公开(公告)号：US20130229793A1

公开(公告)日：2013-09-05

申请号：US13821551

申请日：2011-07-25

申请人： Siegfried Herrmann ,  Norwin Von Malm ,  Lutz Höppel

发明人： Siegfried Herrmann ,  Norwin Von Malm ,  Lutz Höppel

IPC分类号： H05B33/08 ,  F21L13/06

CPC分类号： H05B33/08 ,  F21L13/06 ,  H01L41/044 ,  H01L41/107 ,  H05B33/0809

摘要： What is specified is: a lighting apparatus, with a piezoelectric transformer (1), which has a mounting face (10), on which at least two output-side connection points (11) are arranged, and at least one substrateless light-emitting diode (2), which is designed to generate electromagnetic radiation, wherein the at least one substrateless light-emitting diode (2) is fitted at least indirectly to the mounting face (10) and fastened mechanically to the mounting face (10), and the at least one substrateless light-emitting diode (2) is electrically conductively connected to at least two of the output-side connection points (11).

摘要翻译： 具体实施方式是：具有压电变压器（1）的照明装置，其具有安装面（10），至少两个输出侧连接点（11）配置在所述安装面上，以及至少一个无基板发光 被设计成产生电磁辐射的二极管（2），其中所述至少一个无基板发光二极管（2）至少间接地装配到所述安装面（10）并机械地紧固到所述安装面（10），以及 所述至少一个无衬底发光二极管（2）与所述输出侧连接点（11）中的至少两个导电地连接。

公开(公告)号：US20130207154A1

公开(公告)日：2013-08-15

申请号：US13810335

申请日：2011-05-25

申请人： Lutz Höppel

发明人： Lutz Höppel

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L25/167 ,  H01L33/22 ,  H01L33/38 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component has a semiconductor body including an epitaxial layer sequence, and a carrier substrate consisting of a semiconductor material connected to the semiconductor body by a solder layer, and through-connections. The carrier substrate includes a surface doping zone extending along a first main surface facing the semiconductor body. The surface doping zone includes a p-conductive region and an n-conductive region adjacent thereto, between which regions a pn-junction is formed. The n-conductive region electrically connects to a p-doped region of the epitaxial layer sequence via a first sub-region of the solder layer, and the p-conductive region electrically connects to an n-doped region of the epitaxial layer sequence via a second sub-region of the solder layer.

摘要翻译： 光电子部件具有包括外延层序列的半导体本体和由通过焊料层连接到半导体主体的半导体材料构成的载体基板和贯通连接。 载体衬底包括沿着面向半导体本体的第一主表面延伸的表面掺杂区。 表面掺杂区包括p导电区和与其相邻的n导电区，在其间形成pn结。 n导电区域经由焊料层的第一子区域电连接到外延层序列的p掺杂区域，并且p导电区域经由一个或多个p型导电区域电连接到外延层序列的n掺杂区域 焊料层的第二子区域。

公开(公告)号：US20130187183A1

公开(公告)日：2013-07-25

申请号：US13813934

申请日：2011-07-25

申请人： Lutz Höppel ,  Karl Engl

发明人： Lutz Höppel ,  Karl Engl

IPC分类号： H01L33/52 ,  H01L33/60

CPC分类号： H01L33/52 ,  H01L33/22 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L33/60 ,  H01L2933/0016

摘要： A light-emitting diode chip is specified, comprising an n-conducting region (1), a p-conducting region (2), an active region (3) between the n-conducting region (1) and the p-conducting region (2), a mirror layer (4) at that side of the p-conducting region (2) which is remote from the active region (3), an encapsulation layer (5) at that side of the mirror layer (4) which is remote from the p-conducting region (2), and a contact layer (6) at a side of the encapsulation layer (5) which is remote from the mirror layer (4), wherein the encapsulation layer (5) extends along a bottom area (43) of the mirror layer (4) which is remote from the p-conducting region (2) and a side area (42) of the mirror layer (4) which runs transversely with respect to the bottom area (43), and the contact layer (6) is freely accessible in places from its side facing the n-conducting region (1).

摘要翻译： 规定了发光二极管芯片，其包括n导电区域（1），p导电区域（2），n导电区域（1）和p导电区域（1）之间的有源区域（3） 2），远离有源区域（3）的p导电区域（2）的该侧的镜面层（4），在镜面层（4）的该侧的封装层（5） 远离导电区域（2）的接触层（6），以及远离镜子层（4）的封装层（5）侧的接触层（6），其中封装层（5）沿着底部 远离导电区域（2）的镜层（4）的区域（43）和相对于底部区域（43）横向延伸的镜层（4）的侧面区域（42） 并且接触层（6）从面向n导电区域（1）的一侧可以自由地接近。

