公开(公告)号：USD641562S1

公开(公告)日：2011-07-19

申请号：US29383681

申请日：2011-01-20

申请人： Sangho Lee

设计人： Sangho Lee

公开(公告)号：US20110037172A1

公开(公告)日：2011-02-17

申请号：US12911592

申请日：2010-10-25

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L23/498 ,  H01L23/00

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device includes a wafer and a dicing saw tape that is laminated to a back surface of the wafer. An active surface of the wafer is opposite the back surface of the wafer. The semiconductor device further includes a lamination tape disposed in contact with the wafer. The lamination tape includes an under-film layer contacting the active surface of the wafer. The lamination tape further includes an adhesive layer contacting the under-film layer.

摘要翻译： 半导体器件包括层叠到晶片的背面的晶片和切割锯带。 晶片的活性表面与晶片的背面相对。 半导体器件还包括与晶片接触设置的层压带。 层压带包括与晶片的活性表面接触的底膜层。 层压带还包括与底膜层接触的粘合剂层。

公开(公告)号：US07838391B2

公开(公告)日：2010-11-23

申请号：US11745045

申请日：2007-05-07

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A semiconductor device begins with a wafer having a plurality of bumps formed on a surface of the wafer. An under-film layer is formed over the wafer to completely cover all portions of the bumps with the under-film layer. An adhesive layer is formed over the under-film layer. A support layer is attached over the adhesive layer. A back surface of the wafer undergoes grinding. The support layer provides structural support to the wafer. The support layer is removed to expose the adhesive layer. The adhesive layer is removed to expose the under-film layer. The wafer is singulated into semiconductor die. The semiconductor die is mounted to a substrate by applying force to a back surface of the semiconductor die to press the bumps through under-film layer to contact the substrate while the under-film layer provides an underfill between the semiconductor die and substrate.

摘要翻译： 半导体器件开始于在晶片的表面上形成有多个凸块的晶片。 在晶片之上形成底膜层，以完全覆盖具有底膜层的凸块的所有部分。 在底膜层上形成粘合剂层。 支撑层附着在粘合剂层上。 晶片的后表面进行研磨。 支撑层为晶片提供结构支撑。 去除支撑层以暴露粘合剂层。 去除粘合剂层以暴露底膜层。 将晶片分成半导体芯片。 通过向半导体管芯的背面施加力将半导体管芯安装到基板上，以通过底膜层将凸块按压以接触基板，同时底膜层在半导体管芯和基板之间提供底部填充。

公开(公告)号：US20090087782A1

公开(公告)日：2009-04-02

申请号：US12331672

申请日：2008-12-10

申请人： M. Dalil Rahman ,  Francis M. Houlihan ,  Munirathna Padmanaban ,  SangHo Lee ,  Ralph R. Dammel ,  David Rentkiewicz ,  Clement Anyadiegwu

发明人： M. Dalil Rahman ,  Francis M. Houlihan ,  Munirathna Padmanaban ,  SangHo Lee ,  Ralph R. Dammel ,  David Rentkiewicz ,  Clement Anyadiegwu

IPC分类号： G03F7/028 ,  G03F7/20

CPC分类号： C07D333/46 ,  C07C25/18 ,  C07C309/05 ,  C07C309/17 ,  C07C381/12 ,  C07D333/76 ,  Y10S430/114

摘要： The present application relates to a compound of formula A-X—B, where (i) A-X—B form an ionic compound Ai Xi Bi where Ai and Bi are each individually an organic onium cation; and Xi is anion of the formula Q-R500—SO3− or (ii) A-X—B form a non-ionic compound Ac-Xc-Bc, where Ai, Bi, Q,, R500, Ac, Bc, and Xc are defined herein. The compounds are useful as photoactive materials.

摘要翻译： 本申请涉及式A-X-B化合物，其中（i）A-X-B形成离子化合物艾希Bi，其中A 1和B 2各自为有机鎓阳离子; 并且X 1是式Q-R 5 O-SO 3 - 或（ⅱ）A-X-B的阴离子，形成非离子化合物Ac-Xc-Bc，其中A 1，B 2，Q 3，R 5 00，A 0，B c和X c如本文所定义。 这些化合物可用作光敏材料。

公开(公告)号：US20050060582A1

公开(公告)日：2005-03-17

申请号：US10749744

申请日：2003-12-30

申请人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

发明人： Yang Choi ,  Hwan Kim ,  Dong Seo ,  Sangho Lee

IPC分类号： H04L12/28 ,  G06F11/30 ,  H04L29/06

CPC分类号： H04L63/1441 ,  H04L2463/146

摘要： An apparatus and method for providing traceback connection using a connection redirection technique are provided. A packet blocking unit blocks an attack packet transmitted to the system and a first response packet output from the system in response to the attack packet, if a system attack sensing signal is received. A response packet generation unit generates a second response packet into which a watermark is inserted, in response to the attack packet, and transmits the second response packet to a system corresponding to the source address of the attack packet. A path traceback unit receives a detection packet containing transmission path information of the second response packet from a system existing on a transmission path of the second response packet, and based on the received detection packet, traces back the transmission path of the second response packet and identifies the location of the attacker system. According to the apparatus and method, even when an attacker attacks a predetermined system via a plurality of systems, the actual location of the attacker system can be traced back fast and accurately and damage of the victim system can be minimized.

