公开(公告)号：US5076387A

公开(公告)日：1991-12-31

申请号：US545753

申请日：1990-07-02

申请人： Yoshio Oka

发明人： Yoshio Oka

IPC分类号： B62K5/00 ,  B62K19/46

CPC分类号： B62K5/01 ,  B62K19/46 ,  B62K2005/001

摘要： A saddle type, off-road vehicle is disclosed which comprises a frame, an engine mounted to the frame, a pair of rear wheels disposed on opposite sides of the frame, at least one front wheel, a seat supported on an upper portion of the frame, and a steering handle positioned forwardly of the seat. Each of the rear wheels has a larger diameter and a smaller lateral width than each of the front wheels. Additionally, the vehicle includes a relatively large storage receptacle is provided on the frame.

摘要翻译： 公开了一种鞍式越野车，其包括框架，安装到框架的发动机，设置在框架的相对侧上的一对后轮，至少一个前轮，支撑在该框架的上部的座椅 框架和位于座椅前方的转向手柄。 每个后轮具有比每个前轮更大的直径和更小的横向宽度。 此外，车辆包括设置在框架上的相对较大的存储容器。

公开(公告)号：US4096822A

公开(公告)日：1978-06-27

申请号：US727772

申请日：1976-09-29

申请人： Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kunihiko Hara

发明人： Masao Yamawaki ,  Katsuo Aoki ,  Yoshio Oka ,  Takao Suzuki ,  Osamu Ina ,  Kunihiko Hara

IPC分类号： H01L21/31 ,  C23C16/44 ,  C23C16/455 ,  C30B31/16 ,  H01L21/22 ,  C23C11/00

CPC分类号： C30B31/16 ,  C23C16/455 ,  C23C16/45578

摘要： A gaseous atmosphere control apparatus for heat-treating semiconductors in a uniform gaseous atmosphere condition is disclosed. The control apparatus is provided with a reaction pipe through which semiconductor wafers are transferred to be heat-treated. A gas distribution pipe is fixed to the inside wall of the reaction pipe for guiding the transfer of the wafers and supplying heat-treating gas in the reaction pipe. The distribution pipe is provided with a plurality of blow-off holes, the diameter thereof being made wider as the pipe extends longitudinally, to thereby control the gaseous atmosphere condition in the reaction pipe to be uniform.

摘要翻译： 公开了一种用于均匀气氛条件下热处理半导体的气体气氛控制装置。 控制装置设置有反应管，半导体晶片通过该反应管被转印以进行热处理。 气体分配管固定到反应管的内壁，用于引导晶片的转移并在反应管中供应热处理气体。 分配管设置有多个排气孔，其管道纵向延伸时，其直径变宽，从而控制反应管中的气态气体状态均匀。

公开(公告)号：US08597459B2

公开(公告)日：2013-12-03

申请号：US11664393

申请日：2005-09-26

申请人： Yoshio Oka ,  Hitoshi Takii ,  Noriki Hayashi

发明人： Yoshio Oka ,  Hitoshi Takii ,  Noriki Hayashi

IPC分类号： B29C65/00 ,  B32B37/00

CPC分类号： H01B1/22 ,  H05K1/095 ,  H05K3/4069 ,  H05K3/4617 ,  H05K2201/0245 ,  H05K2201/0394

摘要： There is provided a conductive paste obtained by kneading conductive particles into an epoxy resin and having good filling ability into a via hole, which can form a connected portion wherein the connection resistance does not change with time even under high temperature and high humidity conditions. Also, there is provided a method for manufacturing a multilayer printed wiring board using the conductive paste.A conductive paste containing conductive particles and a resin mixture wherein the content of the epoxy resin having a molecular weight of 10,000 or more is from 30 to 90% by weight in the total resin component and whose elastic modulus at 85° C. after curing is 2 GPa or less, the content of the conductive particle being from 30 to 75% by volume. Furthermore, a method for manufacturing a multilayer printed wiring board using the conductive paste.

摘要翻译： 提供一种通过将导电性粒子混入环氧树脂中并且具有良好的填充能力进入通孔而获得的导电膏，其可以形成连接部分，其中连接电阻即使在高温和高湿度条件下也不随时间变化。 此外，提供了一种使用导电浆料制造多层印刷线路板的方法。 含有导电性粒子和树脂混合物的导电性糊剂，其中分子量为10,000以上的环氧树脂的含量为总树脂成分的30〜90重量％，固化后85℃的弹性模量为 2GPa以下，导电性粒子的含量为30〜75体积％。 另外，使用该导电性糊料的多层印刷电路板的制造方法。

公开(公告)号：US20120031656A1

公开(公告)日：2012-02-09

申请号：US13265108

申请日：2010-04-13

申请人： Yoshio Oka ,  Takashi Kasuga ,  Issei Okada ,  Katsunari Mikage ,  Naota Uenishi ,  Yasuhiro Okuda

