公开(公告)号：US06861603B1

公开(公告)日：2005-03-01

申请号：US10745692

申请日：2003-12-29

申请人： Yung-Hui Wang

发明人： Yung-Hui Wang

IPC分类号： H01H3/12 ,  H01H13/70

CPC分类号： H01H3/122

摘要： A structure of button for an electronic product has an upper lid, a chassis having a switch and a parallel bar set, which positioned between the upper lid and the chassis, such that the upper lid can move down upon being depressed by an external force to activate the switch of the chassis and can substantially return to its original position upon removing the external force. The parallel bar set has a base, two supporting racks, positioned parallel to each other above the base, wherein a side of one of the two supporting racks is connected to a positioning bar and the positioning bar is buckled to the base, the positioning bar and two supporting racks are positioned between the chassis and the upper lid to enable the upper lid to move towards the chassis under the influence of a movement of the parallel bar set.

摘要翻译： 用于电子产品的按钮结构具有位于上盖和底盘之间的上盖，具有开关和平行杆组件的底架，使得上盖可以通过外力被压下而向下移动 激活底盘的开关，并且在去除外力时可以基本返回到其原始位置。 平行杆组具有基部，两个支撑架，在基座上方彼此平行地定位，其中两个支撑架中的一个的一侧连接到定位杆，并且定位杆被弯曲到基座，定位杆 并且两个支撑架被定位在底盘和上盖之间，以使得上盖能够在平行杆组的运动的影响下朝向底盘移动。

公开(公告)号：US20050035946A1

公开(公告)日：2005-02-17

申请号：US10710195

申请日：2004-06-25

申请人： Yung-Hui Wang

发明人： Yung-Hui Wang

IPC分类号： G06F3/033 ,  G06F3/042 ,  G09G5/08

CPC分类号： G06F3/0421

摘要： An optical mouse includes a housing holding a refractor and a circuit board carrying a light emitting element and a sensor, the refractor having a recessed receiving chamber that accommodates the light emitting element, a reflection surface for reflecting light from the light emitting element onto the contact surface that supports the housing, a light penetrating portion, and a circular arc surface for focusing light from the contact surface onto the sensor through the light penetrating portion.

摘要翻译： 光学鼠标包括容纳折射器的壳体和承载发光元件的电路板和传感器，该折射器具有容纳该发光元件的凹入的容纳室，用于将来自该发光元件的光反射到该触点上的反射面 支撑壳体的表面，透光部分和圆弧表面，用于将来自接触表面的光通过光穿透部分聚焦到传感器上。

公开(公告)号：US06670566B1

公开(公告)日：2003-12-30

申请号：US10266595

申请日：2002-10-09

申请人： Yung-Hui Wang

发明人： Yung-Hui Wang

IPC分类号： H01H518

CPC分类号： H01H13/52 ,  H01H13/48 ,  H01H2205/024 ,  H01H2221/058 ,  H01H2221/082

摘要： A tact switch has a seat body which has a housing compartment for housing a first conductive electrode and a second conductive electrode, a first elastic element located in the housing compartment above the first and the second conductive electrodes, a press set located in the housing compartment above the first elastic element, and a closure body fastened to the seat body to cover the housing compartment. The press set further includes a hat body which has a coupling section and a second elastic element coupled with the coupling section. The coupling section has an opening and a directing section formed on the periphery of the opening with an inner diameter greater than the coupling section, and a chamfered edge located between the directing section and the coupling section to facilitate insertion and assembly of the second elastic element in the coupling section.

摘要翻译： 触控开关具有座体，该座体具有用于容纳第一导电电极和第二导电电极的容纳室，位于第一和第二导电电极上方的壳体隔室中的第一弹性元件，位于壳体隔室 在第一弹性元件上方，以及紧固到座椅主体以覆盖壳体隔间的闭合体。 压力机组还包括具有耦合部分和与耦合部分耦合的第二弹性元件的帽体。 联接部分具有形成在开口的周边上的开口和引导部分，其内径大于联接部分，以及位于引导部分和联接部分之间的倒角边缘，以便于插入和组装第二弹性元件 在耦合部分。

