公开(公告)号：US20060050557A1

公开(公告)日：2006-03-09

申请号：US11251963

申请日：2005-10-18

申请人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

发明人： Tetsuya Ishimaru ,  Nozomu Matsuzaki ,  Hitoshi Kume

IPC分类号： G11C16/04

CPC分类号： G11C16/0433 ,  G11C16/0466 ,  G11C16/10 ,  G11C16/14 ,  H01L27/11568 ,  H01L29/513 ,  H01L29/518 ,  H01L29/792

摘要： Characteristics of a nonvolatile semiconductor memory device are improved. The memory cell comprises: an ONO film constituted by a silicon nitride film SIN for accumulating charge and by oxide films BOTOX and TOPOX disposed thereon and thereunder; a memory gate electrode MG disposed at an upper portion thereof; a select gate electrode SG disposed at a side portion thereof through the ONO film; a gate oxide film SGOX disposed thereunder. By applying a potential to a select gate electrode SG of a memory cell having a source region MS and a drain region MD and to the source region MS and by accelerating electrons flowing in a channel through a high electric field produced between a channel end of the select transistor and an end of an n-type doped region ME disposed under the memory gate electrode MG, hot holes are generated by impact ionization, and the hot holes are injected into a silicon nitride film SIN by a negative potential applied to the memory gate electrode MG, and thereby an erase operation is performed.

公开(公告)号：US20050006698A1

公开(公告)日：2005-01-13

申请号：US10852150

申请日：2004-05-25

申请人： Nozomu Matsuzaki ,  Tetsuya Ishimaru ,  Makoto Mizuno ,  Takashi Hashimoto

发明人： Nozomu Matsuzaki ,  Tetsuya Ishimaru ,  Makoto Mizuno ,  Takashi Hashimoto

IPC分类号： G11C16/02 ,  G11C16/04 ,  G11C16/06 ,  G11C16/10 ,  G11C16/12 ,  G11C16/34 ,  H01L21/8247 ,  H01L27/115 ,  H01L29/788 ,  H01L29/792

CPC分类号： G11C16/107 ,  G11C16/3468

摘要： Memory cells in which an erase and write operation is performed by injecting electrons from a substrate and extracting the electrons into a gate electrode constitute a semiconductor nonvolatile memory device. That is a gate extraction semiconductor nonvolatile memory device. In that device, if an erase bias is applied in a first process of an erase and write operation, memory cells in an overerase condition occur and the charge retention characteristics of such memory cells are degraded. The present invention provides a semiconductor nonvolatile memory device using means for writing all the memory cells in an erase unit before applying the erase bias, and then applying the erase bias.

摘要翻译： 通过从基板注入电子并将电子提取到栅极电极进行擦除和写入操作的存储单元构成半导体非易失性存储器件。 这是一个栅极提取半导体非易失性存储器件。 在该器件中，如果在擦除和写入操作的第一过程中施加擦除偏置，则发生过度过热状态的存储器单元，并且这种存储器单元的电荷保留特性降低。 本发明提供一种半导体非易失性存储器件，其使用在施加擦除偏置之前将所有存储单元写入擦除单元的装置，然后施加擦除偏置。

公开(公告)号：US08796756B2

公开(公告)日：2014-08-05

申请号：US13755348

申请日：2013-01-31

申请人： Kenichi Akita ,  Daisuke Okada ,  Keisuke Kuwahara ,  Yasafumi Morimoto ,  Yasuhiro Shimamoto ,  Kan Yasui ,  Tsuyoshi Arigane ,  Tetsuya Ishimaru

发明人： Kenichi Akita ,  Daisuke Okada ,  Keisuke Kuwahara ,  Yasafumi Morimoto ,  Yasuhiro Shimamoto ,  Kan Yasui ,  Tsuyoshi Arigane ,  Tetsuya Ishimaru

IPC分类号： H01L29/792

CPC分类号： H01L29/66833 ,  H01L27/115 ,  H01L27/11563 ,  H01L27/11568 ,  H01L29/792

摘要： A charge storage layer interposed between a memory gate electrode and a semiconductor substrate is formed shorter than a gate length of the memory gate electrode or a length of insulating films so as to make the overlapping amount of the charge storage layer and a source region to be less than 40 nm. Therefore, in the write state, since the movement in the transverse direction of the electrons and the holes locally existing in the charge storage layer decreases, the variation of the threshold voltage when holding a high temperature can be reduced. In addition, the effective channel length is made to be 30 nm or less so as to reduce an apparent amount of holes so that coupling of the electrons with the holes in the charge storage layer decreases; therefore, the variation of the threshold voltage when holding at room temperature can be reduced.