公开(公告)号：US20120037930A1

公开(公告)日：2012-02-16

申请号：US13262678

申请日：2009-04-03

申请人： Lutz Höppel

发明人： Lutz Höppel

IPC分类号： H01L33/02 ,  H01L33/60 ,  H01L33/62

CPC分类号： H01L33/44 ,  H01L25/0753 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/30 ,  H01L33/46 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method for producing optoelectronic components including A) providing a growth substrate with a semiconductor layer arranged thereon that produces a zone which is active during operation, B) applying separating structures on the semiconductor layer, C) applying a multiplicity of copper layers on the semiconductor layer in regions delimited by the separating structures, D) removing the separating structures, E) applying, a protective layer at least on lateral areas of copper layers, F) applying an auxiliary substrate on the copper layers, G) removing the growth substrate, H) singulating a composite assembly comprising the semiconductor layer, the copper layers and the auxiliary substrate to form components which are separated from one another.

摘要翻译： 一种制造光电子器件的方法，包括：A）提供其上布置有半导体层的生长衬底，其产生在操作期间有活性的区域; B）在半导体层上施加分离结构，C）在半导体上施加多个铜层 在分离结构限定的区域中，D）去除分离结构，E）至少在铜层的横向区域上施加保护层，F）在铜层上施加辅助衬底，G）去除生长衬底， H）将包括半导体层，铜层和辅助衬底的复合组件分开以形成彼此分离的组分。

公开(公告)号：US09276167B2

公开(公告)日：2016-03-01

申请号：US13820999

申请日：2011-08-11

申请人： Lutz Höppel

发明人： Lutz Höppel

IPC分类号： H01L33/02 ,  H01L33/20 ,  H01L33/38 ,  H01L33/40 ,  H01L33/44 ,  H01L33/00 ,  H01L33/22

CPC分类号： H01L33/02 ,  H01L33/0079 ,  H01L33/20 ,  H01L33/22 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/00

摘要： A light-emitting diode chip is specified, comprising an n-conducting region (1), a p-conducting region (2), an active region (3) between the n-conducting region (1) and the p-conducting region (2), a mirror layer (4) at that side of the p-conducting region (2) which is remote from the active region (3), and an insulation layer (5) formed with an electrically insulating material, wherein the mirror layer (4) is designed for reflecting electromagnetic radiation generated in the active region (3), and the mirror layer (4) has a perforation (41), wherein a side area (4a) of the mirror layer (4) is completely covered by the insulation layer (5) in the region of the perforation (41).

摘要翻译： 规定了发光二极管芯片，其包括n导电区域（1），p导电区域（2），n导电区域（1）和p导电区域（1）之间的有源区域（3） 2），远离有源区域（3）的p导电区域（2）的该侧的反射镜层（4）和形成有电绝缘材料的绝缘层（5），其中镜层 （4）被设计成用于反射在有源区域（3）中产生的电磁辐射，并且镜层（4）具有穿孔（41），其中镜层（4）的侧面区域（4a）完全被 绝缘层（5）在穿孔区域（41）中。

公开(公告)号：US20140295589A1

公开(公告)日：2014-10-02

申请号：US14234499

申请日：2012-07-23

申请人： Gudrun Lindberg ,  Lutz Höppel ,  Heribert Zull

发明人： Gudrun Lindberg ,  Lutz Höppel ,  Heribert Zull

IPC分类号： H01L33/44 ,  H01L33/00 ,  H01S5/028

CPC分类号： H01L33/44 ,  H01L33/005 ,  H01S5/0282

摘要： An optoelectronic component includes a semiconductor layer sequence having an optoelectronically active region; a dielectric layer on the semiconductor layer sequence; and a metal layer on the dielectric layer, wherein an adhesion layer is arranged between the dielectric layer and the metal layer, the adhesion layer being covalently bonded to the dielectric layer and to the metal layer.

摘要翻译： 光电子部件包括具有光电活性区域的半导体层序列; 半导体层序列上的电介质层; 以及在所述电介质层上的金属层，其中在所述电介质层和所述金属层之间设置粘合层，所述粘附层共价键合到所述电介质层和所述金属层。

公开(公告)号：US20140145610A1

公开(公告)日：2014-05-29

申请号：US13820181

申请日：2011-08-24

申请人： Patrick Rode ,  Norwin von Malm ,  Lutz Höppel

发明人： Patrick Rode ,  Norwin von Malm ,  Lutz Höppel

IPC分类号： F21K99/00 ,  F21V23/02

CPC分类号： F21K9/50 ,  F21K9/60 ,  F21V7/00 ,  F21V23/02 ,  F21V23/023 ,  F21Y2115/10 ,  H01L41/107

摘要： A light-emitting diode arrangement has a frame-shaped piezo transformer having at least one output-side connection, and having a light-emitting diode module that generates electromagnetic radiation, which module is disposed within the frame-shaped piezo transformer and electrically connects to the output-side connection of the piezo transformer by at least one output-side electrical conductor, wherein radiation emitted by the light-emitting diode module in the direction of the piezo transformer is reflected, at the latter.

