公开(公告)号：US20060169486A1

公开(公告)日：2006-08-03

申请号：US11342215

申请日：2006-01-30

Applicant: Yasuhito Funada ,  Yoshihiko Takeuchi ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

Inventor： Yasuhito Funada ,  Yoshihiko Takeuchi ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

IPC: H05K1/14

CPC classification number: H05K3/0097 ,  H05K1/0393 ,  H05K1/056 ,  H05K3/0052 ,  H05K3/064 ,  H05K2201/0969 ,  H05K2203/0169 ,  H05K2203/0323

Abstract: There is provided a wired circuit board assembly which allows effective prevention of the breakage of the flexing portion of a wired circuit board supported by a support frame. In a wired circuit board support sheet (1), a plurality of wired circuit boards (2) each composed of a base insulating layer (5), a conductor pattern (6), and a cover insulating layer (7) which are formed on a support board (4) are supported by a support frame (3) in such a manner that they are arranged and aligned in mutually spaced relation. Each of the wired circuit board (2) has a flexing portion (20) formed by removing the support board (4) to obtain a flexing property. In addition, second connecting portions (19) are provided in spanning relation between the flexing portion (20) and the vertical frame parts (16) of the support frame (3). The arrangement allows effective prevention of the breakage of the flexing portion (20) of each of the wired circuit boards (2) supported by the support frame (3).

Abstract translation: 提供了一种布线电路板组件，其有效地防止了由支撑框架支撑的布线电路板的弯曲部分的断裂。 在有线电路板支撑片（1）中，分别形成有基底绝缘层（5），导体图案（6）和覆盖绝缘层（7）的多个布线电路板（2） 支撑板（4）由支撑框架（3）支撑，使得它们以相互间隔的关系布置和对准。 每个布线电路板（2）具有通过去除支撑板（4）而形成的弯曲部分（20）以获得弯曲性能。 此外，第二连接部分（19）以支撑框架（3）的弯曲部分（20）和垂直框架部分（16）之间的跨度设置。 该布置允许有效地防止由支撑框架（3）支撑的每个有线电路板（2）的弯曲部分（20）的断裂。

公开(公告)号：US20050122627A1

公开(公告)日：2005-06-09

申请号：US11002199

申请日：2004-12-03

Applicant: Hitoki Kanagawa ,  Yasuhito Funada ,  Tetsuya Oosawa

Inventor： Hitoki Kanagawa ,  Yasuhito Funada ,  Tetsuya Oosawa

IPC: G11B5/60 ,  G11B5/00 ,  G11B5/012 ,  G11B5/48 ,  G11B21/00 ,  G11B21/02 ,  G11B21/21 ,  H05K1/05 ,  H05K1/11 ,  H05K3/24 ,  H05K3/28 ,  H05K3/40

CPC classification number: G11B5/486 ,  G11B5/484 ,  H05K1/056 ,  H05K3/243 ,  H05K3/28 ,  H05K3/4092 ,  H05K2201/0394 ,  H05K2201/0969

Abstract: A suspension board with circuit having a conductor layer formed in the form of a fine wiring circuit by an additive process, while providing a reduced risk of damage and breaking of the conductor layer in a flying lead portion. The suspension board with circuit comprises a supporting board 2, an insulating base layer 3 formed on the supporting board 2, a conductor layer 4 formed on the insulating base layer 3, an insulating cover layer 5 formed on the conductor layer 4, and a flying lead portion 9 in which a supporting-board-side opening 13, a base-layer-side opening 14, and a cover-layer-side opening 15 are formed so that both sides of the conductor layer 4 can be exposed therefrom. A reinforcing portion 16 or 23 for reinforcing the conductor layer 4 formed continuously from at least either of the insulating base layer 3 and the insulating cover layer 5 along the longitudinal direction of the conductor layer 4 is included in the flying lead portion 9.

