公开(公告)号：US20050113472A1

公开(公告)日：2005-05-26

申请号：US10974195

申请日：2004-10-27

Applicant: Ward Fillmore ,  Michael Gallagher ,  Timothy Adams

Inventor： Ward Fillmore ,  Michael Gallagher ,  Timothy Adams

IPC: C08J9/26 ,  C08G77/18 ,  C08J9/00 ,  H01L21/312 ,  H01L21/316 ,  H01L21/768 ,  H01L23/14

CPC classification number: H01L21/3122 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/02348 ,  H01L21/31695 ,  H01L21/7682 ,  H01L21/76825 ,  H01L2221/1047

Abstract: Methods of manufacturing a porous organic polysilica dielectric film are provided, such method using a combination of UV and thermal energy. These methods both cure the organic polysilica dielectric material and remove the porogen.

Abstract translation: 提供了制造多孔有机聚硅氧烷介电膜的方法，这种方法使用UV和热能的组合。 这些方法都可以固化有机聚硅氧烷介电材料并除去致孔剂。

公开(公告)号：US20050089642A1

公开(公告)日：2005-04-28

申请号：US10976292

申请日：2004-10-27

Applicant: Timothy Adams ,  Hongshi Zhen ,  Gregory Prokopowicz ,  Michael Gallagher

Inventor： Timothy Adams ,  Hongshi Zhen ,  Gregory Prokopowicz ,  Michael Gallagher

IPC: C07F7/08 ,  H01L21/312 ,  B05D5/12 ,  C07F7/04

CPC classification number: C08G77/50 ,  C07F7/0874 ,  C08G77/56 ,  C08G77/58 ,  C09D183/14 ,  H01L21/02126 ,  H01L21/02203 ,  H01L21/02216 ,  H01L21/02282 ,  H01L21/3122

Abstract: A method of preparing an organic polysilica partial condensate using basic and acidic catalysts is provided. Upon curing, such organic polysilica material has improved mechanical properties.

Abstract translation: 提供了使用碱性和酸性催化剂制备有机聚硅氧烷部分缩合物的方法。 固化后，这种有机聚硅氧烷材料具有改进的机械性能。

公开(公告)号：US20050074547A1

公开(公告)日：2005-04-07

申请号：US10969588

申请日：2004-10-20

Applicant: Paul Morganelli ,  Jayesh Shah ,  David Peard ,  Timothy Adams

Inventor： Paul Morganelli ,  Jayesh Shah ,  David Peard ,  Timothy Adams

IPC: H01L21/56 ,  H05K3/28 ,  H05K3/30 ,  B05D5/12

CPC classification number: H05K3/305 ,  H01L21/563 ,  H01L24/29 ,  H01L2224/16 ,  H01L2224/29111 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/73203 ,  H01L2224/83191 ,  H01L2224/83856 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/0105 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/0132 ,  H01L2924/01322 ,  H01L2924/04953 ,  H01L2924/10253 ,  H01L2924/14 ,  H01L2924/1579 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/3025 ,  H05K3/284 ,  H05K2201/0116 ,  H05K2201/10674 ,  H05K2201/10734 ,  H05K2201/10977 ,  H05K2203/306 ,  Y02P70/613 ,  Y10T29/49117 ,  Y10T29/4913 ,  Y10T29/49144 ,  H01L2224/13111 ,  H01L2924/0665 ,  H01L2224/29099 ,  H01L2224/29199 ,  H01L2924/00 ,  H01L2224/0401

Abstract: The invention relates to a method for utilizing one or more encapsulant compositions containing an expandable or pre-expanded filler on an electronic component.

Abstract translation: 本发明涉及一种利用一种或多种在电子部件上含有可膨胀或预膨胀填料的密封剂组合物的方法。