公开(公告)号：US6137390A

公开(公告)日：2000-10-24

申请号：US304471

申请日：1999-05-03

Applicant: Mean-Jue Tung ,  Yu-Ting Huang

Inventor： Mean-Jue Tung ,  Yu-Ting Huang

IPC: H01F17/04 ,  H01F27/02 ,  H01F22/02

CPC classification number: H01F27/027 ,  H01F27/022 ,  H01F17/045

Abstract: An inductor with enhanced inductance and reduced electromagnetic inductance (EMI) interference. It contains: (a) a magnetic core; (b) an electrically conducting coil wound about the magnetic core; and (c) a magnetic resin layer compression-molded to embed at least a portion of the outer periphery of the electrically conducting coil. The magnetic resin contains a magnetic powder dispersed in a polymer resin. For relatively low inductance inductors, instead of being of a hard metal rod, the magnetic core can be made of the same material as the magnetic resin. The inductance of the inductor can be controlled by controlling the magnetic permeability of the magnetic resin or the thickness of the magnetic resin layer, or both. The magnetic core can be a magnetic metal/metal oxide core, or a consolidated magnetic core made of the same or different magnetic resin as the magnetic resin layer. A metal magnetic sheath can be further provided outside of the magnetic resin layer.

Abstract translation: 具有增强电感和降低电磁感抗（EMI）干扰的电感器。 它包含：（a）磁芯; （b）缠绕在磁芯上的导电线圈; 和（c）压缩成型以嵌入导电线圈的外周的至少一部分的磁性树脂层。 磁性树脂含有分散在聚合物树脂中的磁性粉末。 对于相对较低的电感电感器，代替硬金属棒，磁芯可以由与磁性树脂相同的材料制成。 可以通过控制磁性树脂的磁导率或磁性树脂层的厚度或两者来控制电感器的电感。 磁芯可以是磁性金属/金属氧化物芯，或由与磁性树脂层相同或不同的磁性树脂制成的固结磁芯。 可以在磁性树脂层的外部进一步设置金属磁性护套。

公开(公告)号：USD895870S1

公开(公告)日：2020-09-08

申请号：US29683216

申请日：2019-03-12

Applicant: Yu-Ting Huang

Designer： Yu-Ting Huang

公开(公告)号：US09768223B2

公开(公告)日：2017-09-19

申请号：US13333899

申请日：2011-12-21

Applicant: Chia-Sheng Lin ,  Yu-Ting Huang

Inventor： Chia-Sheng Lin ,  Yu-Ting Huang

IPC: H01L31/18 ,  H01L27/146 ,  H01L23/00

CPC classification number: H01L27/14683 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/94 ,  H01L27/14618 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/13 ,  H01L2224/13101 ,  H01L2224/48091 ,  H01L2224/48463 ,  H01L2924/00014 ,  H01L2924/1461 ,  H01L2224/45099 ,  H01L2924/00 ,  H01L2924/014

Abstract: Embodiments provide a chip device package and a method for fabricating thereof. A semiconductor chip has a substrate. A supporting brick is separated from the substrate by a certain distance. A bonding pad having a surface is disposed across the substrate and the supporting brick. A bonding wire is electrically connected to the bonding pad.

公开(公告)号：US08993342B2

公开(公告)日：2015-03-31

申请号：US13159361

申请日：2011-06-13

Applicant: Mean-Jue Tung ,  Yu-Ting Huang ,  Li-Kou Chen ,  Yi-Shan Lin ,  Hsiang-Ming Huang ,  Shinn-Zong Lin ,  Woei-Cherng Shyu ,  Hsiao-Jung Wang

Inventor： Mean-Jue Tung ,  Yu-Ting Huang ,  Li-Kou Chen ,  Yi-Shan Lin ,  Hsiang-Ming Huang ,  Shinn-Zong Lin ,  Woei-Cherng Shyu ,  Hsiao-Jung Wang

IPC: B03C1/00 ,  G01N1/34 ,  B03C1/28 ,  B03C1/033 ,  G01N33/00

CPC classification number: B03C1/288 ,  B03C1/0332 ,  B03C2201/18 ,  B03C2201/26 ,  G01N33/0098 ,  Y10T436/25 ,  Y10T436/25375 ,  Y10T436/255

Abstract: A magnetic separation unit is provided, including a first member made of non-magnetic materials comprising a trench extending within the first member and a second member made of magnetic materials including a protrusion portion protruding over a surface of the second member, wherein the first member connects the second member such that the trench functions as a fluid channel formed between the first and second members, and the protrusion portion of the second member is contained by the trench of the first member.