Abstract translation: 一种具有电路的悬挂板，其具有通过添加工艺以精细布线电路形式形成的导体层，同时降低了飞行引线部分中的导体层损坏和断裂的风险。 具有电路的悬挂板包括支撑板2，形成在支撑板2上的绝缘基底层3，形成在绝缘基底层3上的导体层4，形成在导体层4上的绝缘覆盖层5和飞行 引导部分9，其中形成有支撑板侧开口13，基底层侧开口14和覆盖层侧开口15，使得导体层4的两侧可以从其露出。 用于加强导体层4的加强部分16或23包括在导线层9的长度方向上，从绝缘基底层3和绝缘覆盖层5中的至少一个连续地形成的导体层4。

公开(公告)号：US06245432B1

公开(公告)日：2001-06-12

申请号：US09139723

申请日：1998-08-31

Applicant: Yasuhito Funada ,  Toshihiko Omote

Inventor： Yasuhito Funada ,  Toshihiko Omote

IPC: B32B1508

CPC classification number: B32B15/08 ,  B32B7/12 ,  B32B15/043 ,  B32B27/281 ,  B32B27/34 ,  B32B2311/12 ,  B32B2311/30 ,  B32B2379/08 ,  C08G73/1025 ,  G03F7/0387 ,  G11B5/4846 ,  H05K1/056 ,  Y10S428/901 ,  Y10T428/24917 ,  Y10T428/31681 ,  Y10T428/31721

Abstract: The present invention provides a circuit substrate and a circuit-formed suspension substrate comprising the circuit substrate, the circuit substrate comprising a metal foil substrate and an insulating layer composed of a polyimide resin formed on the metal foil substrate, wherein the polyimide resin is one obtained by the reaction of (A) p-phenylene diamine and (B) acid anhydrides of (a) 3,4,3′,4′-biphenyltetracarboxylic acid dianhydride and (b) 2,2-bis(3,4-dicarboxyphenyl)hexafluoropropane. Since a coefficient of linear thermal expansion of the polyimide resin is close to that of various metal foils, the circuit substrate causes no cracking on the resin layer and scarcely causes warpage, and the resin layer does not separate.

Abstract translation: 本发明提供一种电路基板和电路形成的悬浮基板，其包括电路基板，电路基板包括金属箔基板和由形成在金属箔基板上的聚酰亚胺树脂构成的绝缘层，其中聚酰亚胺树脂是获得的 （a）3,4,3'，4'-联苯四羧酸二酐的（A）对苯二胺和（B）酸酐的反应，和（b）2,2-双（3,4-二羧基苯基） 六氟丙烷。 由于聚酰亚胺树脂的线性热膨胀系数接近于各种金属箔，所以电路基板不会在树脂层上产生开裂，几乎不引起翘曲，树脂层不分离。

公开(公告)号：US07638873B2

公开(公告)日：2009-12-29

申请号：US11606021

申请日：2006-11-30

Applicant: Jun Ishii ,  Yasuhito Funada

Inventor： Jun Ishii ,  Yasuhito Funada

IPC: H01L23/04

CPC classification number: H05K1/056 ,  H05K3/388 ,  H05K3/44 ,  H05K2201/0317 ,  H05K2201/0338 ,  H05K2201/09845 ,  H05K2203/0723 ,  Y10T428/24917

Abstract: A wired circuit board is provided which can reduce transmission loss with a simple layer structure and also features excellent long-term reliability by preventing the occurrence of an ion migration phenomenon between a metal foil and an insulating layer to improve the adhesion between the metal foil and the insulating layer and the conductivity of a conductor. A metal supporting board is prepared and a first metal thin film is formed on the metal supporting board by sputtering or electrolytic plating. A metal foil is formed on the first metal thin film by electrolytic plating. A second metal thin film is formed over the metal foil and the metal supporting board by electroless plating or sputtering. An insulating base layer is formed on the second metal thin film. A conductive pattern is formed as a wired circuit pattern on the insulating base layer. An insulating cover layer is formed on the insulating base layer to cover the conductive pattern.