摘要翻译： 提供了一种使用连接重定向技术提供回溯连接的装置和方法。 如果接收到系统攻击感知信号，则分组阻塞单元阻止发送到系统的攻击分组和响应于攻击分组从系统输出的第一响应分组。 响应分组生成单元响应于攻击分组生成插入了水印的第二响应分组，并将第二响应分组发送到与攻击分组的源地址对应的系统。 路径追溯单元从存在于第二响应分组的传输路径上的系统接收包含第二响应分组的传输路径信息的检测分组，并且基于接收到的检测分组，追踪第二响应分组的传输路径， 识别攻击者系统的位置。 根据该装置和方法，即使攻击者通过多个系统攻击预定的系统，也可以快速，准确地跟踪攻击者系统的实际位置，并且可以使受害者系统的损坏最小化。

公开(公告)号：US06762078B2

公开(公告)日：2004-07-13

申请号：US09774952

申请日：2001-01-30

申请人： WonSun Shin ,  DoSung Chun ,  SangHo Lee ,  SeonGoo Lee ,  Vincent DiCaprio

发明人： WonSun Shin ,  DoSung Chun ,  SangHo Lee ,  SeonGoo Lee ,  Vincent DiCaprio

IPC分类号： H01L2144

CPC分类号： H01L21/568 ,  H01L21/56 ,  H01L21/561 ,  H01L21/565 ,  H01L23/13 ,  H01L23/3128 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/544 ,  H01L24/45 ,  H01L24/48 ,  H01L24/96 ,  H01L24/97 ,  H01L25/105 ,  H01L2223/54473 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/81005 ,  H01L2224/85001 ,  H01L2224/97 ,  H01L2225/1035 ,  H01L2225/1058 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/15151 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/18165 ,  H01L2924/00014 ,  H01L2224/85 ,  H01L2924/00012

摘要： Semiconductor packages having a thin structure capable of easily discharging heat from a semiconductor chip included therein, and methods for fabricating such semiconductor packages, are disclosed. An embodiment of a semiconductor package includes a semiconductor chip having a first major surface and a second major surface, the semiconductor chip being provided at the second major surface with a plurality of input/output pads; a circuit board including a resin substrate having a first major surface and a second major surface, a first circuit pattern formed at the first major surface and provided with a plurality of ball lands, a second circuit pattern formed at the second major surface and provided with a plurality of bond fingers connected with the ball lands by conductive via holes through the resin substrate, cover coats respectively coating the first and second circuit patterns while allowing the bond fingers and the ball lands to be exposed therethrough, and a central through hole adapted to receive the semiconductor chip therein; electrical conductors that electrically connect the input/output pads of the semiconductor chip with the bond fingers of the circuit board, respectively; a resin encapsulate that covers the semiconductor chip, the electrical conductors, and at least part of the circuit board; and, a plurality of conductive balls fused on the ball lands of the circuit board, respectively.

摘要翻译： 公开了具有能够容易地从包括在其中的半导体芯片放出热的薄结构的半导体封装以及制造这种半导体封装的方法。 半导体封装的实施例包括具有第一主表面和第二主表面的半导体芯片，所述半导体芯片在第二主表面处设置有多个输入/输出焊盘; 包括具有第一主表面和第二主表面的树脂基板的电路板，形成在第一主表面处并设置有多个球接头的第一电路图案，形成在第二主表面处并且设置有第二主表面的第二电路图案 多个粘结指状物通过导电通孔与树脂基底连接，通过树脂基底，覆盖涂层分别涂覆第一和第二电路图案，同时允许粘合指状物和球状区域暴露于其中;以及中心通孔，其适于 在其中接收半导体芯片; 电导体，其将半导体芯片的输入/输出焊盘电连接到电路板的键合指; 覆盖半导体芯片，电导体和电路板的至少一部分的树脂封装; 以及多个导电球分别熔合在电路板的球面上。

公开(公告)号：US20130042523A1

公开(公告)日：2013-02-21

申请号：US13551096

申请日：2012-07-17

申请人： Sangho LEE ,  Jang sik BAE ,  Ae Kyeung MOON ,  Song LI ,  Hae Dong LEE ,  Kyuhyung KIM ,  Gwang Su KIM

发明人： Sangho LEE ,  Jang sik BAE ,  Ae Kyeung MOON ,  Song LI ,  Hae Dong LEE ,  Kyuhyung KIM ,  Gwang Su KIM

IPC分类号： A01G9/14

CPC分类号： A01G9/22 ,  A01G9/243 ,  Y02A40/258 ,  Y02A40/266 ,  Y02P60/124

摘要： A greenhouse plant cultivation control system includes a plurality of solar cell modules providing light of different wavelengths to each of a plurality of areas in which plants are cultivated, and a movement of a plant to an area in which light of a wavelength required for the plant is provided is determined according to a type of the plant and a growth stage of the plant.