摘要翻译： 发光二极管装置具有至少一个输出侧连接的框形压电变压器，并且具有产生电磁辐射的发光二极管模块，该模块设置在框形压电变压器内并电连接到 通过至少一个输出侧电导体的压电变压器的输出侧连接，其中由发光二极管模块在压电变压器的方向上发射的辐射在后者处被反射。

公开(公告)号：US08716724B2

公开(公告)日：2014-05-06

申请号：US13127328

申请日：2009-11-27

申请人： Norwin von Malm ,  Klaus Streubel ,  Patrick Rode ,  Karl Engl ,  Lutz Höppel ,  Jürgen Moosburger

发明人： Norwin von Malm ,  Klaus Streubel ,  Patrick Rode ,  Karl Engl ,  Lutz Höppel ,  Jürgen Moosburger

IPC分类号： H01L33/62

CPC分类号： H01L33/62 ,  H01L27/156 ,  H01L33/22 ,  H01L33/382 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic projection device which generates a predefined image during operation, including a semiconductor body having an active layer that generates electromagnetic radiation and a radiation exit side and is an imaging element of the projection device, wherein, to electrically contact the semiconductor body, a first contact layer and a second contact layer are arranged at a rear side of the semiconductor body, the rear side lying opposite the radiation exit side, and are electrically insulated from one another by a separating layer.

摘要翻译： 一种光电投影装置，其在工作期间产生预定图像，包括具有产生电磁辐射的有源层和辐射出射侧的半导体本体，并且是投影装置的成像元件，其中，与半导体本体电接触， 接触层和第二接触层设置在半导体本体的后侧，后侧与辐射出口侧相对，并且通过分离层彼此电绝缘。

公开(公告)号：US20130193450A1

公开(公告)日：2013-08-01

申请号：US13696602

申请日：2011-04-29

申请人： Werner Bergbauer ,  Lutz Höppel ,  Philipp Drechsel ,  Christopher Kölper ,  Martin Strassburg ,  Patrick Rode

发明人： Werner Bergbauer ,  Lutz Höppel ,  Philipp Drechsel ,  Christopher Kölper ,  Martin Strassburg ,  Patrick Rode

IPC分类号： H01L33/02 ,  H01L31/02 ,  H01L31/18

CPC分类号： H01L33/02 ,  H01L31/02 ,  H01L31/02327 ,  H01L31/02363 ,  H01L31/18 ,  H01L33/0079 ,  H01L33/12 ,  H01L33/22 ,  H01L33/24 ,  Y02E10/50

摘要： An optoelectronic semiconductor chip includes a semiconductor layer stack and a radiation exit face or radiation entrance face, wherein the semiconductor layer stack includes an active layer that generates or receives electromagnetic radiation, and a plurality of nanostructures arranged in the semiconductor layer stack and/or on the radiation exit or entrance face, at least some of the nanostructures including at least one substructure.

摘要翻译： 光电子半导体芯片包括半导体层堆叠和辐射出射面或辐射入射面，其中半导体层堆叠包括产生或接收电磁辐射的有源层，和布置在半导体层堆叠中和/或之上的多个纳米结构 辐射出口或入射面，至少一些纳米结构包括至少一个子结构。

公开(公告)号：US08482026B2

公开(公告)日：2013-07-09

申请号：US13379417

申请日：2010-07-06

申请人： Lutz Höppel

发明人： Lutz Höppel

IPC分类号： H01L29/22 ,  H01L33/00 ,  H01L27/15 ,  H01L29/267 ,  H01L31/12 ,  H01L31/0203 ,  H01L23/04

CPC分类号： H01L33/486 ,  H01L25/167 ,  H01L33/44 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2924/00

摘要： An optoelectronic component includes a semiconductor body and a carrier substrate connected to the semiconductor body with a solder joint, wherein the carrier substrate includes first and second apertures, through which first and second electrically conductive connecting layers are guided from a first primary surface of the carrier substrate facing away from the semiconductor body to a second primary surface of the carrier substrate facing away from the semiconductor body, the carrier substrate made of a semiconductor material and having side flanks, which run obliquely to the primary surfaces at least in a first partial region, wherein the side flanks are provided with an electrically insulating layer in the first partial region.

摘要翻译： 光电子部件包括半导体本体和与焊接接头连接到半导体本体的载体基板，其中载体基板包括第一和第二孔，第一和第二导电连接层从载体基板的第一主表面引导到载体基板 衬底背向半导体本体至背离半导体本体的载体衬底的第二主表面，载体衬底由半导体材料制成并具有至少在第一部分区域中倾斜于主表面延伸的侧面 ，其中所述侧面在所述第一部分区域中设置有电绝缘层。