Abstract translation: 提供一种布线电路板，其可以通过简单的层结构降低传输损耗，并且还通过防止金属箔和绝缘层之间的离子迁移现象的发生而具有优异的长期可靠性，以提高金属箔和绝缘层之间的粘附性 绝缘层和导体的导电性。 制备金属支撑板，并且通过溅射或电解电镀在金属支撑板上形成第一金属薄膜。 通过电解电镀在第一金属薄膜上形成金属箔。 通过无电镀或溅射在金属箔和金属支撑板上形成第二金属薄膜。 在第二金属薄膜上形成绝缘基层。 导电图案形成为绝缘基底层上的布线电路图案。 绝缘覆盖层形成在绝缘基底层上以覆盖导电图案。

公开(公告)号：US07471519B2

公开(公告)日：2008-12-30

申请号：US11187865

申请日：2005-07-25

Applicant: Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

Inventor： Yasunari Ooyabu ,  Yasuhito Funada ,  Hitoki Kanagawa ,  Tetsuya Ohsawa

IPC: H05K1/00

CPC classification number: H05K1/181 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/09972 ,  Y02P70/611

Abstract: A wired circuit board that can prevent inconsistency in characteristic impedance to allow effective transmission of electrical signals from a magnetic head to a control board portion. A wired circuit board is constructed so that a suspension board portion for supporting the magnetic head and a control board portion for controlling the magnetic head are formed to be continuous and integral with each other. To be more specific, a first conductor layer connected to the magnetic head in the suspension board portion and a second conductor layer connected to a preamplifier IC in the control board portion are formed from the same material and formed on a common insulating base layer simultaneously. Further, a common insulating cover layer to cover the first conductor layer and the second conductor layer is formed on the common insulating base layer.

Abstract translation: 一种可以防止特性阻抗不一致的有线电路板，以允许有效地将电信号从磁头传输到控制板部分。 布线电路板被构造成使得用于支撑磁头的悬架板部分和用于控制磁头的控制板部分彼此连续并且一体地形成。 更具体地说，连接到悬架板部分中的磁头的第一导体层和连接到控制板部分中的前置放大器IC的第二导体层由相同的材料形成并同时形成在公共绝缘基底层上。 此外，在公共绝缘基底层上形成覆盖第一导体层和第二导体层的公共绝缘覆盖层。

公开(公告)号：US20080149361A1

公开(公告)日：2008-06-26

申请号：US12004400

申请日：2007-12-21

Applicant: Jun ISHII ,  Yasunari OOYABU ,  Yasuhito FUNADA

Inventor： Jun ISHII ,  Yasunari OOYABU ,  Yasuhito FUNADA

IPC: H02G3/04

CPC classification number: H05K1/0259 ,  G11B5/486 ,  H05K1/056 ,  H05K1/167 ,  Y10T29/49117

Abstract: A wired circuit board includes a metal supporting board, an insulating layer formed on the metal supporting board, a conductive pattern formed on the insulating layer and having a plurality of wires, and a semiconductive layer formed on a surface of the insulating layer exposed from the conductive pattern so as to be in contact with the conductive pattern. The insulating layer is formed with a groove exposing the metal supporting board between at least two adjacent wires, and the semiconductive layer is in contact with the metal supporting board in the groove.

Abstract translation: 布线电路板包括金属支撑板，形成在金属支撑板上的绝缘层，形成在绝缘层上并具有多根导线的导电图案，以及形成在绝缘层的暴露于该绝缘层的表面上的半导体层 导电图案以与导电图案接触。 绝缘层形成有将金属支撑板暴露在至少两个相邻导线之间的沟槽，并且半导电层与凹槽中的金属支撑板接触。

公开(公告)号：US20070051534A1

公开(公告)日：2007-03-08

申请号：US11514963

申请日：2006-09-05

Applicant: Jun Ishii ,  Yasuhito Funada ,  Yasunari Ooyabu

Inventor： Jun Ishii ,  Yasuhito Funada ,  Yasunari Ooyabu

IPC: H05K1/00

CPC classification number: H05K3/28 ,  H05K1/0259 ,  H05K1/056 ,  H05K1/167 ,  H05K3/16 ,  H05K2201/0769