摘要翻译： 插入在存储栅电极和半导体衬底之间的电荷存储层形成为比存储栅电极的栅极长度或绝缘膜的长度短，以使电荷存储层和源极区域的重叠量成为 小于40nm。 因此，在写入状态下，由于在电荷存储层中局部存在的电子和空穴的横向的移动减少，因此可以降低保持高温时的阈值电压的变化。 此外，有效沟道长度为30nm以下，以减少空穴的表观量，使得电子与电荷存储层中的空穴的耦合减小; 因此，可以降低在室温下保持时的阈值电压的变化。

公开(公告)号：US08472258B2

公开(公告)日：2013-06-25

申请号：US13269425

申请日：2011-10-07

申请人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C11/34 ,  G11C16/04 ,  G11C16/06

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US08324092B2

公开(公告)日：2012-12-04

申请号：US12652517

申请日：2010-01-05

申请人： Kan Yasui ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shin-Ichiro Kimura

发明人： Kan Yasui ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shin-Ichiro Kimura

IPC分类号： H01L21/00

CPC分类号： H01L27/115 ,  G11C16/0425 ,  H01L27/11568 ,  H01L29/42344

摘要： A method of manufacturing a non-volatile semiconductor memory device is provided which overcomes a problem of penetration of implanted ions due to the difference of optimal gate height in simultaneous formation of a self-align split gate type memory cell utilizing a side wall structure and a scaled MOS transistor. A select gate electrode to form a side wall in a memory area is formed to be higher than that of the gate electrode in a logic area so that the height of the side wall gate electrode of the self-align split gate memory cell is greater than that of the gate electrode in the logic area. Height reduction for the gate electrode is performed in the logic area before gate electrode formation.

摘要翻译： 提供一种制造非挥发性半导体存储器件的方法，其克服了由于最佳栅极高度的差异而引入的离子的渗透问题，同时形成利用侧壁结构的自对准分裂栅型存储单元和 缩放MOS晶体管。 形成在存储区域中形成侧壁的选择栅电极比逻辑区域中的栅电极高，使得自对准分离栅极存储单元的侧壁栅电极的高度大于 在逻辑区域的栅电极。 栅极电极的高度降低在栅电极形成之前的逻辑区域中进行。

公开(公告)号：US08125012B2

公开(公告)日：2012-02-28

申请号：US11639134

申请日：2006-12-15

申请人： Toshiyuki Mine ,  Kan Yasui ,  Tetsuya Ishimaru ,  Yasuhiro Shimamoto

发明人： Toshiyuki Mine ,  Kan Yasui ,  Tetsuya Ishimaru ,  Yasuhiro Shimamoto

IPC分类号： H01L21/336 ,  H01L21/31

CPC分类号： H01L29/42344 ,  H01L29/512 ,  H01L29/513 ,  H01L29/792 ,  Y10S438/954

摘要： Performance of a non-volatile semiconductor storage device which performs electron writing by hot electrons and hole erasure by hot holes is improved. A non-volatile memory cell which performs a writing operation by electrons and an erasure operation by holes has a p-type well region, isolation regions, a source region, and a drain region provided on an Si substrate. A control gate electrode is formed via a gate insulating film between the source region and the drain region. In a left-side side wall of the control gate electrode, a bottom Si oxide film, an electric charge holding film, a top Si oxide film, and a memory gate electrode are formed. The electric charge holding film is formed from an Si nitride film stoichiometrically excessively containing silicon.

摘要翻译： 通过热电子进行电子写入和通过热孔进行空穴擦除的非易失性半导体存储装置的性能得到改善。 通过电子执行写入操作和通过空穴的擦除操作的非易失性存储单元具有设置在Si衬底上的p型阱区域，隔离区域，源极区域和漏极区域。 通过栅极绝缘膜在源极区域和漏极区域之间形成控制栅电极。 在控制栅电极的左侧壁形成有底部的氧化硅膜，电荷保持膜，顶部氧化物膜和存储栅电极。 电荷保持膜由化学计量过度地含有硅的氮化硅膜形成。

公开(公告)号：US20120026798A1

公开(公告)日：2012-02-02

申请号：US13269425

申请日：2011-10-07

申请人： Digh HISAMOTO ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh HISAMOTO ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C16/10

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅极结构的半导体非易失性存储器件中进行热空穴注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US08076709B2

公开(公告)日：2011-12-13

申请号：US12873679

申请日：2010-09-01

申请人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

发明人： Tetsuya Ishimaru ,  Digh Hisamoto ,  Kan Yasui ,  Shinichiro Kimura

IPC分类号： H01L29/792 ,  G11C16/04

CPC分类号： G11C16/0466 ,  H01L21/28282 ,  H01L29/66833 ,  H01L29/792

摘要： In a situation where a memory cell includes an ONO film, which comprises a silicon nitride film for charge storage and oxide films positioned above and below the silicon nitride film; a memory gate above the ONO film; a select gate, which is adjacent to a lateral surface of the memory gate via the ONO film; a gate insulator positioned below the select gate; a source region; and a drain region, an erase operation is performed by injecting holes generated by BTBT into the silicon nitride film while applying a positive potential to the source region, applying a negative potential to the memory gate, applying a positive potential to the select gate, and flowing a current from the drain region to the source region, thus improving the characteristics of a nonvolatile semiconductor memory device.

