Abstract:
An optical transmitter that controls the extinction ratio by modulating a power level of an optical signal using a frequency spread tone. An electro-optic transducer driver generates an electrical signal that is to be converted into an optical signal. Meanwhile, a tone generator generates an electrical tone having a relatively narrow frequency spectrum. A frequency spreading circuit frequency spreads the electrical tone. A modulator modulates a power level of the electrical signal using the frequency spread electrical tone. An electro-optic transducer then converts the modulated electrical signal into a corresponding optical signal. An optoelectronic transducer recovers the modulated electrical signal by monitoring the optical signal. The tone is then recovered from the signal, and demodulated. The demodulated tone is then used to control the extinction ratio.
Abstract:
An active linear amplifier circuit mounted in an optoelectronic package includes input nodes for receiving a differential signal pair, a first bipolar transistor, a second bipolar transistor, an electro-optical transducer and a decoupling circuit. A base terminal of the first bipolar transistor is coupled to the two input nodes and an emitter terminal of the first bipolar transistor is coupled to a base terminal of the second bipolar transistor. A collector terminal of the first bipolar transistor is coupled to a first terminal of the electro-optical transducer, the first terminal of the electro-optical transducer also being configured to be coupled to a voltage source. A collector terminal of the second bipolar transistor is coupled to a second terminal of the electro-optical transducer and an emitter terminal of the second bipolar transistor is coupled to a signal ground which is not the header ground.
Abstract:
An optoelectronic transceiver comprises an active linear TOSA circuit mounted on a header. The active linear TOSA circuit includes input nodes for receiving a differential signal pair, a first bipolar transistor, a second bipolar transistor and an electro-optical transducer. A base terminal of the first bipolar transistor is coupled to the two input nodes and an emitter terminal of the first bipolar transistor is coupled to a base terminal of the second bipolar transistor. A collector terminal of the first bipolar transistor is coupled to a first terminal of the electro-optical transducer, the first terminal of the electro-optical transducer also being configured to be coupled to a voltage source. A collector terminal of the second bipolar transistor is coupled to a second terminal of the electro-optical transducer and an emitter terminal of the second bipolar transistor is coupled to a signal ground which is not the header ground.
Abstract:
A low inductance structure for improving the integrity of data signals carried in an optical subassembly is disclosed. In one embodiment the optical subassembly comprises a housing containing a lens assembly and an optical isolator. The optical subassembly further includes an optoelectronic package having a base defining a mounting surface that cooperates with a cap to define a hermetic enclosure. First and second signal leads of the subassembly include ends that extend into the hermetic enclosure. A submount is disposed on the base mounting surface. A low inductance structure is integrally formed with the submount and includes a dielectric body interposed between the first and second leads. The body includes shaped edges and conductive pad structures in electrical communication with conductive traces disposed on the submount. Each pad structure is also in electrical communication with a respective one of the first and second signal leads via a plurality of wirebonds.
Abstract:
An active cable that communicates over much of its length using one or more optical fibers, but which includes at integrated electrical connector at least one of its ends. The cable may be an electrical to optical cable, and electrical to electrical cable, or one of many other potential configurations.
Abstract:
The optoelectronic device includes a photo diode and an amplifier, which amplifies output of the photo diode. The amplifier includes an input stage and an output stage. In one embodiment, the input stage has a series connection to a resistor, which is connected to a ground. The output stage has a connection to ground that does not overlap the series connection. In another embodiment, the input stage has a first connection to a bypass capacitor, which is connected to a power source. The output stage has a separate, second connection to the capacitor, which prevents high frequencies from flowing between the input stage and said output stage via a connection to the power source.
Abstract:
In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.
Abstract:
An intelligent transmitter module (“ITM”) includes a CDR circuit for equalizing and retiming an electrical data signal, a driver for generating a modulation signal and/or performing waveform shaping of the equalized and retimed signal, and an optical transmitter configured to emit an optical signal representative of the data signal. A linear amplifier may also be included to amplify the modulation signal when the optical transmitter is a laser with managed chirp. Alternately or additionally, a microcontroller with a 14-bit or higher A2D can be included to control and optimize operation of the ITM. In one embodiment, the CDR, driver, linear amplifier, and/or microcontroller are flip chip bonded to a first substrate while the laser with managed chirp is bonded to a second substrate. The first substrate may comprise a multi-layer high frequency laminate.
Abstract:
In one example embodiment, an optoelectronic module includes an optical receiver and a post-amplifier. The optical receiver is configured to receive an optical signal and generate an electrical data signal corresponding to the optical signal. The post-amplifier is electrically connected to the optical receiver and is configured to amplify the electrical data signal. The optoelectronic module further includes means for quantifying a quality of the optical signal from which the amplified electrical data signal is derived.
Abstract:
In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.