Abstract: The invention provides a wired circuit board that can prevent deterioration of a conductive pattern and short-circuiting of the conductive pattern. The wired circuit board is presented herein in the form of a suspension board with circuit which comprises an insulating base layer formed on a metal supporting board, a conductive pattern formed on the insulating base layer, a metal oxide layer formed on a surface of the conductive pattern and on a surface of the insulating base layer by sputtering, and an insulating cover layer, formed on the metal oxide layer, to cover the conductive pattern. According to this suspension board with circuit, since the metal oxide layer to cover the conductive pattern is formed by the sputtering, the metal oxide layer can be formed with a uniform thickness. Hence, the metal oxide layer can fully function as a barrier layer to the conductive pattern and, accordingly, deterioration of the conductive pattern and the short-circuiting of the conductive pattern can be prevented effectively.

Abstract translation: 本发明提供一种布线电路板，其可以防止导电图案的劣化和导电图案的短路。 布线电路板在这里以具有电路的悬挂板的形式呈现，该电路包括形成在金属支撑板上的绝缘基底层，形成在绝缘基底层上的导电图案，形成在导电的表面上的金属氧化物层 通过溅射形成在绝缘基底层的表面上，以及形成在金属氧化物层上的覆盖导电图案的绝缘覆盖层。 根据具有电路的该悬挂板，由于通过溅射形成覆盖导电图案的金属氧化物层，所以可以形成均匀的厚度的金属氧化物层。 因此，金属氧化物层可以充分发挥导电图案的阻挡层的作用，因此可以有效地防止导电图案的劣化和导电图案的短路。

公开(公告)号：US20050248885A1

公开(公告)日：2005-11-10

申请号：US11123181

申请日：2005-05-06

Applicant: Yasuhito Funada ,  Tetsuya Ohsawa

Inventor： Yasuhito Funada ,  Tetsuya Ohsawa

IPC: G11B5/60 ,  G11B5/48 ,  G11B21/21 ,  H05K1/00 ,  H05K1/05 ,  H05K3/28

CPC classification number: H05K1/028 ,  G11B5/484 ,  H05K1/056 ,  H05K3/28 ,  H05K2201/0969 ,  H05K2201/0989

Abstract: A suspension board with circuit that can allow precise adjustment of floatation (floatation angle) of even a small-sized slider to a magnetic disc even when the outrigger portions are reduced in rigidity. A gimbal portion 6 of the suspension board with circuit 1 is formed by a tongue portion 10 for mounting a magnetic head thereon, and outrigger portions 11 provided at both sides of the tongue portion 10, and an opening 12 is formed in the insulating cover layer 5 so that the conductor layer 4 can be exposed therefrom in the outrigger portions 11. This can allow reduction in rigidity of the outrigger portions 11, and as such can allow precise adjustment of floatation (floatation angle) of the slider to the magnetic disc even when a small-sized slider is mounted on the gimbal portion.

Abstract translation: 具有电路的悬挂板，即使当外伸支架部分的刚度降低时，也能够将即使小尺寸滑块的浮动（浮动角）精确地调整到磁盘。 具有电路1的悬挂板的万向节部6由用于在其上安装磁头的舌部10形成，并且设置在舌部10的两侧的外伸支架部分11和开口12形成在绝缘覆盖层 5，使得导体层4可以在外伸支架部分11中暴露出来。这可以允许外伸支架部分11的刚性降低，并且因此可以允许精确地调节滑块对磁盘的浮动（浮动角度） 当小型滑块安装在万向节部分上时。

公开(公告)号：US20050186332A1

公开(公告)日：2005-08-25

申请号：US11059465

申请日：2005-02-16

Applicant: Yasuhito Funada ,  Hitoki Kanagawa

Inventor： Yasuhito Funada ,  Hitoki Kanagawa

IPC: C23C18/31 ,  B05D5/12 ,  C23C18/32 ,  C25D7/00 ,  G11B5/48 ,  G11B5/60 ,  G11B21/21 ,  H05K1/05 ,  H05K3/00 ,  H05K3/06 ,  H05K3/10 ,  H05K3/18 ,  H05K3/24 ,  H05K3/44