摘要翻译： 在存储单元包括ONO膜的情况下，其包括用于电荷存储的氮化硅膜和位于氮化硅膜上方和下方的氧化膜; 在ONO电影上方的记忆门; 选择栅极，其经由ONO膜与存储栅的侧表面相邻; 位于选择门下方的栅极绝缘体; 源区; 和漏极区域，通过将BTBT产生的空穴注入氮化硅膜，同时向源极区域施加正电位，向存储栅极施加负电位，向选择栅极施加正电位，进行擦除操作，以及 使电流从漏极区域流向源极区域，从而改善非易失性半导体存储器件的特性。

公开(公告)号：US08064261B2

公开(公告)日：2011-11-22

申请号：US12787158

申请日：2010-05-25

申请人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

发明人： Digh Hisamoto ,  Kan Yasui ,  Tetsuya Ishimaru ,  Shinichiro Kimura ,  Daisuke Okada

IPC分类号： G11C11/34 ,  G11C16/04 ,  G11C16/06

CPC分类号： G11C16/0425 ,  G11C16/12 ,  G11C16/14 ,  G11C16/26 ,  G11C16/3454 ,  G11C16/3459

摘要： An operation scheme for operating stably a semiconductor nonvolatile memory device is provided.When hot-hole injection is conducted in the semiconductor nonvolatile memory device of a split gate structure, the hot-hole injection is verified using a crossing point that does not change with time. Thus, an erased state can be verified without being aware of any time-varying changes.Also, programming or programming/erasure is conducted by repeating pulse voltage or multi-step voltage application to a gate section multiple times.

摘要翻译： 提供一种稳定运行半导体非易失性存储器件的操作方案。 当在分裂栅结构的半导体非易失性存储器件中进行热孔注入时，使用不随时间变化的交叉点来验证热孔注入。 因此，可以验证擦除状态，而不知道任何时变变化。 此外，通过将多次脉冲电压或多级电压施加到栅极部分进行编程或编程/擦除。

公开(公告)号：US07872298B2

公开(公告)日：2011-01-18

申请号：US11777812

申请日：2007-07-13

申请人： Yasuhiro Shimamoto ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shinichiro Kimura

发明人： Yasuhiro Shimamoto ,  Digh Hisamoto ,  Tetsuya Ishimaru ,  Shinichiro Kimura

IPC分类号： H01L29/788

CPC分类号： H01L29/792 ,  G11C16/0425 ,  H01L21/28282 ,  H01L21/31155 ,  H01L27/105 ,  H01L27/11521 ,  H01L27/11526 ,  H01L27/11546 ,  H01L27/11568 ,  H01L29/42344 ,  H01L29/66833

摘要： Performance and reliability of a semiconductor device including a non-volatile memory are improved. A memory cell of the non-volatile memory includes, over an upper portion of a semiconductor substrate, a select gate electrode formed via a first dielectric film and a memory gate electrode formed via a second dielectric film formed of an ONO multilayered film having a charge storing function. The first dielectric film functions as a gate dielectric film, and includes a third dielectric film made of silicon oxide or silicon oxynitride and a metal-element-containing layer made of a metal oxide or a metal silicate formed between the select gate electrode and the third dielectric film. A semiconductor region positioned under the memory gate electrode and the second dielectric film has a charge density of impurities lower than that of a semiconductor region positioned under the select gate electrode and the first dielectric film.

摘要翻译： 提高了包括非易失性存储器的半导体器件的性能和可靠性。 非易失性存储器的存储单元包括在半导体衬底的上部上的经由第一电介质膜形成的选择栅电极和通过由具有电荷的ONO多层膜形成的第二电介质膜形成的存储栅电极 存储功能。 第一介质膜用作栅极电介质膜，并且包括由氧化硅或氮氧化硅制成的第三电介质膜和由选择栅电极和第三电极之间形成的金属氧化物或金属硅酸盐构成的含金属元素层 电介质膜。 位于存储栅电极下方的半导体区域和第二电介质膜的电荷密度低于位于选择栅电极和第一电介质膜下方的半导体区域的电荷密度。