摘要翻译： 温室植物栽培控制系统包括多个太阳能电池模块，其向植物栽培的多个区域中的每个区域提供不同波长的光，以及植物移动到植物所需波长的光的区域 根据植物的类型和植物的生长阶段来确定。

公开(公告)号：US08329554B2

公开(公告)日：2012-12-11

申请号：US12916758

申请日：2010-11-01

申请人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

发明人： Junghoon Shin ,  Sangho Lee ,  Sungyoon Lee

IPC分类号： H01L21/30 ,  H01L21/46

CPC分类号： H01L21/78 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2224/0401

摘要： A method of making a semiconductor device includes forming an under-film layer over bumps disposed on a surface of a wafer to completely cover the bumps, and forming an adhesive layer over the under-film layer. The method further includes attaching a support layer over the adhesive layer, removing a portion of a back surface of the wafer, and removing the support layer to expose the adhesive layer that remains disposed over the under-film layer. The method further includes removing the adhesive layer to expose the under-film layer while the bumps remain completely covered by the under-film layer, and singulating the wafer to form a semiconductor die. The method further includes pressing the bumps into contact with a substrate while the under-film layer provides an underfill between the semiconductor die and the substrate.

摘要翻译： 制造半导体器件的方法包括在设置在晶片表面上的凸起上形成底膜层，以完全覆盖凸块，并在底膜层上形成粘合剂层。 所述方法还包括将粘合剂层附着在粘合剂层上，去除晶片后表面的一部分，以及去除支撑层以暴露保留设置在底膜层上的粘合剂层。 该方法还包括去除粘合剂层以暴露底膜层，同时凸块保持完全被底膜层覆盖，并且单晶化晶片以形成半导体管芯。 该方法进一步包括按压凸块与基底接触，同时底膜层在半导体管芯和衬底之间提供底部填充。

公开(公告)号：USD651424S1

公开(公告)日：2012-01-03

申请号：US29383685

申请日：2011-01-20

申请人： Sangho Lee

设计人： Sangho Lee

公开(公告)号：US20110044873A1

公开(公告)日：2011-02-24

申请号：US12863024

申请日：2008-12-24

申请人： Junseong AHN ,  Bongjae KIM ,  Sangho LEE ,  Okyoun KIM ,  Seunghoon OH

发明人： Junseong AHN ,  Bongjae KIM ,  Sangho LEE ,  Okyoun KIM ,  Seunghoon OH

IPC分类号： B01D53/56 ,  B01J29/04

CPC分类号： B01J37/0009 ,  B01D53/8628 ,  B01D2251/206 ,  B01D2255/50 ,  B01D2255/9207 ,  B01D2257/402 ,  B01J29/06 ,  B01J29/064 ,  B01J29/076 ,  B01J29/40 ,  B01J35/04 ,  B01J2229/42 ,  C04B35/18 ,  C04B38/0006 ,  C04B2111/00129 ,  C04B2111/00793 ,  C04B2111/0081 ,  F01N3/0222 ,  Y02C20/10 ,  Y02T10/20

摘要： The present invention relates to conversion of exhaust gas containing nitrogen oxide (NOx) such as NO, NO2 and N2O into N2 and H2O through catalytic reaction with injection of a reducing agent such as ammonia and urea. A fabrication method of zeolite honeycomb type catalyst for reducing nitrogen oxide of the present invention includes: (a) obtaining an inorganic binder by mixing and uniformly peptizing pseudo-boehmite, distilled water and a pH adjuster; (b) obtaining a paste by mixing and kneading zeolite, the inorganic binder, an organic binder and distilled water; (c) extruding the paste into an extrudate having a through pore of a regular structure; and (d) drying and heat treating the extrudate.

摘要翻译： 本发明涉及通过催化反应将含有NO，NO 2和N 2 O的氮氧化物（NO x）如NO，NO 2和N 2 O的废气转化成N 2和H 2 O，注入还原剂如氨和尿素。 本发明的用于还原氮氧化物的沸石蜂窝型催化剂的制造方法包括：（a）通过混合并均匀地将假勃姆石，蒸馏水和pH调节剂胶溶得到无机粘合剂; （b）通过混合和捏合沸石，无机粘合剂，有机粘合剂和蒸馏水来获得糊料; （c）将糊料挤出到具有规则结构的通孔的挤出物中; 和（d）干燥和热处理挤出物。