公开(公告)号：US08000107B2

公开(公告)日：2011-08-16

申请号：US12078330

申请日：2008-03-28

申请人： Yung-Hui Wang ,  In-De Ou ,  Chih-Pin Hung

发明人： Yung-Hui Wang ,  In-De Ou ,  Chih-Pin Hung

IPC分类号： H01L23/495

CPC分类号： H05K1/185 ,  H01L23/5389 ,  H01L24/19 ,  H01L2924/14 ,  H05K3/4602 ,  H05K2201/09681 ,  H05K2201/09781 ,  H05K2201/10636 ,  H05K2203/1178 ,  Y02P70/611 ,  H01L2924/00

摘要： A carrier with embedded components comprises a substrate and at least one embedded component. The substrate has at least one slot and a first composite layer. The embedded component is disposed at the slot of the substrate. The first composite layer has a degassing structure, at least one first through hole and at least one first fastener, wherein the degassing structure corresponds to the slot, the first through hole exposes the embedded component, and the first fastener is formed at the first through hole and contacts the embedded component. According to the present invention, the degassing structure can smoothly discharge the hydrosphere existing within the carrier under high temperature circumstances and the first fastener is in contact with the embedded component, which increases the joint strength between the embedded component and the substrate.

摘要翻译： 具有嵌入式部件的载体包括基板和至少一个嵌入部件。 衬底具有至少一个槽和第一复合层。 嵌入式部件设置在基板的狭槽处。 第一复合层具有脱气结构，至少一个第一通孔和至少一个第一紧固件，其中脱气结构对应于槽，第一通孔暴露嵌入的部件，并且第一紧固件形成在第一通孔 孔并与嵌入式组件接触。 根据本发明，脱气结构能够在高温环境下平稳地排出存在于载体内的水圈，并且第一紧固件与嵌入部件接触，这增加了嵌入部件和基板之间的接合强度。

公开(公告)号：US20110036701A1

公开(公告)日：2011-02-17

申请号：US12845186

申请日：2010-07-28

申请人： Yung-Hui WANG

发明人： Yung-Hui WANG

IPC分类号： H01H3/02

CPC分类号： H01H13/705 ,  H01H13/86 ,  H01H2211/002 ,  H01H2215/046 ,  H01H2217/044 ,  H01H2223/002 ,  H01H2227/034

摘要： A closed-air cushioned key switch structure includes an electrical board having multiple contacts, and multiple key switch bodies arranged above the contacts of the electrical board, each key switch body having top press portion for clicking by a user, a conductor at the bottom side for contacting one respective contact of the electrical board to produce a switching signal and an enclosed air chamber defined in between the press portion and the conductor for buffering clicking to give comfort to the user's finger to avoid noises. The key switch bodies are formed in integrity without any gap in therebetween, avoiding penetration of fluid or water through the key switch bodies to contaminate or wet the electrical board.

摘要翻译： 闭式气垫键开关结构包括具有多个触点的电路板，以及布置在电路板的触点上方的多个键开关体，每个按键开关主体具有顶部按压部分，用于用户点击;底部的导体 用于接触电路板的一个相应触点以产生切换信号，以及限定在按压部分和导体之间的封闭空气室，用于缓冲点击以给使用者的手指提供舒适感，以避免噪音。 钥匙开关本体完整地形成，在其间没有任何间隙，避免了流体或水穿过钥匙开关本体，从而污染或弄湿电路板。

公开(公告)号：US20100018761A1

公开(公告)日：2010-01-28

申请号：US12500841

申请日：2009-07-10

申请人： YUNG-HUI WANG ,  Ying-Te Ou

发明人： YUNG-HUI WANG ,  Ying-Te Ou

IPC分类号： H05K1/16 ,  H05K1/11 ,  H05K3/30 ,  H01R43/16

CPC分类号： H01L23/49827 ,  H01L21/4857 ,  H01L21/486 ,  H01L23/49822 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/24 ,  H01L24/82 ,  H01L2224/04105 ,  H01L2224/24227 ,  H01L2224/32225 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15153 ,  H01L2924/1517 ,  H05K1/185 ,  H05K1/188 ,  H05K3/429 ,  H05K3/4602 ,  H05K3/4652 ,  H05K2201/09536 ,  H05K2201/10674 ,  H05K2203/063 ,  Y10T29/4913 ,  Y10T29/49204 ,  Y10T29/49213