Abstract translation: 提供一种磁分离单元，包括由非磁性材料制成的第一构件，该第一构件包括在第一构件内延伸的沟槽和由包括突出部分在第二构件的表面上突出的磁性材料制成的第二构件，其中第一构件 连接第二构件，使得沟槽用作形成在第一和第二构件之间的流体通道，并且第二构件的突出部分被第一构件的沟槽包围。

公开(公告)号：US08716844B2

公开(公告)日：2014-05-06

申请号：US13416504

申请日：2012-03-09

Applicant: Yu-Ting Huang

Inventor： Yu-Ting Huang

IPC: H01L23/552

CPC classification number: H01L21/78 ,  H01L21/56 ,  H01L23/3114 ,  H01L23/482 ,  H01L23/552 ,  H01L23/60 ,  H01L24/05 ,  H01L24/13 ,  H01L27/14618 ,  H01L27/14627 ,  H01L2224/02371 ,  H01L2224/02373 ,  H01L2224/0345 ,  H01L2224/03462 ,  H01L2224/03464 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/05573 ,  H01L2224/05624 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05669 ,  H01L2224/13022 ,  H01L2224/13024 ,  H01L2924/0001 ,  H01L2924/1461 ,  H01L2924/00014 ,  H01L2224/13099 ,  H01L2224/05599 ,  H01L2924/00

Abstract: A chip package includes: a substrate; a signal pad and a ground pad disposed on the substrate; a first and a second conducting layers disposed on the substrate and electrically connected to the signal pad and the ground pad, respectively, wherein the first and the second conducting layers extend from an upper surface of the substrate towards a lower surface of the substrate along a first and a second side surfaces of the substrate, respectively, and the first and the second conducting layers protrude from the lower surface; and a protection layer disposed on the substrate, wherein the protection layer completely covers the entire portion of the first conducting layer located on the first side surface of the substrate, and the entire portion of the second conducting layer located on the second side surface of the substrate is not covered by the protection layer.

Abstract translation: 芯片封装包括：基板; 信号焊盘和设置在所述基板上的接地焊盘; 第一导电层和第二导电层，其分别设置在所述基板上并电连接到所述信号焊盘和所述接地焊盘，其中所述第一和第二导电层沿着所述第一和第二导电层从所述基板的上表面延伸到所述基板的下表面 第一和第二侧面分别与第一和第二导电层从下表面突出; 以及设置在所述基板上的保护层，其中所述保护层完全覆盖位于所述基板的所述第一侧表面上的所述第一导电层的整个部分，并且所述第二导电层的位于所述基板的第二侧表面上的整个部分 衬底不被保护层覆盖。

公开(公告)号：US20130267236A1

公开(公告)日：2013-10-10

申请号：US13542021

申请日：2012-07-05

Applicant: YU-TING HUANG ,  CHING-FENG HSIEH

Inventor： YU-TING HUANG ,  CHING-FENG HSIEH

IPC: H04W72/04

CPC classification number: H04W72/10

Abstract: A smallcell base station and a channel assignment method for the same are introduced. In response to a connection mode-related service request make by a user equipment (UE) for performing a communication service, a channel assignment processor of the smallcell base provides a forward access channel (FACH) for functioning as a communication route of the UE, assigns to the UE the FACH for functioning as a wireless transmission channel between the smallcell base and the UE in the connection mode when no dedicated channel (DCH) is available, and discontinues other communication services so as to release a DCH to the UE when the communication service has higher priority. Accordingly, the smallcell base need not keep a DCH for use in accessing during the connection mode, thereby making good use of channel resources.

Abstract translation: 介绍了一种小小区基站和信道分配方法。 响应于用于执行通信服务的用户设备（UE）进行的与连接模式相关的服务请求，小小区基站的信道分配处理器提供用作UE的通信路由的前向接入信道（FACH） 在没有专用信道（DCH）可用的情况下，在连接模式中向UE UE分配用作小型基站和UE之间的无线传输信道，并且中止其他通信服务以便当UE发送DCH时向UE发送DCH 通信服务具有较高的优先级。 因此，在连接模式期间，小区基站不需要保留用于接入的DCH，从而充分利用信道资源。

公开(公告)号：US20120304712A1

公开(公告)日：2012-12-06

申请号：US13484562

申请日：2012-05-31

Applicant: Ming-Shyang CHIOU ,  Chia-Min SUN ,  Yu-Ting HUANG ,  Song-Gen SHYU ,  Ching-Chuan KUO

Inventor： Ming-Shyang CHIOU ,  Chia-Min SUN ,  Yu-Ting HUANG ,  Song-Gen SHYU ,  Ching-Chuan KUO

IPC: E05B65/06 ,  E05C1/10 ,  E05C1/12

CPC classification number: E05B55/005 ,  E05B13/108 ,  Y10T70/5389 ,  Y10T70/5394 ,  Y10T70/5531 ,  Y10T70/5832 ,  Y10T292/0997 ,  Y10T292/1022 ,  Y10T292/57

Abstract: In a cylinder lock assembly, a latch operating tube has an enlarged end portion extending into an outer drive tube disposed in an outer handle. A locking spindle is disposed in the latch operating tube and has a locking tongue extending radially and outwardly through the outer drive tube to interlock with an outer rose when the locking spindle is pressed by a push button to move to a locked state. A locking plate is sleeved around the locking spindle and has a radial locking part to engage a protrusion that projects radially and inwardly from an inner surface of the enlarged end portion so that the locking spindle is locked against movements to an unlocked state when the locking spindle is in its locked state.