CPC classification number: H05K3/244 ,  G11B5/486 ,  H05K1/056 ,  H05K3/062 ,  H05K3/108 ,  H05K2203/072

Abstract: In order to provide a new production method of a suspension board with circuit capable of preventing deterioration of the outward appearance and defects in products caused by a metal supporting layer, and further capable of forming an electroless nickel plating layer having an even thickness in a reliable manner, an insulating base layer is first formed on a supporting board, and a chromium thin film and a copper thin film are formed next sequentially on the surface of the supporting board exposed from the insulating base layer and on the entire surface of the insulating base layer. Subsequently, a plating resist is formed in a reversal pattern with respect to the wired circuit pattern on the surface of the copper thin film, and a conductor layer is formed on the surface of the copper thin film exposed from the plating resist by electrolytic plating. The plating resist is removed after an electroless nickel plating layer is formed on the conductor layer. Subsequently, the copper thin film and the chromium thin film are removed sequentially, and an insulating cover layer is formed next.

Abstract translation: 为了提供具有能够防止由金属支撑层引起的外观劣化和产品缺陷的电路的新型制造方法，并且还能够以可靠的方式形成具有均匀厚度的无电镀镍层 首先在支撑板上形成绝缘基底层，并且在从绝缘基底层暴露的支撑板的表面上以及在绝缘基底的整个表面上依次形成铬薄膜和铜薄膜 层。 随后，相对于铜薄膜表面上的布线电路图形，以反转图案形成电镀抗蚀剂，并且通过电解电镀在从镀覆抗蚀剂暴露的铜薄膜的表面上形成导体层。 在导体层上形成化学镀镍层之后，去除电镀抗蚀剂。 随后，依次除去铜薄膜和铬薄膜，接着形成绝缘覆盖层。

公开(公告)号：US6100582A

公开(公告)日：2000-08-08

申请号：US35871

申请日：1998-03-06

Applicant: Toshihiko Omote ,  Yasuhito Funada

Inventor： Toshihiko Omote ,  Yasuhito Funada

IPC: C08G69/26 ,  C08G73/10 ,  G03F7/004 ,  G03F7/038 ,  G11B3/00 ,  G11B5/48 ,  G11B5/60 ,  G11B21/00 ,  G11B21/02 ,  G11B21/16 ,  G11B21/18 ,  G11B25/04 ,  H05K1/03 ,  H05K1/05 ,  H05K3/46 ,  H01L23/04

CPC classification number: C08G73/1025 ,  C08G73/1039 ,  C08G73/1042 ,  G03F7/0387 ,  G11B21/00 ,  G11B5/486 ,  H05K1/056 ,  G03F7/0045 ,  Y10T428/24917

Abstract: A circuit substrate having an insulating layer comprising a polyimide resin on a metal foil substrate, wherein the polyimide resin is a polyimide resin obtained by the reaction of(A) aromatic diamines comprising(a) p-phenylene diamine and(b) 2,2'-bis(trifluoromethyl)-4,4'-diaminobiphenyl.(B) 3,4,3',4'-biphenyltetracarboxylic acid dianhydride.The circuit-formed substrate has a desired circuit comprising a conductive layer on the circuit substrate.The polyimide resin has a coefficient of thermal linear expansion close to that of the metal foil, and hence breakage does not occur on the resin layer, the resin layer does not separate, and warping does not occur.

Abstract translation: 1.一种电路基板，具有在金属箔基板上具有聚酰亚胺树脂的绝缘层，其中，所述聚酰亚胺树脂是通过（A）芳族二胺与（a）对苯二胺和（b）2,2 '（双（三氟甲基）-4,4'-二氨基联苯。 （B）3,4,3'，4'-联苯四羧酸二酐。 电路形成的衬底具有包括在电路衬底上的导电层的所需电路。 聚酰亚胺树脂的热线膨胀系数接近于金属箔，因此在树脂层上不会发生断裂，树脂层不分离，翘曲不发生。