摘要： An embedded chip substrate includes a first insulation layer, a core layer, a chip, a second insulation layer, a first circuit layer, and a second circuit layer. The core layer disposed on the first insulation layer has an opening that exposes a portion of the first insulation layer. The chip is adhered into a recess constructed by the opening and the first insulation layer. The second insulation layer is disposed on the core layer for covering the chip. The first circuit layer is disposed at the outer side of the first insulation layer located between the first circuit layer and the core layer. The second circuit layer is disposed at the outer side of the second insulation layer located between the second circuit layer and the core layer. The first circuit layer is electrically connected to the second circuit layer that is electrically connected to the chip.

摘要翻译： 嵌入式芯片基板包括第一绝缘层，芯层，芯片，第二绝缘层，第一电路层和第二电路层。 设置在第一绝缘层上的芯层具有露出第一绝缘层的一部分的开口。 芯片被粘合到由开口和第一绝缘层构成的凹槽中。 第二绝缘层设置在芯层上以覆盖芯片。 第一电路层设置在位于第一电路层和芯层之间的第一绝缘层的外侧。 第二电路层设置在位于第二电路层和芯层之间的第二绝缘层的外侧。 第一电路层电连接到电连接到芯片的第二电路层。

公开(公告)号：US20100006330A1

公开(公告)日：2010-01-14

申请号：US12493065

申请日：2009-06-26

申请人： Chieh-Chen Fu ,  Ying-Te Ou ,  Yung-Hui Wang

发明人： Chieh-Chen Fu ,  Ying-Te Ou ,  Yung-Hui Wang

IPC分类号： H05K1/16 ,  H05K13/00

CPC分类号： H05K1/185 ,  H01L21/486 ,  H01L21/6835 ,  H01L23/49816 ,  H01L23/49822 ,  H01L23/49827 ,  H01L23/5389 ,  H01L24/19 ,  H01L25/105 ,  H01L2221/68345 ,  H01L2221/68359 ,  H01L2224/04105 ,  H01L2224/20 ,  H01L2924/01005 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/18162 ,  H05K1/056 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/09536 ,  H05K2201/10674 ,  Y10T29/49172

摘要： A process of an embedded chip package structure includes following steps. Firstly, a metal core layer having a first surface, a second surface opposite to the first surface, an opening, and a number of through holes are provided. The opening and the through holes connect the first surface and the second surface. A chip is then disposed in the opening. Next, a dielectric layer is formed in the opening and the through holes to fix the chip in the opening. Thereafter, a number of conductive vias are respectively formed in the through holes and insulated from the metal core layer by a portion of the dielectric layer located in the through holes. A circuit structure is then formed on the first surface of the metal core layer by performing a build-up process, and the circuit structure electrically connects the chip and the conductive vias.

摘要翻译： 嵌入式芯片封装结构的处理包括以下步骤。 首先，提供具有第一表面，与第一表面相对的第二表面，开口和多个通孔的金属芯层。 开口和通孔连接第一表面和第二表面。 然后将芯片设置在开口中。 接下来，在开口和通孔中形成电介质层，以将芯片固定在开口中。 此后，多个导电通孔分别形成在通孔中并且通过位于通孔中的介电层的一部分与金属芯层绝缘。 然后通过执行积聚过程在金属芯层的第一表面上形成电路结构，并且电路结构将芯片和导电通孔电连接。

公开(公告)号：US07586184B2

公开(公告)日：2009-09-08

申请号：US11870620

申请日：2007-10-11

申请人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

发明人： Chih Pin Hung ,  Chi Tsung Chiu ,  In De Ou ,  Yung Hui Wang

IPC分类号： H01L23/498

CPC分类号： H05K1/144 ,  H01L24/16 ,  H01L24/45 ,  H01L24/48 ,  H01L25/162 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2924/00011 ,  H01L2924/00014 ,  H01L2924/01079 ,  H01L2924/14 ,  H01L2924/1433 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/19107 ,  H05K2201/042 ,  H05K2201/10977 ,  H05K2203/049 ,  Y10T428/23 ,  H01L2224/0401 ,  H01L2924/00012