Abstract translation: 在气缸锁组件中，闩锁操作管具有延伸到设置在外手柄中的外驱动管中的扩大端部。 锁定主轴设置在闩锁操作管中，并且当锁定主轴被按钮按压以移动到锁定状态时，锁定舌片通过外部驱动管径向向外延伸，以与外部玫瑰互锁。 锁定板围绕锁定主轴套管并且具有径向锁定部分以接合从扩大端部的内表面径向向内突出的突出部，使得当锁定主轴处于锁定状态时锁定主轴被锁定以解除锁定状态 处于锁定状态。

公开(公告)号：US20120227667A1

公开(公告)日：2012-09-13

申请号：US13413002

申请日：2012-03-06

Applicant: Juno Yu-Ting HUANG ,  Suresh M. SHRAUTI ,  Alain DUBOUST ,  David BOUR ,  Wei-Yung HSU ,  Liang-Yun CHEN

Inventor： Juno Yu-Ting HUANG ,  Suresh M. SHRAUTI ,  Alain DUBOUST ,  David BOUR ,  Wei-Yung HSU ,  Liang-Yun CHEN

IPC: C30B25/12 ,  B05D5/00 ,  B24B1/00 ,  C30B25/02

CPC classification number: C30B25/12 ,  C30B29/403 ,  H01L21/67103 ,  H01L21/67115 ,  H01L21/68764 ,  H01L21/68771

Abstract: Substrate carrier having multiple emissivity coefficients for thin film processing and more particularly for support of a substrate during a deposition process epitaxially growing a film on the substrate. A front side of the carrier has a first carrier surface upon which the substrate is to be disposed, the first carrier surface having a first emissivity coefficient different than a second emissivity coefficient of a second carrier surface adjacent to the first carrier surface. Selection of the second emissivity coefficient independent of the first emissivity coefficient may modify an amount of energy radiated from the second carrier surface during processing of the substrate. In one embodiment, the second carrier surface has a second emissivity coefficient which is lower than the first emissivity coefficient to reduce heat loss from the carrier surface while maintaining high efficiency energy transfer between the carrier and a substrate.

Abstract translation: 具有用于薄膜处理的多个发射系数的衬底载体，更具体地说，用于在沉积过程中支撑衬底，该衬底在衬底上外延生长膜。 载体的前侧具有第一载体表面，基底将被放置在该第一载体表面上，第一载体表面的第一发射率系数不同于与第一载体表面相邻的第二载体表面的第二发射率系数。 与第一发射率系数无关的第二发射系数的选择可以修改在衬底的处理期间从第二载体表面辐射的能量的量。 在一个实施例中，第二载体表面具有低于第一发射率系数的第二发射率系数，以减少载体表面的热损失，同时保持载体和基底之间的高效能量传递。

公开(公告)号：US20120073503A1

公开(公告)日：2012-03-29

申请号：US13098241

申请日：2011-04-29

Applicant: Juno Yu-Ting Huang ,  Sang Won Kang ,  David H. Quach ,  Wei-Yung Hsu

Inventor： Juno Yu-Ting Huang ,  Sang Won Kang ,  David H. Quach ,  Wei-Yung Hsu

IPC: C30B25/08 ,  C30B25/12

CPC classification number: C30B25/08 ,  C30B25/12 ,  C30B29/403

Abstract: Apparatus and systems are disclosed for processing a substrate. In an embodiment, a system includes a processing chamber, which includes a substrate support to support the substrate. The chamber further includes a plate member positioned below the substrate support and designed to improve heating efficiency within the processing chamber. The processing chamber further includes a lower dome positioned below the plate member. The plate member is designed to prevent a coating from being deposited on the lower dome during processing conditions. The plate member is designed to prevent particles and debris from falling below the plate member. The plate member is designed to improve heating uniformity between the plate member and the substrate within the processing chamber.

Abstract translation: 公开了用于处理衬底的装置和系统。 在一个实施例中，系统包括处理室，其包括用于支撑衬底的衬底支撑件。 腔室还包括位于衬底支撑件下方并被设计成提高处理室内的加热效率的板构件。 处理室还包括位于板构件下方的下拱顶。 板构件被设计成防止在加工条件下涂层沉积在下圆顶上。 板构件被设计成防止颗粒和碎屑落在板构件下方。 板构件被设计成改善处理室内的板构件和衬底之间的加热均匀性。

公开(公告)号：USD647495S1

公开(公告)日：2011-10-25

申请号：US29385937

申请日：2011-02-23

Applicant: Hsiang-Szu Chang ,  Nien-Tze Yeh ,  Kuen-Pu Lu ,  Chia-Hsun Chen ,  Yu-Ting Huang

Designer： Hsiang-Szu Chang ,  Nien-Tze Yeh ,  Kuen-Pu Lu ,  Chia-Hsun Chen ,  Yu-Ting Huang