发明人： Yoshio Oka ,  Takashi Kasuga ,  Issei Okada ,  Katsunari Mikage ,  Naota Uenishi ,  Yasuhiro Okuda

IPC分类号： H05K1/09 ,  C25D7/00 ,  C25D5/02 ,  H05K1/00 ,  H05K3/00

CPC分类号： H05K3/424 ,  C23C28/00 ,  C23C28/023 ,  C23C28/027 ,  H05K1/09 ,  H05K3/022 ,  H05K3/025 ,  H05K3/06 ,  H05K3/064 ,  H05K3/108 ,  H05K3/1241 ,  H05K3/1283 ,  H05K3/188 ,  H05K3/246 ,  H05K3/38 ,  H05K3/4038 ,  H05K3/4069 ,  H05K3/422 ,  H05K3/426 ,  H05K2201/0154

摘要： Provided are a substrate for a printed wiring board, and a printed wiring board, which are not limited in size because vacuum equipment is not necessary for the production, in which an organic adhesive is not used, and which can include a conductive layer (copper foil layer) having a sufficiently small thickness. Also provided are a method for producing the substrate for a printed wiring board, and a method for producing the printed wiring board. A substrate 1 for a printed wiring board includes an insulating base 11, a first conductive layer 12 that is stacked on the insulating base 11, and a second conductive layer 13 that is stacked on the first conductive layer 12, in which the first conductive layer 12 is a coating layer composed of a conductive ink containing metal particles, and the second conductive layer 13 is a plating layer.

摘要翻译： 提供一种用于印刷线路板的基板和印刷线路板，其尺寸不受限制，因为不需要使用有机粘合剂的真空设备，并且可以包括导电层（铜 箔层）具有足够小的厚度。 还提供了一种用于制造印刷线路板用基板的方法及其制造方法。 用于印刷电路板的基板1包括绝缘基底11，堆叠在绝缘基底11上的第一导电层12和层叠在第一导电层12上的第二导电层13，其中第一导电层 12是由含有金属颗粒的导电油墨构成的涂层，第二导电层13是镀层。

公开(公告)号：US20050236182A1

公开(公告)日：2005-10-27

申请号：US10517058

申请日：2003-06-02

申请人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

发明人： Noriki Hayashi ,  Yoshio Oka ,  Masahiko Kanda ,  Narito Yagi ,  Kenji Miyazaki ,  Kyouichirou Nakatsugi

IPC分类号： H05K1/09 ,  H05K3/10 ,  H05K3/12 ,  H05K3/16 ,  H05K3/24 ,  H05K3/38 ,  H05K1/16

CPC分类号： H05K3/246 ,  H05K1/095 ,  H05K3/108 ,  H05K3/12 ,  H05K3/1216 ,  H05K3/16 ,  H05K3/381 ,  H05K3/388 ,  H05K2201/0347 ,  H05K2201/035 ,  H05K2203/072 ,  H05K2203/095 ,  Y10T29/49126

摘要： A novel board for printed wiring comprising a fine conductor wiring having a clear and favorable boundary line and fabricated by an ordinal printing method such as screen printing, a printed wiring board using the same, and methods for manufacturing them. A board for printed wiring and a method for manufacturing the same are characterized in that the surface of a board is subjected to one of the surface treatments: (a) roughening, (2) plasma treatment, (3) roughening and then plasma treatment, and (4) roughening and then forming of a metal film coating by sputtering. A printed wiring board and a method for manufacturing the same is characterize in that a conductor wiring is fabricated by printing using a conductive paste containing metal particles the average particle diameter of which is 4 μm or less and the maximum particle diameter of which is 15 μm or less. Another printed wiring board and a method for manufacturing the same is characterized in that the surface of a conductor wiring fabricated using a conductive paste containing metal particles M and a binder B at a volume ratio of M/B of 1/1 to 1.9/1 is etched, a plating coating is formed on the surface.

摘要翻译： 一种用于印刷布线的新型印刷电路板，包括具有透明且有利的边界线的精细导体布线，并通过诸如丝网印刷的顺序印刷法，使用其的印刷线路板及其制造方法制造。 印刷电路板及其制造方法的特征在于，对板的表面进行表面处理之一：（a）粗糙化，（2）等离子体处理，（3）粗糙化，然后进行等离子体处理， 和（4）通过溅射粗化然后形成金属膜涂层。 印刷电路板及其制造方法的特征在于，使用含有平均粒径为4μm以下，最大粒径为15μm的金属粒子的导电糊进行印刷，制造导体布线 或更少。 另一种印刷线路板及其制造方法的特征在于，使用含有金属粒子M和粘合剂B的M / B的体积比为1/1〜1.9 / 1的导电性糊剂制造的导体布线的表面 被蚀刻，在表面上形成镀覆层。