摘要： An electronic package is provided. The electronic package includes a first substrate, an electronic component, a first sealant, a second substrate, a plurality of bonding wires and a second sealant, wherein the first substrate has opposing upper and lower surfaces and a plurality of bonding pads is disposed on the upper surface of the first substrate. The electronic component is positioned on the upper surface of the first substrate and electrically connected to the bonding pads. The first sealant is formed on the upper surface of the first substrate to encapsulate the electronic component. The lower surface of the second substrate is attached to the first sealant. The upper surface of the second substrate includes a central protrusion and a rim portion which surrounds and is lower than the central protrusion. A plurality of bonding wires is used to electrically connect the rim portion to the first substrate. The second sealant is formed on the upper surface of the first substrate and on the rim portion of the second substrate to encapsulate the bonding wires, the first sealant and the rim portion.

摘要翻译： 提供电子包装。 电子封装包括第一基板，电子部件，第一密封剂，第二基板，多个接合线和第二密封剂，其中第一基板具有相对的上表面和下表面，并且多个接合焊盘设置在 第一基板的上表面。 电子部件位于第一基板的上表面上并电连接到接合焊盘。 第一密封剂形成在第一基板的上表面上以封装电子部件。 第二基板的下表面附接到第一密封剂。 第二基板的上表面包括中心突起和围绕中心突起的边缘部分。 使用多个接合线将边缘部分电连接到第一基板。 第二密封剂形成在第一基板的上表面和第二基板的边缘部分上，以封装接合线，第一密封剂和边缘部分。

公开(公告)号：US07523551B2

公开(公告)日：2009-04-28

申请号：US11182743

申请日：2005-07-18

申请人： Ching-Fu Horng ,  Yung-Hui Wang

发明人： Ching-Fu Horng ,  Yung-Hui Wang

IPC分类号： H01R43/00

CPC分类号： H05K1/188 ,  H05K3/427 ,  H05K3/4652 ,  H05K2201/0355 ,  H05K2201/10636 ,  Y02P70/611 ,  Y10T29/49126 ,  Y10T29/4913 ,  Y10T29/49137 ,  Y10T29/49144 ,  Y10T29/49155 ,  Y10T29/49169 ,  Y10T29/49174 ,  Y10T29/49208

摘要： A manufacturing method of a multi-layer circuit board embedded with a passive component includes the steps of: providing a conductive foil which has one or more pairs of metal protruding points; connecting a passive element to the corresponding metal protruding points; providing a board having a core substrate with organic insulation layer on a core substrate; stacking the conductive foil and the board, wherein the passive component is embedded in the organic insulation layer and patterning on the conductive foil.

摘要翻译： 嵌入无源部件的多层电路板的制造方法包括以下步骤：提供具有一对或多对金属突出点的导电箔; 将无源元件连接到相应的金属突出点; 在芯基板上提供具有有机绝缘层的芯基板的板; 堆叠导电箔和板，其中无源部件嵌入有机绝缘层中并在导电箔上图案化。

公开(公告)号：US20080212287A1

公开(公告)日：2008-09-04

申请号：US12040634

申请日：2008-02-29

申请人： Che-Kun Shih ,  Yung-Hui Wang

发明人： Che-Kun Shih ,  Yung-Hui Wang

IPC分类号： H05K1/11 ,  H05K3/40

CPC分类号： H01L23/5389 ,  H01L23/3677 ,  H01L24/19 ,  H01L2224/04105 ,  Y10T29/49165

摘要： A semiconductor package structure and manufacturing method thereof are provided, wherein the semiconductor package structure comprises a multi-layer circuit board, an electronic device and a slug. The multi-layer circuit board has at least one via hole, and the electronic device having a upper surface is buried in the multi-layer circuit board, wherein a portion of the upper surface is connected with the via hole. The slug is set in the via hole. One end of the slug is in contact with the upper surface of the electronic device and the other end of the slug is exposed out of the multi-layer circuit board through the via hole.

摘要翻译： 提供了一种半导体封装结构及其制造方法，其中半导体封装结构包括多层电路板，电子器件和芯棒。 多层电路板具有至少一个通孔，具有上表面的电子器件埋设在多层电路板中，其中上表面的一部分与通孔连接。 将块状物置于通孔中。 芯块的一端与电子器件的上表面接触，并且芯块的另一端通过通孔从多层电路板露出。