(公告)日：2023-07-11
申请号：US17524322
申请日：2021-11-11
IPC分类号： H01T23/00 , H01L21/683 , H01L21/67 , H01L21/687
CPC分类号： H01L21/6833 , H01L21/67248 , H01L21/68757
摘要： A substrate fixing device includes: a base plate; and an electrostatic chuck that is fixed to the base plate to adsorb a substrate by electrostatic force. The electrostatic chuck includes: an adsorption layer that is formed of ceramic and that contacts the substrate to adsorb and hold the substrate; a first heating layer that is formed on the adsorption layer and that includes a first electrode; a second heating layer that is formed on the first heating layer and that includes a second electrode; and a via that is provided between the first electrode and the second electrode to electrically connect the first electrode and the second electrode to each other. The via includes a body portion, and an end portion that is connected to the body portion. A diameter of the end portion is larger than that of the body portion.
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公开(公告)号：US20230209729A1
公开(公告)日：2023-06-29
申请号：US18177461
申请日：2023-03-02
发明人： Junichi NAKAMURA , Takeshi TAKAI , Yusuke KARASAWA , Yoshihisa KANBE , Shuhei MOMOSE , Toshiki SHIROTORI
CPC分类号： H05K3/4661 , H05K1/115 , H05K2201/0212 , H05K2201/0959 , H05K2201/096
摘要： A wiring board includes a core layer having a first through hole formed therein, a magnetic resin filled inside the first through hole, a second through hole formed in the magnetic resin, and a plating film covering an inner wall surface of the second through hole. The plating film includes an electroless plating film, and an electrolytic plating film. The electroless plating film makes direct contact with an inner wall surface of the second through hole.
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公开(公告)号：US20230164908A1
公开(公告)日：2023-05-25
申请号：US17992078
申请日：2022-11-22
发明人： Tatsuaki Denda , Takehito Terasawa
CPC分类号： H05K1/0224 , H05K1/0393 , H05K2201/2081
摘要： A wiring board includes a plurality of insulating layers each being made of flexible insulating resin, and a conductor layer that is laminated on the plurality of insulating layers and that has a conductor pattern. The conductor layer includes a conductor pattern that has a certain shape in which a plurality of unit patterns are connected in plan view. The unit pattern includes a U-shaped pattern, an inverted U-shaped pattern that is arranged such that an opening side is located away from an opening side of the U-shaped pattern, and a straight line pattern that connects center portions of the U-shaped pattern and the inverted U-shaped pattern.
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