公开(公告)号：US07254149B2

公开(公告)日：2007-08-07

申请号：US10393218

申请日：2003-03-19

Applicant: Giorgio Giaretta ,  The' Linh Nguyen ,  Jan Lipson ,  Rudolf J. Hofmeister

Inventor： Giorgio Giaretta ,  The' Linh Nguyen ,  Jan Lipson ,  Rudolf J. Hofmeister

IPC: H01S3/04

CPC classification number: H01S5/02212 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/48137 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01S5/02276 ,  H01S5/0427 ,  H01L2924/00

Abstract: The present invention relates generally to optoelectronic devices, and particularly to a submount, pedestal, and bond wire assembly for a transistor outline package. A bottom surface of the submount is connected to a top surface of the pedestal. Each bond wire in a bond wire set is connected to a position on the top surface of the submount, and to a position on the signal line. The signal line is positioned a first distance from the position on the top surface of the submount and a second distance from the pedestal. The submount is sized such that a portion of the bottom and the top surface of the submount extends beyond the top surface of the pedestal such that the first distance is less than the second distance.

Abstract translation: 本发明一般涉及光电器件，尤其涉及用于晶体管轮廓封装的基座，基座和接合线组件。 底座的底面连接到基座的顶面。 接合线组中的每个接合线连接到子安装座的顶表面上的位置，并连接到信号线上的位置。 信号线位于距离底座的顶表面上的位置的第一距离处，并且距离基座的第二距离。 底座的尺寸使得底座的一部分和底座的顶表面延伸超过基座的顶表面，使得第一距离小于第二距离。

公开(公告)号：US06876004B2

公开(公告)日：2005-04-05

申请号：US10005924

申请日：2001-12-04

Applicant: Paul K. Rosenberg ,  Daniel K. Case ,  Jan Lipson ,  Rudolf J. Hofmeister ,  The' Linh Nguyen

Inventor： Paul K. Rosenberg ,  Daniel K. Case ,  Jan Lipson ,  Rudolf J. Hofmeister ,  The' Linh Nguyen

IPC: G02B6/42 ,  H05K1/02 ,  H05K1/18 ,  H05K3/34 ,  H01L29/267 ,  G02B6/36 ,  G02F1/29

CPC classification number: G02B6/4201 ,  H01L24/45 ,  H01L2224/05554 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/49111 ,  H01L2224/49175 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01079 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/30107 ,  H01L2924/3011 ,  H05K1/0243 ,  H05K1/189 ,  H05K3/3447 ,  H05K2201/0715 ,  H05K2201/10121 ,  H05K2201/10166 ,  H05K2201/10371 ,  H05K2203/1147 ,  H01L2924/00014 ,  H01L2924/00

Abstract: An optoelectronic assembly includes a transistor outline (TO) package that houses an optoelectronic device. The TO package and the optoelectronic device are coupled to a circuit interconnect. The circuit interconnect includes an insulator having a first side for transmitting a signal current between the optoelectronic device and a device external to the TO package, and a second side for transmitting a ground current between the TO package and the external device. For a predefined operating frequency range, the impedance of the circuit interconnect approximately matches the impedance of the signal leads of the TO package and also approximately matches the impedance of the device external to the TO package. The optoelectronic device may include a laser diode or a photo diode. In addition, the present invention is an optoelectronic transceiver including a transmitter optoelectronic assembly and a receiver optoelectronic assembly. The transmitter optoelectronic assembly includes a transmitter TO package and a transmitter circuit interconnect, and the receiver optoelectronic assembly includes a receiver TO package and a receiver circuit interconnect.

Abstract translation: 光电组件包括容纳光电器件的晶体管轮廓（TO）封装。 TO封装和光电子器件耦合到电路互连。 电路互连包括绝缘体，其具有用于在光电器件与TO封装外部的器件之间传输信号电流的第一侧，以及用于在TO封装和外部器件之间传输接地电流的第二侧。 对于预定义的工作频率范围，电路互连的阻抗近似匹配TO封装的信号引线的阻抗，并且大致匹配TO封装外部器件的阻抗。 光电子器件可以包括激光二极管或光电二极管。 另外，本发明是一种包括发射器光电组件和接收器光电组件的光电收发器。 发射器光电组件包括发射器TO封装和发射器电路互连，并且接收器光电组件包括接收器TO封装和接收器电路互连。

公开(公告)号：US06841815B2

公开(公告)日：2005-01-11

申请号：US10285204

申请日：2002-10-30

Applicant: The' Linh Nguyen ,  Daniel K. Case ,  Philip D. Shapiro

Inventor： The' Linh Nguyen ,  Daniel K. Case ,  Philip D. Shapiro

IPC: H01L23/66 ,  H01L25/16 ,  H01L31/0203 ,  H05K1/02 ,  H05K1/18 ,  H05K1/11 ,  H01L29/76

CPC classification number: H05K1/0243 ,  H01L23/66 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L25/167 ,  H01L31/0203 ,  H01L2223/6644 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/0603 ,  H01L2224/45144 ,  H01L2224/48011 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/4823 ,  H01L2224/48237 ,  H01L2224/49113 ,  H01L2224/49171 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19107 ,  H01L2924/30105 ,  H01L2924/30107 ,  H01L2924/3011 ,  H01L2924/30111 ,  H05K1/023 ,  H05K1/189 ,  H05K2201/10022 ,  H05K2201/10121 ,  H05K2201/10522 ,  H01L2924/00014 ,  H01L2924/00

Abstract: The optoelectronic device includes a photo diode and an amplifier, which amplifies output of the photo diode. The amplifier includes an input stage and an output stage. In one embodiment, the input stage has a series connection to a resistor, which is connected to a ground. The output stage has a connection to ground that does not overlap the series connection. In another embodiment, the input stage has a first connection to a bypass capacitor, which is connected to a power source. The output stage has a separate, second connection to the capacitor, which prevents high frequencies from flowing between the input stage and said output stage via a connection to the power source.

Abstract translation: 光电子器件包括光电二极管和放大器，其放大光电二极管的输出。 放大器包括输入级和输出级。 在一个实施例中，输入级与连接到地的电阻串联连接。 输出级具有与串联连接不重叠的接地连接。 在另一个实施例中，输入级具有连接到电源的旁路电容器的第一连接。 输出级具有与电容器的单独的第二连接，其防止高频率通过与电源的连接在输入级和所述输出级之间流动。

公开(公告)号：US20110008053A1

公开(公告)日：2011-01-13

申请号：US12831435

申请日：2010-07-07

Applicant: The' Linh Nguyen

Inventor： The' Linh Nguyen

IPC: H04B10/00

CPC classification number: H04B10/07953

Abstract: In one example embodiment, an optoelectronic module includes an optical receiver and a post-amplifier. The optical receiver is configured to receive an optical signal and generate an electrical data signal corresponding to the optical signal. The post-amplifier is electrically connected to the optical receiver and is configured to amplify the electrical data signal. The optoelectronic module further includes means for quantifying a quality of the optical signal from which the amplified electrical data signal is derived.